Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

Project Information

APECS-PL

Grant agreement ID: 101183307

DOI

10.3030/101183307

EC signature date 17 December 2024

Start date 1 November 2024

End date 30 June 2029

Funded under

• Digital, Industry and Space

Total cost

€ 194 423 096,69

EU contribution

€ 96 211 548,36

Coordinated by

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV
Germany

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Conference proceedings (17)

Robust Ku-Band Low-Noise Amplifier in Gan Hemt Technology

Author(s): Luisa de la Fuente, Beatriz Aja, Enrique Villa, Eduardo Artal, Philipp Neininger, Christian Friesicke, Fabian Thome, Peter Brückner, Aintzane Lujambio, David Lobato, Mario Rueda, David Cuadrado-Calle, Valerie Dutto
Published in: 2025 55th European Microwave Conference (EuMC), 2025
Publisher: IEEE
DOI: 10.23919/EUMC65286.2025.11235293

Vision of the APECS Pilot Line

Author(s): Stephan Guttowski, Michael Töpper, Andreas Grimm
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2027

System Technology Co-Optimisation (STCO)

Author(s): Benjamin Prautsch, Jana Just
Published in: 2025
Publisher: FMD STCO Workshop at Semicon 2025

Heterogeneous integration and QMI in APECS

Author(s): Andreas Mai, Hady Yacoub
Published in: 2025
Publisher: FMD STCO Workshop at Semicon 2025

A Compact GaN-Based D-Ban High-Power Waveguide Amplifier Module

Author(s): Nico Riedmann, MaciejĆwikliński, Dirk Schwantuschke, Peter Brückner
Published in: 2025
Publisher: IEEE
DOI: 10.23919/EUMC65286.2025.11235092

A V-Band (61-72 GHz) GaN HEMT High-Power Amplifier

Author(s): Moise Safari Mugisho, Christian Friesicke, Sandrine Wagner, Rüdiger Quay
Published in: 2025
Publisher: IEEE
DOI: 10.23919/EUMIC65284.2025.11234498

Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line

Author(s): Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2026

Characterization, testing & reliability for heterogeneous integration of chiplets

Author(s): Daniel Kriesten, Norbert Pöllmann, Julia Wecker, Dominik Schröder, Sebastian Brand, Christopher Benndorf, Emanuele Strieter, Nisha Jakob Kabakci, Steffen Kurth, Frank Altmann
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2028

System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line

Author(s): Benjamin Prautsch, Elmar Herzer, Michael Mensing, Petra Künzel, Marco Dietz, André Lüdecke, Hendrik Boerma, Fabian Hopsch
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2029

Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration

Author(s): Erik Jung, Michael Töpper, Michael Mensing, Frank Roscher, Jan Hefer; Andreas Mai, Karl Friedrich Becker
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2025

The Demonstrators of the APECS Pilot Line

Author(s): Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2030

The Demonstrators of the APECS Pilot Line

Author(s): Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Published in: 2025
Publisher: Special session on European Chiplet Innovation at MST Kongress 2030

A 200 mW, High-Gain Gan-Based D-Band Power Amplifier for 6G Communication Applications

Author(s): Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Published in: 2025 20th European Microwave Integrated Circuits Conference (EuMIC), 2025
Publisher: IEEE
DOI: 10.23919/EUMIC65284.2025.11234457

"""Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR) """

Author(s): Steffan Kurth, Frank Altmann
Published in: 2025
Publisher: FMD STCO Workshop at Semicon 2025

A D-Band Front-End T/R MMIC in a $70-\text{nm}$ GaN HEMT Technology

Author(s): Thomas Zieciak, Philipp Neininger, Christian Friesicke, Peter Brückner, Rüdiger Quay
Published in: 2025 IEEE/MTT-S International Microwave Symposium - IMS 2025, 2025
Publisher: IEEE
DOI: 10.1109/IMS40360.2025.11103926

"""Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration """

Author(s): Michael Schiffer, Stephan Guttowski
Published in: 2025
Publisher: FMD STCO Workshop at Semicon 2025

The Demonstrators of the APECS Pilot Line (STCO)

Author(s): Rafael Jordan, Elmar Herzer, Michael Mensing, Martin Möhrle, Henning Schröder, Marco Dietz, Michael Töpper
Published in: 2025
Publisher: FMD STCO Workshop at Semicon 2025

Peer reviewed articles (1)

Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS)

Author(s): Patrick R. Bressler, Michael Töpper, Peter Ramm
Published in: Nature Reviews Electrical Engineering, Issue 2, 2025, ISSN 2948-1201
Publisher: Springer Science and Business Media LLC
DOI: 10.1038/S44287-024-00134-6