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Performance and Reliability of Plastic-Encapsulated CMOS ASICs

Publications

DEVELOPMENT OF A LOW STRESS HIGH PINCOUNT PLASTIC PACKAGE FOR HIGH RELIABILITY CMOS ASICS

Author(s): CLAES A (MIETEC ALCATEL, OUDENAARDE (BE)), KELLY G (NMRC UNIVERSITY COLLEGE, CORK (IE)), EXPOSITO J (SGS-THOMSON MICROELECTRONICS, GRENOBLE (FR)), NEEF G (SEL ALCATEL, STUTTGART (DE)), ZACHARIASSEN K (ELECTRONIKCENTRALEN, HOERSHOLM (DK))
Published in: EXTRACT: ESPRIT 1991 : CONFERENCE PROCEEDINGS (1991) PP. 152-164 (EUR 13853) THE OFFICE FOR OFFICIAL PUBLICATIONS OF THE EUROPEAN COMMUNITIES, L-2985 LUXEMBOURG, 1991, Page(s) 152-164

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