Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

Informazioni relative al progetto

APECS-PL

ID dell’accordo di sovvenzione: 101183307

DOI

10.3030/101183307

Data della firma CE 17 Dicembre 2024

Data di avvio 1 Novembre 2024

Data di completamento 30 Giugno 2029

Finanziato da

• Digital, Industry and Space

Costo totale

€ 194 423 096,69

Contributo UE

€ 96 211 548,36

Coordinato da

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Risultati finali

Other (1)

Integration of software into FMD infrastructure to enable FMD-wide access

The invests in software will be made available to the relevant FDM institutes in order to unify the STCO design flow and enable access to it.

Websites, patent fillings, videos etc. (2)

Website

Set up and launch of a responsive APECS website

APECS Branding

Development of a unified and cohesive image of the APECS pilot line coordinated with presentation materials

Pubblicazioni

Conference proceedings (25)

Robust Ku-Band Low-Noise Amplifier in Gan Hemt Technology

Autori: Luisa de la Fuente, Beatriz Aja, Enrique Villa, Eduardo Artal, Philipp Neininger, Christian Friesicke, Fabian Thome, Peter Brückner, Aintzane Lujambio, David Lobato, Mario Rueda, David Cuadrado-Calle, Valerie Dutto
Pubblicato in: 2025 55th European Microwave Conference (EuMC), 2025
Editore: IEEE
DOI: 10.23919/EUMC65286.2025.11235293

Vision of the APECS Pilot Line

Autori: Stephan Guttowski, Michael Töpper, Andreas Grimm
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2027

System Technology Co-Optimisation (STCO)

Autori: Benjamin Prautsch, Jana Just
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Ultra-Low Chirp DML Array for 144 Gbps per lane over 21 km Transmission

Autori: G. Vasudevan Rajeswari, J.Andree, C. Kottke, M.Moehrle, A.Sigmund, M.Theurer, R. Freund, M.Schell
Pubblicato in: 2026
Editore: Session: WeA: High power and High speed at ISLC 2026

Broadband Interconnect and Assembly for Sub-THz Heterogeneous Integration

Autori: Sébastien Chartier, Katarzyna Holc, Damian Stenzel, Bersant Gashi, Axel Tessmann, Arnuf Leuther, Patricie Merkert
Pubblicato in: 2026 17th German Microwave Conference (GeMiC), 2026, ISBN 979-8-3195-1955-9
Editore: IEEE
DOI: 10.1109/GEMIC71240.2026.11516438

Heterogeneous integration and QMI in APECS

Autori: Andreas Mai, Hady Yacoub
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Fabrication of Pocket Wafers for Quasi-Monolithic Integration

Autori: Jenny Göckeritz, Andreas Herrmann, Kirstin Bornhorst, Lukas Lorenz
Pubblicato in: 2026 49th International Spring Seminar on Electronics Technology (ISSE), 2026, ISBN 979-8-3315-8393-4
Editore: IEEE
DOI: 10.1109/ISSE70010.2026.11600944

A Compact GaN-Based D-Ban High-Power Waveguide Amplifier Module

Autori: Nico Riedmann, MaciejĆwikliński, Dirk Schwantuschke, Peter Brückner
Pubblicato in: 2025
Editore: IEEE
DOI: 10.23919/EUMC65286.2025.11235092

A V-Band (61-72 GHz) GaN HEMT High-Power Amplifier

Autori: Moise Safari Mugisho, Christian Friesicke, Sandrine Wagner, Rüdiger Quay
Pubblicato in: 2025
Editore: IEEE
DOI: 10.23919/EUMIC65284.2025.11234498

Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2026

APECS Pilot Line: Your Gateway to Heterogeneous Integration & Packaging Technologies

Autori: C. Kroh, F. Mohn, K. Scheurer
Pubblicato in: 2026
Editore: Poster Session EPoSS Annual Forum

Characterization, testing & reliability for heterogeneous integration of chiplets

Autori: Daniel Kriesten, Norbert Pöllmann, Julia Wecker, Dominik Schröder, Sebastian Brand, Christopher Benndorf, Emanuele Strieter, Nisha Jakob Kabakci, Steffen Kurth, Frank Altmann
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2028

System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line

Autori: Benjamin Prautsch, Elmar Herzer, Michael Mensing, Petra Künzel, Marco Dietz, André Lüdecke, Hendrik Boerma, Fabian Hopsch
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2029

Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration

Autori: Erik Jung, Michael Töpper, Michael Mensing, Frank Roscher, Jan Hefer; Andreas Mai, Karl Friedrich Becker
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2025

The Demonstrators of the APECS Pilot Line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2030

