Opis projektu
Very advanced nanoelectronic components: design, engineering, technology and manufacturability
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- and micro-technologies and materials, both of which are key enablers for advanced thermal and mechanical interfaces, have to be developed and compatibly integrated to obtain higher electrical, thermal and reliability performance under harsh environmental conditions.Nanotherm's objective is to take up these challenges in design, technology and test:Novel approaches to thermal technologies with superior electrical, thermal and thermo-mechanical properties will be developed in the project and demonstrated on automotive, avionics, solid-state lighting and industrial applications. Parallel routes will be followed addressing nano-sinter-adhesive bonding, phonon-coupled VACNT joining, nano-functionalised nano-filled adhesive die attach and graphene-enhanced surfaces. The main principle common to all technologies is the exploitation of nano-effects to obtain outstanding interconnect properties by especially developed processes.In parallel, a multi-scale and multi-domain modelling framework will furnish guidelines for materials design by various approaches from ab-inito up to continuum modelling and verified by corresponding experimental techniques.The consortium, composed of 18 partners from industry, SME and academia out of 8 European countries, embodies the necessary excellence and interdisciplinarity to address these tasks successfully. We are convinced that Nanotherm's results will enable the next generation of heterogeneously integrated power packages, cut down thermal interface resistance at least by 50% and impact also on other power system-in-package configurations.
Zaproszenie do składania wniosków
FP7-ICT-2011-8
Zobacz inne projekty w ramach tego zaproszenia
System finansowania
CP - Collaborative project (generic)Koordynator
92190 MEUDON
Francja
Zobacz na mapie
Uczestnicy (17)
85579 Neubiberg
Zobacz na mapie
12489 Berlin
Zobacz na mapie
63450 Hanau
Zobacz na mapie
12489 Berlin
Zobacz na mapie
70839 Gerlingen-Schillerhoehe
Zobacz na mapie
09111 Chemnitz
Zobacz na mapie
08193 Cerdanyola Del Valles
Zobacz na mapie
75794 Paris
Zobacz na mapie
1111 Budapest
Zobacz na mapie
1117 Budapest
Zobacz na mapie
5656 AG Eindhoven
Zobacz na mapie
5612 AE Eindhoven
Zobacz na mapie
50-370 Wroclaw
Zobacz na mapie
90268 LODZ
Zobacz na mapie
4485 629 Mindelo Vila Do Conde
Zobacz na mapie
412 96 GOTEBORG
Zobacz na mapie
418 79 Goteborg
Zobacz na mapie