DESIgning and REcycling sustainable Electronic boards for a EUropean circular economy

Project Information

DESIRE4EU

Grant agreement ID: 101161251

DOI

10.3030/101161251

EC signature date 13 June 2024

Start date 1 September 2024

End date 31 August 2028

Funded under

• The European Innovation Council (EIC)

Total cost

€ 3 999 995,00

EU contribution

€ 3 999 995,00

Coordinated by

INSTITUT POLYTECHNIQUE DE GRENOBLE
France

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Conference proceedings (10)

A Brief Review on Electromigration Behaviours of Solder Joints Under Electrothermal Load

Author(s): Zoltán Tafferner, Attila Géczy
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11120986

Enhancing the Manufacturability of Biodegradable PLA/Flax PCB Assemblies Through Design Optimization

Author(s): Gergő Havellant, Attila Géczy
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11121033

Current carrying capacity of PCB traces on PLA/Flax biodegradable substrates

Author(s): Csapody Ádám, Attila Géczy
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11120908

Investigating the Copper Peel and Solder Joint Shear Strength on Biodegradable Substrates

Author(s): Oliver Krammer, Gergely Hambuch, Réka Bátorfi, Balázs Illés, Attila Géczy
Published in: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2024
Publisher: IEEE
DOI: 10.1109/SIITME63973.2024.10814765

Biodegradable PCBs with PLA/Flax Substrate: FTIR and SEM Analysis of Soil Degradation

Author(s): Attila Géczy, Lívia Gyenizse, Csaba Farkas, Dániel Rigler, Balázs Sáfár, András Csiszár
Published in: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Issue 15, 2024
Publisher: IEEE
DOI: 10.1109/ESTC60143.2024.10712063

Tiny, Distributed, and Eco-Optimized: Proposal of Design Guidelines for Environmentally Friendly ML Devices

Author(s): Cuartielles, David; Géczy, Attila; Grennerat, Vincent; Xavier, Pascal
Published in: 2024 IEEE/ACM Symposium on Edge Computing (SEC), 2024
Publisher: IEEE
DOI: 10.1109/SEC62691.2024.00050

Soil Degradation of Sustainable PCB Substrates in Natural and Controlled Environments

Author(s): Csaba Farkas, László Gál, Lívia Gyenizse, Gábor Harsányi, Dániel Rigler, Balázs Sáfár, Dániel Gere, András Csiszár, Attila Géczy
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11121032

Effect of Water Absorption on the Low-Frequency Dielectric Properties of Biodegradable PLA/Flax PCB Substrates

Author(s): Zoltán Ádám Tamus, Sila Zeynep Tosun, Attila Géczy
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11121067

Power Electronics Solar Inverter on a Biosourced and Biodegradable Substrate – Thermal Study

Author(s): Vincent Grennerat, Pascal Xavier, Pierre-Olivier Jeannin, Attila Géczy
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11120895

Low-Temperature Soldering (LTS) in the Electronics Industry: a Brief Review

Author(s): Balázs Illés, Attila Géczy, Zoltán Tafferner, Agata Skwarek, Olivér Krammer
Published in: 2025 International Spring Seminar on Electronics Technology (ISSE), 2025
Publisher: IEEE
DOI: 10.1109/ISSE65583.2025.11120985

Peer reviewed articles (1)

Implementation of microcontroller board on a sustainable and degradable PLA/flax composite substrate: a case study

Author(s): Attila Géczy, Dániel Piffkó, Richárd Berényi, Karel Dusek, Pascal Xavier, David Cuartielles
Published in: Nanotechnology, Issue 35, 2024, ISSN 0957-4484
Publisher: IOP Publishing
DOI: 10.1088/1361-6528/AD66D3