Cel
The cost of packaging in microelectronics is around 30% of total production costs, but this is rising at an alarming rate due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro-systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the competitive edge of assembly companies. Moreover, with the exodus of high volume packaging and assembly companies to low-wage countries such as China and India, the manufacturing industry in Europe needs to revitalise itself by encouraging design and innovation that will allow European companies to produce assembly equipment and materials of tomorrow that will feed into the Asian market. Our approach of using microwave technology in bonding has significant advantages over technologies made available in the market. In our approach we don’t need a closed microwave oven. Through the open design we can do the placement, alignment and curing at the same time. The use of this technology in reel-to-reel manufacturing will be possible. Due to the higher level of integration and signifcantly shorter cycle times this new technology will give European packaging companies a clear competitive advantage particularly over their US competitors. Quality of the bonds will be improved as well due to better selectivity and special designed materials as well as the precisely adaptable frequency of the microwave. It uses pulsed microwave sources and relies on the selection of a few resonant cavities frequencies that are jittered (mode hopping). The two characteristics permit not only the avoidance of electrical discharges through arcing, but also the accurate curing of the paste at the location of interest, i.e. at the interface between a die and the substrate for example in the case of DCA. The project is driven bei 6 SME-IAGs who want to create this clear competitive advantage for theirmembers.
Dziedzina nauki
Temat(-y)
Zaproszenie do składania wniosków
FP7-SME-2007-2
Zobacz inne projekty w ramach tego zaproszenia
System finansowania
BSG-SME-AG - Research for SME associations/groupingsKoordynator
80686 Munchen
Niemcy
Zobacz na mapie
Uczestnicy (15)
Zakończenie uczestnictwa
78112 St. Georgen
Zobacz na mapie
20123 MILANO
Zobacz na mapie
79110 Freiburg
Zobacz na mapie
EH 54 6 GU Livingstone, Kirkton North, West Lothien
Zobacz na mapie
78658 Zimmern ob Rottweil
Zobacz na mapie
50171 ZARAGOZA
Zobacz na mapie
Zakończenie uczestnictwa
MK12 5TL Milton Keynes
Zobacz na mapie
70567 STUTTGART
Zobacz na mapie
EH14 4AS Edinburgh
Zobacz na mapie
11415 TALLINN
Zobacz na mapie
SE10 9LS London
Zobacz na mapie
7000 Bucuresti
Zobacz na mapie
97892 KREUZWERTHEIM
Zobacz na mapie
EH10 5RT EDINBURGH
Zobacz na mapie
CO5 0PN TIPTREE
Zobacz na mapie