Risultati finali
1st e-newsletter
Publication of e-newsletter 22nd enewsletter
Publication of e-newsletter 33rd enewsletter
Report about dissemination and exploitation activities in the 3rd year of the project
Progress activities reports 3Report about the technical progress in the 3rd year of the project
Progress activities reports 1Report about the technical progress in the 1st year of the project
Sample specificationsDefination and specifications of the Sample for failure analysing
Progress management report and cost statements 3Progress management report and cost statements for the 3rd year of the project
Progress management report and cost statements 2Progress management report and cost statements for the 2nd year of the project
Report on industrial samples for FADefinition and specification of data management and measurement software
Report on development and realization of FA software
Dissemination and exploitation report 1
Report about dissemination and exploitation activities in the 1st year of the project
Progress activities reports 2Report about the technical progress in the 2nd year of the project
Report on development and realization of FA hardwareReport on development and realization of FA hardware at lab level
Progress management report and cost statements 1Progress management report and cost statements for the 1st year of the project
Dissemination and exploitation report 2Report about dissemination and exploitation activities in the 2nd year of the project
Realization and verification of inline capable FA system
Demonstration of FA systems under laboratory conditionsDemonstration of FA systems under laboratory conditions by analizing the indstrial samples provided by the endusers
Demonstration fully functional in-line FA systemDemonstration fully functional inline FA system at enduser sides
Pubblicazioni
Autori:
D. May; J. Heilmann; E. Boschman; M. Abo Ras; B. Wunderle
Pubblicato in:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Numero 22th, 2021, ISBN 978-1-6654-1373-2
Editore:
IEEE
DOI:
10.1109/eurosime52062.2021.9410832
Autori:
D. R. Wargulski, D. May, C. Grosse-Kockert, E. Boschman, B. Wunderle and M. Abo Ras
Pubblicato in:
Quantitative InfraRed Thermography Conference, Numero 15th, 2020
Editore:
Qirt
DOI:
10.21611/qirt.2020.121
Autori:
D. R. Wargulski; D. May; J. Petrick; R. Schacht; B. Wunderle; M. Abo Ras
All Authors
Pubblicato in:
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 26th, 2020, ISBN 978-1-7281-7643-7
Editore:
IEEE
DOI:
10.1109/therminic49743.2020.9420531
Autori:
Dan R. Wargulski; Daniel May; Florian Löffler; Torsten Nowak; Jan Petrick; Corinna Grosse; Bernhard Wunderle; Eef Boschman; Mohamad Abo Ras
Pubblicato in:
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 25th, 2019, ISBN 978-1-7281-2078-2
Editore:
IEEE
DOI:
10.1109/therminic.2019.8923598
Autori:
S. Panahandeh; D. May; D.R. Wargulski; E. Boschman; R. Schacht; M. Abo Ras; B. Wunderle
Pubblicato in:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, ISBN 978-1-6654-1373-2
Editore:
IEEE
DOI:
10.1109/eurosime52062.2021.9410883
Autori:
Dan R. Wargulski; Daniel May; Eef Boschman; Aaron Hutzler; Bernhard Wunderle; Mohamad Abo Ras
Pubblicato in:
Electronics System-Integration Technology Conference (ESTC), Numero 8th, 2020, ISBN 978-1-7281-6293-5
Editore:
IEEE
DOI:
10.1109/estc48849.2020.9229787
Autori:
Dan R. Wargulski; Florian Löffler; Daniel May; Jens Heilmann; Bernhard Wunderle; Ana Borta-Boyon; Afshin Ziaei; Mohamad Abo Ras
Pubblicato in:
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 24rd, 2018, ISBN 978-1-5386-6759-0
Editore:
IEEE
DOI:
10.1109/therminic.2018.8593331
Autori:
D. May; M. Gora; D. Wargulski; F. Löffler; M. Abo Ras; A. Borta-Boyon; A. Ziaei; B. Wunderle
Pubblicato in:
International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 26th, 2020, ISBN 978-1-7281-7643-7
Editore:
IEEE
DOI:
10.1109/therminic49743.2020.9420519
Autori:
Kaushal Arun Pareek; Daniel May; Mohamad Abo Ras; Bernhard Wunderle
Pubblicato in:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Numero 22th, 2021, ISBN 978-1-6654-1373-2
Editore:
IEEE
DOI:
10.1109/eurosime52062.2021.9410885
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