In-line quality inspection system for smart production of micro and nanoelectronic components

Project Information

INLINETEST

Grant agreement ID: 780832

DOI 10.3030/780832

Project closed

EC signature date 21 September 2017

Start date 1 January 2018

End date 30 November 2021

Funded under

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Total cost € 1 762 631,25

EU contribution € 1 332 916,88

Coordinated by

BERLINER NANOTEST UND DESIGN GMBH
Germany

Deliverables

Open Research Data Pilot (3)

Publication of e-newsletter 1

1st e-newsletter

Publication of e-newsletter 2

2nd enewsletter

Publication of e-newsletter 3

3rd enewsletter

Documents, reports (14)

Dissemination and exploitation report 3

Report about dissemination and exploitation activities in the 3rd year of the project

Progress activities reports 3

Report about the technical progress in the 3rd year of the project

Progress activities reports 1

Report about the technical progress in the 1st year of the project

Sample specifications

Defination and specifications of the Sample for failure analysing

Progress management report and cost statements 3

Progress management report and cost statements for the 3rd year of the project

Progress management report and cost statements 2

Progress management report and cost statements for the 2nd year of the project

Report on industrial samples for FA
Definition and specification of data management and measurement software
Report on development and realization of FA software
Dissemination and exploitation report 1

Report about dissemination and exploitation activities in the 1st year of the project

Progress activities reports 2

Report about the technical progress in the 2nd year of the project

Report on development and realization of FA hardware

Report on development and realization of FA hardware at lab level

Progress management report and cost statements 1

Progress management report and cost statements for the 1st year of the project

Dissemination and exploitation report 2

Report about dissemination and exploitation activities in the 2nd year of the project

Demonstrators, pilots, prototypes (3)

Realization and verification of in-line capable FA system

Realization and verification of inline capable FA system

Demonstration of FA systems under laboratory conditions

Demonstration of FA systems under laboratory conditions by analizing the indstrial samples provided by the endusers

Demonstration fully functional in-line FA system

Demonstration fully functional inline FA system at enduser sides

Websites, patent fillings, videos etc. (1)

INLINETEST website online and logo defined

Publications

Conference proceedings (9)

Tilt- and warpage measurement of bonded dies as an inline quality assessment tool

Author(s): D. May; J. Heilmann; E. Boschman; M. Abo Ras; B. Wunderle
Published in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Issue 22th, 2021, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410832

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation

Author(s): D. R. Wargulski, D. May, C. Grosse-Kockert, E. Boschman, B. Wunderle and M. Abo Ras
Published in: Quantitative InfraRed Thermography Conference, Issue 15th, 2020
Publisher: Qirt
DOI: 10.21611/qirt.2020.121

Pulsed Infrared Thermography Failure Analysis of low-emissivity Specimens without contaminations caused by high-emissivity coatings

Author(s): D. R. Wargulski; D. May; J. Petrick; R. Schacht; B. Wunderle; M. Abo Ras All Authors
Published in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Issue 26th, 2020, ISBN 978-1-7281-7643-7
Publisher: IEEE
DOI: 10.1109/therminic49743.2020.9420531

An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration

Author(s): Dan R. Wargulski; Daniel May; Florian Löffler; Torsten Nowak; Jan Petrick; Corinna Grosse; Bernhard Wunderle; Eef Boschman; Mohamad Abo Ras
Published in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Issue 25th, 2019, ISBN 978-1-7281-2078-2
Publisher: IEEE
DOI: 10.1109/therminic.2019.8923598

Infrared thermal imaging as inline quality assessment tool

Author(s): S. Panahandeh; D. May; D.R. Wargulski; E. Boschman; R. Schacht; M. Abo Ras; B. Wunderle
Published in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410883

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings

Author(s): Dan R. Wargulski; Daniel May; Eef Boschman; Aaron Hutzler; Bernhard Wunderle; Mohamad Abo Ras
Published in: Electronics System-Integration Technology Conference (ESTC), Issue 8th, 2020, ISBN 978-1-7281-6293-5
Publisher: IEEE
DOI: 10.1109/estc48849.2020.9229787

Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy

Author(s): Dan R. Wargulski; Florian Löffler; Daniel May; Jens Heilmann; Bernhard Wunderle; Ana Borta-Boyon; Afshin Ziaei; Mohamad Abo Ras
Published in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Issue 24rd, 2018, ISBN 978-1-5386-6759-0
Publisher: IEEE
DOI: 10.1109/therminic.2018.8593331

Thermal Characterization and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging

Author(s): D. May; M. Gora; D. Wargulski; F. Löffler; M. Abo Ras; A. Borta-Boyon; A. Ziaei; B. Wunderle
Published in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Issue 26th, 2020, ISBN 978-1-7281-7643-7
Publisher: IEEE
DOI: 10.1109/therminic49743.2020.9420519

Towards Data Driven Failure Analysis Using Infrared Thermography

Author(s): Kaushal Arun Pareek; Daniel May; Mohamad Abo Ras; Bernhard Wunderle
Published in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Issue 22th, 2021, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410885