10 Angstrom CMOS exploration

Project Information

10ACe

Grant agreement ID: 101139972

DOI

10.3030/101139972

EC signature date 17 May 2024

Start date 1 May 2024

End date 30 April 2027

Funded under

• Digital, Industry and Space

Total cost

€ 97 951 886,50

EU contribution

€ 23 912 755,63

Coordinated by

ASML NETHERLANDS B.V.
Netherlands

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Conference proceedings (4)

OPC and modeling solution to support 0.55NA EUV stitching

Author(s): Qinglin Zeng, Dongbo Xu, Xuefeng Zeng, Werner Gillijns, Edita Tejnil, Yuyang Sun, Germain Fenger
Published in: International Conference on Extreme Ultraviolet Lithography 2024, 2024
Publisher: SPIE
DOI: 10.1117/12.3034957

OPC model accuracy of dry resist readiness for 0.55NA EUVL by using low-n bright field mask

Author(s): Dongbo Xu, Werner Gillijns, Shruti Jambaldinni, Soobin Hwang, Anuja De Silva, Germain Fenger
Published in: DTCO and Computational Patterning IV, 2025
Publisher: SPIE
DOI: 10.1117/12.3051855

High-NA EUV single patterning of advanced metal logic nodes: inverse lithography techniques in combination with alternative mask absorbers

Author(s): Ana-Maria Armeanu, Nick Pellens, Vicky Philipsen, Evgeny Malankin, Dongbo Xu, Keisuke Mizuuchi, Gabriel Curvacho, Chih-I Wei, Neal V. Lafferty, Germain L. Fenger
Published in: 39th European Mask and Lithography Conference (EMLC 2024), 2024
Publisher: SPIE
DOI: 10.1117/12.3031718

Enablement of 0.55NA EUV bright field mask stitching

Author(s): Dongbo Xu, Qinglin Zeng, Werner Gillijns, Xuefeng Zeng, Yuyang Sun, Germain L. Fenger
Published in: Optical and EUV Nanolithography XXXVIII, 2025
Publisher: SPIE
DOI: 10.1117/12.3051285

Peer reviewed articles (1)

"Influence of water background pressure on removal rates of SiO<mml:math xmlns:mml=""http://www.w3.org/1998/Math/MathML"" altimg=""si5.svg"" display=""inline"" id=""d1e651""><mml:msub><mml:mrow/><mml:mrow><mml:mn>2</mml:mn></mml:mrow></mml:msub></mml:math>, Si and photo resist in reactive ion beam etching"

Author(s): Peter Birtel, Erik Rohkamm, Jens Bauer, Frank Frost
Published in: Surfaces and Interfaces, Issue 64, 2025, ISSN 2468-0230
Publisher: Elsevier BV
DOI: 10.1016/J.SURFIN.2025.106306