Performance and Reliability of Plastic-Encapsulated CMOS ASICs

Project Information

PLASIC

Grant agreement ID: 1711

Project closed

Start date 1 January 1990

End date 31 March 1993

Funded under

• European strategic programme (EEC) for research and development in information technologies (ESPRIT), 1987-1992

Total cost

No data

EU contribution

No data

Coordinated by

MIETEC
Belgium

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Publications

Other (1)

DEVELOPMENT OF A LOW STRESS HIGH PINCOUNT PLASTIC PACKAGE FOR HIGH RELIABILITY CMOS ASICS

Author(s): CLAES A (MIETEC ALCATEL, OUDENAARDE (BE)), KELLY G (NMRC UNIVERSITY COLLEGE, CORK (IE)), EXPOSITO J (SGS-THOMSON MICROELECTRONICS, GRENOBLE (FR)), NEEF G (SEL ALCATEL, STUTTGART (DE)), ZACHARIASSEN K (ELECTRONIKCENTRALEN, HOERSHOLM (DK))
Published in: EXTRACT: ESPRIT 1991 : CONFERENCE PROCEEDINGS (1991) PP. 152-164 (EUR 13853) THE OFFICE FOR OFFICIAL PUBLICATIONS OF THE EUROPEAN COMMUNITIES, L-2985 LUXEMBOURG, 1991, Page(s) 152-164