Publications Conference proceedings (7) Low damage ULK etching by means of high boiling point organic condensation Author(s): R. Chanson, N. Holtzer, P. Lefaucheux, R. Dussart, P. Shen, K. Urabe, C. Dussarat, K. Maekawa, K. Yatsuda, S. Tahara and J.-F. de Marneffe Published in: 2017 Publisher: MRS Cryo-etching: fundamental mechanisms Author(s): R. CHANSON, S. Tahara, K. Sasa, C. Dussarat, R. Dussart, T. Thillocher, P. Lefaucheux, J-F demarneff Published in: 2017 Publisher: PTW Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL) Author(s): Romain Chanson, Philippe Lefaucheux, Remi Dussart, Tillocher Thomas, Peng Shen, Keiichiro Urabe, Christian Dussarat, Kaoru Maekawa, Koichi Yatsuda, Shigeru Tahara, Jean-Francois de Marneffe Published in: 2017 Publisher: iPlasmaNano-VIII Cryo-etching for low-k integration : Phenomenon screening from condensation to damages propagation a 0 damage process is reached Author(s): R. Chanson, J-F. De Marneffe, R. Dussart, T. Thomas, L. Philippe Published in: 2016 Publisher: PESM Option for low damage processing during FSAV : GPPS and alternative plug Author(s): R. Chanson, J.F. de Marneffe, K. Babaei Gavan, F. Lazzarino, T. Yamaguchi, K. Yatsuda Published in: 2017 Publisher: PTW Comparison of C4F8 and Higher boiling point organic for low-k cryo-etching Author(s): F.Leroy, N. Brochu, R. Chanson, R.Dussart, T. Tillocher, J.‑F. de Marneffe, L Zhang, K. Maekawa, K. Yatsuda, S. Tahara, C. Dussarrat Published in: 2016 Publisher: PESM Low-k cryo-etching : Comparison of four different High Boiling Point Organic (HBPO) Author(s): R. CHANSON, S. Tahara, K. Sasa, C. Dussarrat, R. Dussart, T. Tillocher, P. Lefaucheux, J-F de marneffe Published in: 2017 Publisher: AVS Searching for OpenAIRE data... There was an error trying to search data from OpenAIRE No results available
