In-line quality inspection system for smart production of micro and nanoelectronic components

Informazioni relative al progetto

INLINETEST

ID dell’accordo di sovvenzione: 780832

DOI 10.3030/780832

Progetto chiuso

Data della firma CE 21 Settembre 2017

Data di avvio 1 Gennaio 2018

Data di completamento 30 Novembre 2021

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 1 762 631,25

Contributo UE € 1 332 916,88

Coordinato da

BERLINER NANOTEST UND DESIGN GMBH
Germany

Risultati finali

Open Research Data Pilot (3)

Publication of e-newsletter 1

1st e-newsletter

Publication of e-newsletter 2

2nd enewsletter

Publication of e-newsletter 3

3rd enewsletter

Documents, reports (14)

Dissemination and exploitation report 3

Report about dissemination and exploitation activities in the 3rd year of the project

Progress activities reports 3

Report about the technical progress in the 3rd year of the project

Progress activities reports 1

Report about the technical progress in the 1st year of the project

Sample specifications

Defination and specifications of the Sample for failure analysing

Progress management report and cost statements 3

Progress management report and cost statements for the 3rd year of the project

Progress management report and cost statements 2

Progress management report and cost statements for the 2nd year of the project

Report on industrial samples for FA
Definition and specification of data management and measurement software
Report on development and realization of FA software
Dissemination and exploitation report 1

Report about dissemination and exploitation activities in the 1st year of the project

Progress activities reports 2

Report about the technical progress in the 2nd year of the project

Report on development and realization of FA hardware

Report on development and realization of FA hardware at lab level

Progress management report and cost statements 1

Progress management report and cost statements for the 1st year of the project

Dissemination and exploitation report 2

Report about dissemination and exploitation activities in the 2nd year of the project

Demonstrators, pilots, prototypes (3)

Realization and verification of in-line capable FA system

Realization and verification of inline capable FA system

Demonstration of FA systems under laboratory conditions

Demonstration of FA systems under laboratory conditions by analizing the indstrial samples provided by the endusers

Demonstration fully functional in-line FA system

Demonstration fully functional inline FA system at enduser sides

Websites, patent fillings, videos etc. (1)

INLINETEST website online and logo defined

Pubblicazioni

Conference proceedings (9)

Tilt- and warpage measurement of bonded dies as an inline quality assessment tool

Autori: D. May; J. Heilmann; E. Boschman; M. Abo Ras; B. Wunderle
Pubblicato in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Numero 22th, 2021, ISBN 978-1-6654-1373-2
Editore: IEEE
DOI: 10.1109/eurosime52062.2021.9410832

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation

Autori: D. R. Wargulski, D. May, C. Grosse-Kockert, E. Boschman, B. Wunderle and M. Abo Ras
Pubblicato in: Quantitative InfraRed Thermography Conference, Numero 15th, 2020
Editore: Qirt
DOI: 10.21611/qirt.2020.121

Pulsed Infrared Thermography Failure Analysis of low-emissivity Specimens without contaminations caused by high-emissivity coatings

Autori: D. R. Wargulski; D. May; J. Petrick; R. Schacht; B. Wunderle; M. Abo Ras All Authors
Pubblicato in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 26th, 2020, ISBN 978-1-7281-7643-7
Editore: IEEE
DOI: 10.1109/therminic49743.2020.9420531

An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration

Autori: Dan R. Wargulski; Daniel May; Florian Löffler; Torsten Nowak; Jan Petrick; Corinna Grosse; Bernhard Wunderle; Eef Boschman; Mohamad Abo Ras
Pubblicato in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 25th, 2019, ISBN 978-1-7281-2078-2
Editore: IEEE
DOI: 10.1109/therminic.2019.8923598

Infrared thermal imaging as inline quality assessment tool

Autori: S. Panahandeh; D. May; D.R. Wargulski; E. Boschman; R. Schacht; M. Abo Ras; B. Wunderle
Pubblicato in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, ISBN 978-1-6654-1373-2
Editore: IEEE
DOI: 10.1109/eurosime52062.2021.9410883

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings

Autori: Dan R. Wargulski; Daniel May; Eef Boschman; Aaron Hutzler; Bernhard Wunderle; Mohamad Abo Ras
Pubblicato in: Electronics System-Integration Technology Conference (ESTC), Numero 8th, 2020, ISBN 978-1-7281-6293-5
Editore: IEEE
DOI: 10.1109/estc48849.2020.9229787

Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy

Autori: Dan R. Wargulski; Florian Löffler; Daniel May; Jens Heilmann; Bernhard Wunderle; Ana Borta-Boyon; Afshin Ziaei; Mohamad Abo Ras
Pubblicato in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 24rd, 2018, ISBN 978-1-5386-6759-0
Editore: IEEE
DOI: 10.1109/therminic.2018.8593331

Thermal Characterization and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging

Autori: D. May; M. Gora; D. Wargulski; F. Löffler; M. Abo Ras; A. Borta-Boyon; A. Ziaei; B. Wunderle
Pubblicato in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Numero 26th, 2020, ISBN 978-1-7281-7643-7
Editore: IEEE
DOI: 10.1109/therminic49743.2020.9420519

Towards Data Driven Failure Analysis Using Infrared Thermography

Autori: Kaushal Arun Pareek; Daniel May; Mohamad Abo Ras; Bernhard Wunderle
Pubblicato in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Numero 22th, 2021, ISBN 978-1-6654-1373-2
Editore: IEEE
DOI: 10.1109/eurosime52062.2021.9410885