The Demonstrators of the APECS Pilot Line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2030

Interactive Design of Optimized Capacitance Arrays using Intelligent IP Layout Generators

Autori: U. Eichler, T. Reich, U. Hatnik, B. Prautsch
Pubblicato in: 2026
Editore: IEEE

A 200 mW, High-Gain Gan-Based D-Band Power Amplifier for 6G Communication Applications

Autori: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Pubblicato in: 2025 20th European Microwave Integrated Circuits Conference (EuMIC), 2025
Editore: IEEE
DOI: 10.23919/EUMIC65284.2025.11234457

Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR)

Autori: Steffan Kurth, Frank Altmann
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Quasi-Monolithic Integration (QMI) Enables New Possibilities for Sensor and MEMS Applications

Autori: L.Lorenz, A.Herrmann, J.Goeckeritz, M.Eritt, J.Amelung
Pubblicato in: 2025, ISBN 978-3-8007-6614-7
Editore: VDE Verlag
DOI: 10.30420/456614062

Silicon Interposer with Advanced RF Technology Modules for BiCMOS Wafer-Level Packaging

Autori: Matthias Wietstruck, Patrick Krüger, Thomas Voß, Sebastian Schulze, Muhammad F. Bashir, Selin Tolunay Wipf, Emre C. Durmaz, Kanaka Joy, Nafis Hasnayen, Batuhan Sütbas
Pubblicato in: 2026 17th German Microwave Conference (GeMiC), 2026
Editore: IEEE
DOI: 10.1109/GEMIC71240.2026.11516460

A D-Band Front-End T/R MMIC in a $70-\text{nm}$ GaN HEMT Technology

Autori: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Pubblicato in: 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025, 2025
Editore: IEEE
DOI: 10.1109/IMS40360.2025.11103926

Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration

Autori: Michael Schiffer, Stephan Guttowski
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

The Demonstrators of the APECS Pilot Line (STCO)

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

"""Picosecond Pulse Generation Methods for Die-to-Die ESD Testing"""

Autori: Christian Herpers, Heinrich Wolf, David Pommerenke, Amelie Hagelauer
Pubblicato in: 2026
Editore: IPFA

Peer reviewed articles (6)

Solvent Effects on the Blinking Statistics of Color Centers in Chemical Vapor Deposition-Grown hBN

Autori: Tiago Queirós, Pedro Alpuim, Jana B. Nieder
Pubblicato in: ACS Omega, Numero 11, 2026, ISSN 2470-1343
Editore: American Chemical Society (ACS)
DOI: 10.1021/ACSOMEGA.5C12489

Ultra-stable C-band 50 GHz colliding-pulse BH InAs/InP QD mode-locked lasers

Autori: Zahra Safari Jafarlou, Ariane Sigmund, Martin Moehrle, Michael Theurer, Martin Schell
Pubblicato in: Optics Express, Numero 33, 2025, ISSN 1094-4087
Editore: Optica Publishing Group
DOI: 10.1364/OE.562301

Linewidth Narrowing of InP-Based Lasers by Self-Injection Locking With a Monolithically Integrated Ring Resonator

Autori: Hendrik Boerma, Arbnor Berisha, Sarah Cwalina, Mikhal Camjalli, Patrick Runge, Martin Schell
Pubblicato in: IEEE Journal of Selected Topics in Quantum Electronics, Numero 32, 2026, ISSN 1077-260X
Editore: Institute of Electrical and Electronics Engineers (IEEE)
DOI: 10.1109/JSTQE.2026.3686256

Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)

Autori: Patrick R. Bressler, Michael Töpper, Peter Ramm
Pubblicato in: Nature Reviews Electrical Engineering, Numero 2, 2025, ISSN 2948-1201
Editore: Springer Science and Business Media LLC
DOI: 10.1038/S44287-024-00134-6

Ultra-stable 50 GHz high peak power colliding-pulse mode-locked lasers with spot size converter

Autori: Zahra Safari Jafarlou, Martin Moehrle, Ariane Sigmund, Konstantin Wenzel, Robert B. Kohlhaas, Martin Schell
Pubblicato in: Optics Express, Numero 34, 2026, ISSN 1094-4087
Editore: Optica Publishing Group
DOI: 10.1364/OE.585787

Solvent Effects on the Blinking Statistics of Color Centers in Chemical Vapor Deposition-Grown hBN

Autori: Tiago Queirós, Pedro Alpuim, Jana B. Nieder
Pubblicato in: ACS Omega, Numero 11, 2026, ISSN 2470-1343
Editore: American Chemical Society (ACS)
DOI: 10.1021/ACSOMEGA.5C12489