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Zawartość zarchiwizowana w dniu 2024-06-18

Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future

Opis projektu


Design of semiconductor components and electronic based miniaturised systems

Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and device breakdown. To complicate the picture, electronic components tend to get warmer on their own as they operate, due to the fact that the power drawn by the devices from the power supply is dissipated by Joule effect.
As time passes, heat and temperature management is becoming increasingly problematic, for reasons ranging from economical to technological. Packages that are able to sustain high temperatures are very expensive, and so are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause malfunctioning of circuits and components, thus impacting the reliability of the electronic products which incorporate such devices.
The development of new, thermal-aware design paradigms can no longer be postponed if the goal is to enable designers to fully exploit the electronic technologies of the future, being those CMOS or alternative to CMOS.
The thermal problem has several facets, thus it needs to be addressed in a comprehensive manner. The THERMINATOR projects will address the following major challenges: 1) To devise innovative thermal models usable at different levels of abstraction, and to interface/integrate them into existing simulation and design frameworks. 2) To develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest. 3) To enhance existing EDA solutions by means of thermal-aware add-on tools that will enable designers to address temperature issues during their daily work and with their usual design flows.

Dziedzina nauki

Program(-y)

Temat(-y)

Zaproszenie do składania wniosków

FP7-ICT-2009-4
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System finansowania

CP - Collaborative project (generic)

Koordynator

STMICROELECTRONICS SRL
Wkład UE
€ 781 482,00
Adres
VIA C.OLIVETTI 2
20864 Agrate Brianza
Włochy

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Region
Nord-Ovest Lombardia Monza e della Brianza
Rodzaj działalności
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt administracyjny
Salvatore Rinaudo (Mr.)
Linki
Koszt całkowity
Brak danych

Uczestnicy (20)

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Ostatnia aktualizacja: 25 Maja 2022

Moja broszura

Permalink: https://cordis.europa.eu/project/id/248603/pl

European Union, 2024