Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

Información del proyecto

APECS-PL

Identificador del acuerdo de subvención: 101183307

DOI

10.3030/101183307

Fecha de la firma de la CE 17 Diciembre 2024

Fecha de inicio 1 Noviembre 2024

Fecha de finalización 30 Junio 2029

Financiado con arreglo a

• Digital, Industry and Space

Coste total

€ 194 423 096,69

Aportación de la UE

€ 96 211 548,36

Coordinado por

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Other (1)

Integration of software into FMD infrastructure to enable FMD-wide access

The invests in software will be made available to the relevant FDM institutes in order to unify the STCO design flow and enable access to it.

Websites, patent fillings, videos etc. (2)

Website

Set up and launch of a responsive APECS website

APECS Branding

Development of a unified and cohesive image of the APECS pilot line coordinated with presentation materials

Publicaciones

Conference proceedings (17)

Robust Ku-Band Low-Noise Amplifier in Gan Hemt Technology

Autores: Luisa de la Fuente, Beatriz Aja, Enrique Villa, Eduardo Artal, Philipp Neininger, Christian Friesicke, Fabian Thome, Peter Brückner, Aintzane Lujambio, David Lobato, Mario Rueda, David Cuadrado-Calle, Valerie Dutto
Publicado en: 2025 55th European Microwave Conference (EuMC), 2025
Editor: IEEE
DOI: 10.23919/EUMC65286.2025.11235293

Vision of the APECS Pilot Line

Autores: Stephan Guttowski, Michael Töpper, Andreas Grimm
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2027

System Technology Co-Optimisation (STCO)

Autores: Benjamin Prautsch, Jana Just
Publicado en: 2025
Editor: FMD STCO Workshop at Semicon 2025

Heterogeneous integration and QMI in APECS

Autores: Andreas Mai, Hady Yacoub
Publicado en: 2025
Editor: FMD STCO Workshop at Semicon 2025

A Compact GaN-Based D-Ban High-Power Waveguide Amplifier Module

Autores: Nico Riedmann, MaciejĆwikliński, Dirk Schwantuschke, Peter Brückner
Publicado en: 2025
Editor: IEEE
DOI: 10.23919/EUMC65286.2025.11235092

A V-Band (61-72 GHz) GaN HEMT High-Power Amplifier

Autores: Moise Safari Mugisho, Christian Friesicke, Sandrine Wagner, Rüdiger Quay
Publicado en: 2025
Editor: IEEE
DOI: 10.23919/EUMIC65284.2025.11234498

Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line

Autores: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2026

Characterization, testing & reliability for heterogeneous integration of chiplets

Autores: Daniel Kriesten, Norbert Pöllmann, Julia Wecker, Dominik Schröder, Sebastian Brand, Christopher Benndorf, Emanuele Strieter, Nisha Jakob Kabakci, Steffen Kurth, Frank Altmann
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2028

System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line

Autores: Benjamin Prautsch, Elmar Herzer, Michael Mensing, Petra Künzel, Marco Dietz, André Lüdecke, Hendrik Boerma, Fabian Hopsch
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2029

Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration

Autores: Erik Jung, Michael Töpper, Michael Mensing, Frank Roscher, Jan Hefer; Andreas Mai, Karl Friedrich Becker
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2025

The Demonstrators of the APECS Pilot Line

Autores: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2030

The Demonstrators of the APECS Pilot Line

Autores: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Publicado en: 2025
Editor: Special session on European Chiplet Innovation at MST Kongress 2030

A 200 mW, High-Gain Gan-Based D-Band Power Amplifier for 6G Communication Applications

Autores: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Publicado en: 2025 20th European Microwave Integrated Circuits Conference (EuMIC), 2025
Editor: IEEE
DOI: 10.23919/EUMIC65284.2025.11234457

Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR)

Autores: Steffan Kurth, Frank Altmann
Publicado en: 2025
Editor: FMD STCO Workshop at Semicon 2025

A D-Band Front-End T/R MMIC in a $70-\text{nm}$ GaN HEMT Technology

Autores: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Publicado en: 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025, 2025
Editor: IEEE
DOI: 10.1109/IMS40360.2025.11103926

Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration

Autores: Michael Schiffer, Stephan Guttowski
Publicado en: 2025
Editor: FMD STCO Workshop at Semicon 2025

The Demonstrators of the APECS Pilot Line (STCO)

Autores: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Publicado en: 2025
Editor: FMD STCO Workshop at Semicon 2025

Peer reviewed articles (2)

Ultra-stable C-band 50 GHz colliding-pulse BH InAs/InP QD mode-locked lasers

Autores: Zahra Safari Jafarlou, Ariane Sigmund, Martin Moehrle, Michael Theurer, Martin Schell
Publicado en: Optics Express, Edición 33, 2025, ISSN 1094-4087
Editor: Optica Publishing Group
DOI: 10.1364/OE.562301

Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)

Autores: Patrick R. Bressler, Michael Töpper, Peter Ramm
Publicado en: Nature Reviews Electrical Engineering, Edición 2, 2025, ISSN 2948-1201
Editor: Springer Science and Business Media LLC
DOI: 10.1038/S44287-024-00134-6