Boosting the European Value Chain for Sustainable Power Electronics

Project Information

FastLane

Grant agreement ID: 101139788

DOI

10.3030/101139788

EC signature date 22 May 2024

Start date 1 May 2024

End date 30 April 2027

Funded under

• Digital, Industry and Space

Total cost

€ 96 869 925,89

EU contribution

€ 23 002 522,05

Coordinated by

VALEO ELECTRIFICATION SAS
France

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Documents, reports (1)

Data Management Plan

First version of the data management plan (DMP), with description of methods and processes to manage the relevant research data to make them findable, accessible, interoperable and reusable

Websites, patent fillings, videos etc. (1)

Project Website

Setup of the FASTLANE project website

Publications

Conference proceedings (22)

Analýza výsledkov cyklického výkonového testu MOS tranzistora podporená 3D elektrotepelnými simuláciami

Author(s): P. Suhaj, A. Chvala,
Published in: """Studentská vedecká a odborná činnost’ (ŠVOČ), 2025""", 2025
Publisher: ŠVOČ
DOI: 10.5281/ZENODO.15774808

Implementácia meracieho systému pre testovanie spoľahlivosti výkonových prvkov

Author(s): M. Hraňo, A. Chvála,
Published in: """Studentská vedecká a odborná činnost’ (ŠVOČ), 2026""", 2026
Publisher: ŠVOČ

Design of Packaging of Power DMOS Transistor

Author(s): P. Príbytný, A. Chvála, J. Marek
Published in: International Conference on Advances in Electronic and Photonic Technologies (ADEPT), 2024
Publisher: Zenodo
DOI: 10.5281/ZENODO.14974727

Neural Network for Calibration of Electrical Models of Semiconductor Devices

Author(s): M. Amira, A. Chvála
Published in: 2024 15th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2025
Publisher: IEEE
DOI: 10.1109/ASDAM63148.2024.10844606

Design of Power SiC Transistor Embedded in PCB Supported by 3D Simulations

Author(s): A. Chvála, J. Marek
Published in: International Conference on Advances in Electronic and Photonic Technologies (ADEPT), 2024
Publisher: Zenodo
DOI: 10.5281/ZENODO.14974467

Semiconductor-Focused Simulation Environment for Emitted Noise Sensitivity of MOSFET Parameters

Author(s): Robert Kragl, Steffen Beushausen, Karl Oberdieck, Konstantin Spanos, Ingmar Kallfass
Published in: 2025 International Symposium on Electromagnetic Compatibility – EMC Europe, 2025
Publisher: IEEE
DOI: 10.1109/EMCEUROPE61644.2025.11176251

Optimization of Packaging for Power DMOS Transistor

Author(s): P. Pribytný, M. Amira, J. Marek, A. Chvála
Published in: 13th International Conference on Advances in Electronic and Photonic Technologies, 2025, 2025
Publisher: ADEPT
DOI: 10.5281/ZENODO.15774710

Neural Network-Based Calibration of Electrical Models for MOSFETs and Diode

Author(s): M. Amira, A. Chvala
Published in: ELITECH`25 27th Conference of Doctoral Students Faculty of Electrical Engineering and Information Technology, 2025
Publisher: ELITECH`26
DOI: 10.5281/ZENODO.15774850

TCAD Study on Parallel SiC Two-Pole SSCB Chips Integrated into a 900 V Power Module

Author(s): M. Keck, N. Boettcher, R. Domes, J. Lindner, H. Rauh and J. Schulze
Published in: International Conference on Integrated Power Electronics (CIPS), Dresden, Germany, 2026
Publisher: IEEE

Plasma Behavior of SiC MOSFETs with Engineered Substrates During Reverse Recovery

Author(s): Alaluss, Mohamed; Mysore, Madhu Lakshman; Herrmann, Clemens; Goel, Shubhanshu; Elsayed, Ahmed; Basler, Thomas
Published in: 2025 37th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2025
Publisher: IEEE
DOI: 10.23919/ISPSD62843.2025.11117512

FastLane: Life Cycle Analysis of SiC from Substrate to Converter

Author(s): Elise Chaumat
Published in: Nanoelec Symposium on Sustainable Electronics and Digital Technologies, 2024
Publisher: Zenodo
DOI: 10.5281/ZENODO.14988627

