Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

Informazioni relative al progetto

APECS-PL

ID dell’accordo di sovvenzione: 101183307

DOI

10.3030/101183307

Data della firma CE 17 Dicembre 2024

Data di avvio 1 Novembre 2024

Data di completamento 30 Giugno 2029

Finanziato da

• Digital, Industry and Space

Costo totale

€ 194 423 096,69

Contributo UE

€ 96 211 548,36

Coordinato da

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Pubblicazioni

Conference proceedings (17)

Robust Ku-Band Low-Noise Amplifier in Gan Hemt Technology

Autori: Luisa de la Fuente, Beatriz Aja, Enrique Villa, Eduardo Artal, Philipp Neininger, Christian Friesicke, Fabian Thome, Peter Brückner, Aintzane Lujambio, David Lobato, Mario Rueda, David Cuadrado-Calle, Valerie Dutto
Pubblicato in: 2025 55th European Microwave Conference (EuMC), 2025
Editore: IEEE
DOI: 10.23919/EUMC65286.2025.11235293

Vision of the APECS Pilot Line

Autori: Stephan Guttowski, Michael Töpper, Andreas Grimm
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2027

System Technology Co-Optimisation (STCO)

Autori: Benjamin Prautsch, Jana Just
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Heterogeneous integration and QMI in APECS

Autori: Andreas Mai, Hady Yacoub
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

A Compact GaN-Based D-Ban High-Power Waveguide Amplifier Module

Autori: Nico Riedmann, MaciejĆwikliński, Dirk Schwantuschke, Peter Brückner
Pubblicato in: 2025
Editore: IEEE
DOI: 10.23919/EUMC65286.2025.11235092

A V-Band (61-72 GHz) GaN HEMT High-Power Amplifier

Autori: Moise Safari Mugisho, Christian Friesicke, Sandrine Wagner, Rüdiger Quay
Pubblicato in: 2025
Editore: IEEE
DOI: 10.23919/EUMIC65284.2025.11234498

Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2026

Characterization, testing & reliability for heterogeneous integration of chiplets

Autori: Daniel Kriesten, Norbert Pöllmann, Julia Wecker, Dominik Schröder, Sebastian Brand, Christopher Benndorf, Emanuele Strieter, Nisha Jakob Kabakci, Steffen Kurth, Frank Altmann
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2028

System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line

Autori: Benjamin Prautsch, Elmar Herzer, Michael Mensing, Petra Künzel, Marco Dietz, André Lüdecke, Hendrik Boerma, Fabian Hopsch
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2029

Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration

Autori: Erik Jung, Michael Töpper, Michael Mensing, Frank Roscher, Jan Hefer; Andreas Mai, Karl Friedrich Becker
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2025

The Demonstrators of the APECS Pilot Line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2030

The Demonstrators of the APECS Pilot Line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2030

A 200 mW, High-Gain Gan-Based D-Band Power Amplifier for 6G Communication Applications

Autori: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Pubblicato in: 2025 20th European Microwave Integrated Circuits Conference (EuMIC), 2025
Editore: IEEE
DOI: 10.23919/EUMIC65284.2025.11234457

"""Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR) """

Autori: Steffan Kurth, Frank Altmann
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

A D-Band Front-End T/R MMIC in a $70-\text{nm}$ GaN HEMT Technology

Autori: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Pubblicato in: 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025, 2025
Editore: IEEE
DOI: 10.1109/IMS40360.2025.11103926

"""Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration """

Autori: Michael Schiffer, Stephan Guttowski
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

The Demonstrators of the APECS Pilot Line (STCO)

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Peer reviewed articles (1)

Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)

Autori: Patrick R. Bressler, Michael Töpper, Peter Ramm
Pubblicato in: Nature Reviews Electrical Engineering, Numero 2, 2025, ISSN 2948-1201
Editore: Springer Science and Business Media LLC
DOI: 10.1038/S44287-024-00134-6