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CORDIS

In-line quality inspection system for smart production of micro and nanoelectronic components

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Dissemination and exploitation report 3 (se abrirá en una nueva ventana)

Report about dissemination and exploitation activities in the 3rd year of the project

Progress activities reports 3 (se abrirá en una nueva ventana)

Report about the technical progress in the 3rd year of the project

Progress activities reports 1 (se abrirá en una nueva ventana)

Report about the technical progress in the 1st year of the project

Sample specifications (se abrirá en una nueva ventana)

Defination and specifications of the Sample for failure analysing

Progress management report and cost statements 3 (se abrirá en una nueva ventana)

Progress management report and cost statements for the 3rd year of the project

Progress management report and cost statements 2 (se abrirá en una nueva ventana)

Progress management report and cost statements for the 2nd year of the project

Report on industrial samples for FA (se abrirá en una nueva ventana)
Definition and specification of data management and measurement software (se abrirá en una nueva ventana)
Report on development and realization of FA software (se abrirá en una nueva ventana)
Dissemination and exploitation report 1 (se abrirá en una nueva ventana)

Report about dissemination and exploitation activities in the 1st year of the project

Progress activities reports 2 (se abrirá en una nueva ventana)

Report about the technical progress in the 2nd year of the project

Report on development and realization of FA hardware (se abrirá en una nueva ventana)

Report on development and realization of FA hardware at lab level

Progress management report and cost statements 1 (se abrirá en una nueva ventana)

Progress management report and cost statements for the 1st year of the project

Dissemination and exploitation report 2 (se abrirá en una nueva ventana)

Report about dissemination and exploitation activities in the 2nd year of the project

Realization and verification of in-line capable FA system (se abrirá en una nueva ventana)

Realization and verification of inline capable FA system

Demonstration of FA systems under laboratory conditions (se abrirá en una nueva ventana)

Demonstration of FA systems under laboratory conditions by analizing the indstrial samples provided by the endusers

Demonstration fully functional in-line FA system (se abrirá en una nueva ventana)

Demonstration fully functional inline FA system at enduser sides

Publicaciones

Tilt- and warpage measurement of bonded dies as an inline quality assessment tool (se abrirá en una nueva ventana)

Autores: D. May; J. Heilmann; E. Boschman; M. Abo Ras; B. Wunderle
Publicado en: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Edición 22th, 2021, ISBN 978-1-6654-1373-2
Editor: IEEE
DOI: 10.1109/eurosime52062.2021.9410832

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation (se abrirá en una nueva ventana)

Autores: D. R. Wargulski, D. May, C. Grosse-Kockert, E. Boschman, B. Wunderle and M. Abo Ras
Publicado en: Quantitative InfraRed Thermography Conference, Edición 15th, 2020
Editor: Qirt
DOI: 10.21611/qirt.2020.121

Pulsed Infrared Thermography Failure Analysis of low-emissivity Specimens without contaminations caused by high-emissivity coatings (se abrirá en una nueva ventana)

Autores: D. R. Wargulski; D. May; J. Petrick; R. Schacht; B. Wunderle; M. Abo Ras All Authors
Publicado en: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Edición 26th, 2020, ISBN 978-1-7281-7643-7
Editor: IEEE
DOI: 10.1109/therminic49743.2020.9420531

An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration (se abrirá en una nueva ventana)

Autores: Dan R. Wargulski; Daniel May; Florian Löffler; Torsten Nowak; Jan Petrick; Corinna Grosse; Bernhard Wunderle; Eef Boschman; Mohamad Abo Ras
Publicado en: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Edición 25th, 2019, ISBN 978-1-7281-2078-2
Editor: IEEE
DOI: 10.1109/therminic.2019.8923598

Infrared thermal imaging as inline quality assessment tool (se abrirá en una nueva ventana)

Autores: S. Panahandeh; D. May; D.R. Wargulski; E. Boschman; R. Schacht; M. Abo Ras; B. Wunderle
Publicado en: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, ISBN 978-1-6654-1373-2
Editor: IEEE
DOI: 10.1109/eurosime52062.2021.9410883

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings (se abrirá en una nueva ventana)

Autores: Dan R. Wargulski; Daniel May; Eef Boschman; Aaron Hutzler; Bernhard Wunderle; Mohamad Abo Ras
Publicado en: Electronics System-Integration Technology Conference (ESTC), Edición 8th, 2020, ISBN 978-1-7281-6293-5
Editor: IEEE
DOI: 10.1109/estc48849.2020.9229787

Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy (se abrirá en una nueva ventana)

Autores: Dan R. Wargulski; Florian Löffler; Daniel May; Jens Heilmann; Bernhard Wunderle; Ana Borta-Boyon; Afshin Ziaei; Mohamad Abo Ras
Publicado en: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Edición 24rd, 2018, ISBN 978-1-5386-6759-0
Editor: IEEE
DOI: 10.1109/therminic.2018.8593331

Thermal Characterization and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging (se abrirá en una nueva ventana)

Autores: D. May; M. Gora; D. Wargulski; F. Löffler; M. Abo Ras; A. Borta-Boyon; A. Ziaei; B. Wunderle
Publicado en: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Edición 26th, 2020, ISBN 978-1-7281-7643-7
Editor: IEEE
DOI: 10.1109/therminic49743.2020.9420519

Towards Data Driven Failure Analysis Using Infrared Thermography (se abrirá en una nueva ventana)

Autores: Kaushal Arun Pareek; Daniel May; Mohamad Abo Ras; Bernhard Wunderle
Publicado en: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Edición 22th, 2021, ISBN 978-1-6654-1373-2
Editor: IEEE
DOI: 10.1109/eurosime52062.2021.9410885

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