A Novel Design Variation of a Monolithically Integrated SiC Circuit Breaker

Author(s): A. Hartmann, N. Boettcher
Published in: International Convention on Information and Communication Technology, Electronics and Microelectronics, 2025
Publisher: IEEE
DOI: 10.5281/ZENODO.15681864

Design of Power SiC Transistor Embedded in PCB Supported by 3D Thermo-Mechanical Simulations

Author(s): A. Chvála, P. Suhaj, M. Florovič, J. Marek
Published in: 2024 15th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2025
Publisher: IEEE
DOI: 10.1109/ASDAM63148.2024.10844645

Active Voltage Probe for Direct Measurement of EMC-Relevant Noise of Power Semiconductors

Author(s): Robert Kragl, Konstantin Spanos, Karl Oberdieck, Steffen Beushausen, Ingmar Kallfass
Published in: 2025 IEEE Energy Conversion Conference Congress and Exposition (ECCE), 2025
Publisher: IEEE
DOI: 10.1109/ECCE58356.2025.11259863

Design of Packaging of Power DMOS Transistor

Author(s): P. Príbytný, M. Amira, J. Marek, A. Chvála
Published in: 2024 15th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2025
Publisher: IEEE
DOI: 10.1109/ASDAM63148.2024.10844597

Neural Network-Based Calibration of Electrical Models for Silicon Carbide Diodes

Author(s): M. Amira, A. Chvála
Published in: WOCSDICE-EXMATEC, 2025, Cadiz, Spain 16-20 June 2025, 2025
Publisher: WOCSDICE-EXMATEC
DOI: 10.5281/ZENODO.20024223

Thermal Simulation with Model Order Reduction for Improved Computational Speed

Author(s): A. Chvala, M. Florovic, J. Marek
Published in: 13th International Conference on Advances in Electronic and Photonic Technologies, 2025, 2025
Publisher: ADEPT
DOI: 10.5281/ZENODO.15774465

"Effiziente SiC-Leistungsmodule – Herausforderungen und Lösungsansätze zum großflächigen Silber-Sintern von ""Active Metal Brazed""- Substraten auf Aluminium-Bodenplatten"

Author(s): Sebastian Fritzsche, Katja Stenger, Felix Koser, Noah Glaab, Benjamin Fabian, Florian Seifert
Published in: The 13th DVS/GMM Conference EBL 2026, 2026
Publisher: EBL 2026
DOI: 10.5281/ZENODO.18983130

Analysis of Power Cyclic Test Results of Power MOS Transistor Supported by 3D Electro-Thermal Simulations

Author(s): P. Suhaj, A. Chvala
Published in: 13th International Conference on Advances in Electronic and Photonic Technologies, 2025, 2025
Publisher: ADEPT
DOI: 10.5281/ZENODO.15774774

Improving Device Behavior Prediction Using Neural Networks for MOSFET and Diode Modeling

Author(s): M. Amira, A. Chvála
Published in: 7th International Conference on Microelectronic Devices and Technologies, (MicDAT 2025), 2025
Publisher: IFSA Publishing
DOI: 10.13140/RG.2.2.25110.61767

Measurements at High Temperature for Thermal Resisstance of MOSFETs

Author(s): C. R. Mitulescu (Sandulescu), N. Codreanu, C. Ionescu, P. Svasta, M. Branzei, B. Enache
Published in: 25th European Microelectronics and Packaging Conference&Exibition (EMPC), 2025, ISBN 9798331565756
Publisher: IEEE

Impact of Switching Behavior on the Noise Emission of Power Semiconductors

Author(s): Robert Kragl, Karl Oberdieck, Konstantin Spanos, Steffen Beushausen, Ingmar Kallfass
Published in: 2024 IEEE 9th Southern Power Electronics Conference (SPEC), 2025
Publisher: IEEE
DOI: 10.1109/SPEC62217.2024.10893134

Peer reviewed articles (1)

Introducing a modified sample preparation and straightforward elemental ratio determination strategy with LA-ICP-MS to expand the nanoparticle probing toolkit

Author(s): Olga Lanaridi, Yan Chen, Jakob Nils Blaschke, Pablo Ayala, Bernhard C. Bayer, Dominik Eder, Andreas Limbeck
Published in: Advances in Sample Preparation, Issue 16, 2025, ISSN 2772-5820
Publisher: Elsevier BV
DOI: 10.1016/J.SAMPRE.2025.100223