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Contenuto archiviato il 2024-06-18

Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test

Obiettivo

The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, through-silicon via technologies or package-stacking approaches are growing in importance. Market studies show that SiP devices will have an average growth of 10 to 20% per year over the next five years.

Campo scientifico

CORDIS classifica i progetti con EuroSciVoc, una tassonomia multilingue dei campi scientifici, attraverso un processo semi-automatico basato su tecniche NLP.

Invito a presentare proposte

ENIAC-2009-1
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Coordinatore

INFINEON TECHNOLOGIES AG
Contributo UE
€ 634 152,00
Indirizzo
AM CAMPEON 1-15
85579 Neubiberg
Germania

Mostra sulla mappa

Regione
Bayern Oberbayern München, Landkreis
Tipo di attività
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Collegamenti
Costo totale
Nessun dato

Partecipanti (39)