Objective
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, through-silicon via technologies or package-stacking approaches are growing in importance. Market studies show that SiP devices will have an average growth of 10 to 20% per year over the next five years.
Fields of science
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques.
Call for proposal
ENIAC-2009-1
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Coordinator
85579 Neubiberg
Germany
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Participants (39)
20864 Agrate Brianza
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2595 DA Den Haag
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40126 Bologna
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EH3 9EP Edinburgh
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5656AG Eindhoven
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3001 Leuven
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75015 PARIS 15
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B 8900 Ieper
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23780 Cernusco Lombardone
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13790 Rousset
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37100 Tours
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80686 Munchen
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71083 Herrenberg
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00101 HELSINKI
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02150 Espoo
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85748 GARCHING
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3189 Horten
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01510 Vantaa
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7034 Trondheim
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8141 Premstatten
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01620 Vantaa
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F- 85660 Saint-Philbert-de-Bouaine
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1210 Wien
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10088 VOLPIANO
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73463 Westhausen
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78530 Buc
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WC1E 6BT LONDON
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NW3 4HB London
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80333 Munchen
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4782 St Florian Am Inn
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78052 VILLINGEN SCHWENNINGEN
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2628 CN Delft
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6921 EX Duiven
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5656 AG Eindhoven
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2013 Skjetten
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01217 DRESDEN
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8010 Graz
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31700 BLAGNAC
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6641 TL BEUNINGEN GLD
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