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CORDIS - Forschungsergebnisse der EU
CORDIS

In-line quality inspection system for smart production of micro and nanoelectronic components

CORDIS bietet Links zu öffentlichen Ergebnissen und Veröffentlichungen von HORIZONT-Projekten.

Links zu Ergebnissen und Veröffentlichungen von RP7-Projekten sowie Links zu einigen Typen spezifischer Ergebnisse wie Datensätzen und Software werden dynamisch von OpenAIRE abgerufen.

Leistungen

Dissemination and exploitation report 3 (öffnet in neuem Fenster)

Report about dissemination and exploitation activities in the 3rd year of the project

Progress activities reports 3 (öffnet in neuem Fenster)

Report about the technical progress in the 3rd year of the project

Progress activities reports 1 (öffnet in neuem Fenster)

Report about the technical progress in the 1st year of the project

Sample specifications (öffnet in neuem Fenster)

Defination and specifications of the Sample for failure analysing

Progress management report and cost statements 3 (öffnet in neuem Fenster)

Progress management report and cost statements for the 3rd year of the project

Progress management report and cost statements 2 (öffnet in neuem Fenster)

Progress management report and cost statements for the 2nd year of the project

Report on industrial samples for FA (öffnet in neuem Fenster)
Definition and specification of data management and measurement software (öffnet in neuem Fenster)
Report on development and realization of FA software (öffnet in neuem Fenster)
Dissemination and exploitation report 1 (öffnet in neuem Fenster)

Report about dissemination and exploitation activities in the 1st year of the project

Progress activities reports 2 (öffnet in neuem Fenster)

Report about the technical progress in the 2nd year of the project

Report on development and realization of FA hardware (öffnet in neuem Fenster)

Report on development and realization of FA hardware at lab level

Progress management report and cost statements 1 (öffnet in neuem Fenster)

Progress management report and cost statements for the 1st year of the project

Dissemination and exploitation report 2 (öffnet in neuem Fenster)

Report about dissemination and exploitation activities in the 2nd year of the project

Realization and verification of in-line capable FA system (öffnet in neuem Fenster)

Realization and verification of inline capable FA system

Demonstration of FA systems under laboratory conditions (öffnet in neuem Fenster)

Demonstration of FA systems under laboratory conditions by analizing the indstrial samples provided by the endusers

Demonstration fully functional in-line FA system (öffnet in neuem Fenster)

Demonstration fully functional inline FA system at enduser sides

Veröffentlichungen

Tilt- and warpage measurement of bonded dies as an inline quality assessment tool (öffnet in neuem Fenster)

Autoren: D. May; J. Heilmann; E. Boschman; M. Abo Ras; B. Wunderle
Veröffentlicht in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ausgabe 22th, 2021, ISBN 978-1-6654-1373-2
Herausgeber: IEEE
DOI: 10.1109/eurosime52062.2021.9410832

Inspection of silver-sinter die attaches by pulsed and lock-in infrared thermography with flash lamp and laser excitation (öffnet in neuem Fenster)

Autoren: D. R. Wargulski, D. May, C. Grosse-Kockert, E. Boschman, B. Wunderle and M. Abo Ras
Veröffentlicht in: Quantitative InfraRed Thermography Conference, Ausgabe 15th, 2020
Herausgeber: Qirt
DOI: 10.21611/qirt.2020.121

Pulsed Infrared Thermography Failure Analysis of low-emissivity Specimens without contaminations caused by high-emissivity coatings (öffnet in neuem Fenster)

Autoren: D. R. Wargulski; D. May; J. Petrick; R. Schacht; B. Wunderle; M. Abo Ras All Authors
Veröffentlicht in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Ausgabe 26th, 2020, ISBN 978-1-7281-7643-7
Herausgeber: IEEE
DOI: 10.1109/therminic49743.2020.9420531

An In-line Failure Analysis System Based on IR Thermography Ready for Production Line Integration (öffnet in neuem Fenster)

Autoren: Dan R. Wargulski; Daniel May; Florian Löffler; Torsten Nowak; Jan Petrick; Corinna Grosse; Bernhard Wunderle; Eef Boschman; Mohamad Abo Ras
Veröffentlicht in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Ausgabe 25th, 2019, ISBN 978-1-7281-2078-2
Herausgeber: IEEE
DOI: 10.1109/therminic.2019.8923598

Infrared thermal imaging as inline quality assessment tool (öffnet in neuem Fenster)

Autoren: S. Panahandeh; D. May; D.R. Wargulski; E. Boschman; R. Schacht; M. Abo Ras; B. Wunderle
Veröffentlicht in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, ISBN 978-1-6654-1373-2
Herausgeber: IEEE
DOI: 10.1109/eurosime52062.2021.9410883

Inline failure analysis of electronic components by infrared thermography without high-emissivity spray coatings (öffnet in neuem Fenster)

Autoren: Dan R. Wargulski; Daniel May; Eef Boschman; Aaron Hutzler; Bernhard Wunderle; Mohamad Abo Ras
Veröffentlicht in: Electronics System-Integration Technology Conference (ESTC), Ausgabe 8th, 2020, ISBN 978-1-7281-6293-5
Herausgeber: IEEE
DOI: 10.1109/estc48849.2020.9229787

Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy (öffnet in neuem Fenster)

Autoren: Dan R. Wargulski; Florian Löffler; Daniel May; Jens Heilmann; Bernhard Wunderle; Ana Borta-Boyon; Afshin Ziaei; Mohamad Abo Ras
Veröffentlicht in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Ausgabe 24rd, 2018, ISBN 978-1-5386-6759-0
Herausgeber: IEEE
DOI: 10.1109/therminic.2018.8593331

Thermal Characterization and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging (öffnet in neuem Fenster)

Autoren: D. May; M. Gora; D. Wargulski; F. Löffler; M. Abo Ras; A. Borta-Boyon; A. Ziaei; B. Wunderle
Veröffentlicht in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Ausgabe 26th, 2020, ISBN 978-1-7281-7643-7
Herausgeber: IEEE
DOI: 10.1109/therminic49743.2020.9420519

Towards Data Driven Failure Analysis Using Infrared Thermography (öffnet in neuem Fenster)

Autoren: Kaushal Arun Pareek; Daniel May; Mohamad Abo Ras; Bernhard Wunderle
Veröffentlicht in: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ausgabe 22th, 2021, ISBN 978-1-6654-1373-2
Herausgeber: IEEE
DOI: 10.1109/eurosime52062.2021.9410885

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