Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

Risultati finali

Integration of software into FMD infrastructure to enable FMD-wide access

The invests in software will be made available to the relevant FDM institutes in order to unify the STCO design flow and enable access to it.

Website

Set up and launch of a responsive APECS website

APECS Branding

Development of a unified and cohesive image of the APECS pilot line coordinated with presentation materials

Pubblicazioni

Robust Ku-Band Low-Noise Amplifier in Gan Hemt Technology

Autori: Luisa de la Fuente, Beatriz Aja, Enrique Villa, Eduardo Artal, Philipp Neininger, Christian Friesicke, Fabian Thome, Peter Brückner, Aintzane Lujambio, David Lobato, Mario Rueda, David Cuadrado-Calle, Valerie Dutto
Pubblicato in: 2025 55th European Microwave Conference (EuMC), 2025
Editore: IEEE
DOI: 10.23919/EUMC65286.2025.11235293

Vision of the APECS Pilot Line

Autori: Stephan Guttowski, Michael Töpper, Andreas Grimm
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2027

System Technology Co-Optimisation (STCO)

Autori: Benjamin Prautsch, Jana Just
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Heterogeneous integration and QMI in APECS

Autori: Andreas Mai, Hady Yacoub
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

A Compact GaN-Based D-Ban High-Power Waveguide Amplifier Module

Autori: Nico Riedmann, MaciejĆwikliński, Dirk Schwantuschke, Peter Brückner
Pubblicato in: 2025
Editore: IEEE
DOI: 10.23919/EUMC65286.2025.11235092

A V-Band (61-72 GHz) GaN HEMT High-Power Amplifier

Autori: Moise Safari Mugisho, Christian Friesicke, Sandrine Wagner, Rüdiger Quay
Pubblicato in: 2025
Editore: IEEE
DOI: 10.23919/EUMIC65284.2025.11234498

Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2026

Characterization, testing & reliability for heterogeneous integration of chiplets

Autori: Daniel Kriesten, Norbert Pöllmann, Julia Wecker, Dominik Schröder, Sebastian Brand, Christopher Benndorf, Emanuele Strieter, Nisha Jakob Kabakci, Steffen Kurth, Frank Altmann
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2028

System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line

Autori: Benjamin Prautsch, Elmar Herzer, Michael Mensing, Petra Künzel, Marco Dietz, André Lüdecke, Hendrik Boerma, Fabian Hopsch
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2029

Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration

Autori: Erik Jung, Michael Töpper, Michael Mensing, Frank Roscher, Jan Hefer; Andreas Mai, Karl Friedrich Becker
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2025

The Demonstrators of the APECS Pilot Line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2030

The Demonstrators of the APECS Pilot Line

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: Special session on European Chiplet Innovation at MST Kongress 2030

A 200 mW, High-Gain Gan-Based D-Band Power Amplifier for 6G Communication Applications

Autori: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Pubblicato in: 2025 20th European Microwave Integrated Circuits Conference (EuMIC), 2025
Editore: IEEE
DOI: 10.23919/EUMIC65284.2025.11234457

Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR)

Autori: Steffan Kurth, Frank Altmann
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

A D-Band Front-End T/R MMIC in a $70-\text{nm}$ GaN HEMT Technology

Autori: Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Pubblicato in: 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025, 2025
Editore: IEEE
DOI: 10.1109/IMS40360.2025.11103926

Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration

Autori: Michael Schiffer, Stephan Guttowski
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

The Demonstrators of the APECS Pilot Line (STCO)

Autori: Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Pubblicato in: 2025
Editore: FMD STCO Workshop at Semicon 2025

Ultra-stable C-band 50 GHz colliding-pulse BH InAs/InP QD mode-locked lasers

Autori: Zahra Safari Jafarlou, Ariane Sigmund, Martin Moehrle, Michael Theurer, Martin Schell
Pubblicato in: Optics Express, Numero 33, 2025, ISSN 1094-4087
Editore: Optica Publishing Group
DOI: 10.1364/OE.562301

Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)

Autori: Patrick R. Bressler, Michael Töpper, Peter Ramm
Pubblicato in: Nature Reviews Electrical Engineering, Numero 2, 2025, ISSN 2948-1201
Editore: Springer Science and Business Media LLC
DOI: 10.1038/S44287-024-00134-6

Risultati finali

Pubblicazioni

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