Resultado final
Experimentally validated EMI-aware IEC61508 techniques and measures
Unified ISO26262 electromagnetic risk analysis approach for functional safety and cyber-security
Unified ISO26262 electromagnetic risk analysis approach for functional safety andcyber-security
Scientific articles: 2 proceedings & 2 journal papers/ESRRisk-based EMI certification report of real-life maritime application
Validated IC-EM and IC-IM models including environmental stress and ageing
Public engagement: 2/ESR
Public engagement: 2/ESR (see 2.3.1 for complete overview)
EMI Risk Management Plan for two real-life environmentsIntegrated Circuit to measure absorbed energy
Validated statistical methodology to estimate coupling into enclosure or device
Description methodology for risk prediction from IC to system level
Validation report electromagnetic risk assessment methodologies
Basic description statistical electromagnetic risk assessment
Guidelines for electromagnetic protection of critical infrastructures
Flow-diagram for an EMI-aware safety case
EMI fault-tolerant automotive IC
Dedicated EMI Risk Management and Design Plan for display systems in medical environment
EMI-aware risk identification and assessment of vehicular communication systems
PETER Special Session at the Safety Critical Systems Symposium
PETER Training School IIIPETER Training School II
PETER special sessions/workshops II
PETER Workshop at the EMC Europe Symposium
PETER Kick-Off Meeting/PETER Training School IProject website (www.etn-peter.eu)
Publicaciones
Autores:
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Publicado en:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9900924
Autores:
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Publicado en:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559385
Autores:
F. R. Arduini, M. Lanzrath, T. Pusch, M. Suhrke and H. Garbe
Publicado en:
IEEE Int. Joint EMC/SI/PI and EMC Europe Symp., 2021, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559348
Autores:
P. Memar, J. Vankeirsbilck, D. Vanoost, T. Holvoet, J. Boydens
Publicado en:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559336
Autores:
Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Publicado en:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Editor:
IEEE Xplore
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559356
Autores:
A. Nateghi, M. Schaarschmidt, S. Fisahn, H. Garbe
Publicado en:
Asia-Pacific Int. Symp. On Electromagnetic Compatibility (APEMC), 2021
Editor:
IEEE
DOI:
10.1109/apemc49932.2021.9596789
Autores:
Hasan Habib, Tin Claeys, Richard Perdriau. Davy, Pissoort
Publicado en:
International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Edición 13, 2022
Editor:
IEEE
DOI:
10.1109/emccompo52133.2022.9758598
Autores:
M. Tishehzan, M. Nicholson, and J. F. Dawson
Publicado en:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2023, 2023
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274226
Autores:
Hasan Habib, Tim Claeys, Dries Vanoost, Guy A. E. Vandenbosch, Davy Pissoort
Publicado en:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Edición 23-25 Sept. 2020, 2020, Página(s) 1-6, ISBN 978-1-7281-5579-1
Editor:
IEEE
DOI:
10.1109/emceurope48519.2020.9245715
Autores:
A. Ramezani, Q. M. Khan, H. Pues
Publicado en:
13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022
Editor:
IEEE Xplore
DOI:
10.1109/emccompo52133.2022.9758617
Autores:
F. R. Arduini, A. Nateghi, M. Schaarschmidt, M. Lanzrath and M. Suhrke
Publicado en:
EMV Kongress 2022. Aachen, 2022
Editor:
Apprimus
DOI:
10.15488/12553
Autores:
A. Nateghi, M. Schaarschmidt, S. Fisahn, H. Garbe
Publicado en:
IEEE Int. Joint EMC/SI/PI and EMC Europe Symposium, 2021, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559200
Autores:
Mohammad Tishehzan; Mark Nicholson; John F. Dawson; Davy Pissoort
Publicado en:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2022
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9900989
Autores:
Lokesh Devaraj, Alastair R. Ruddle, Alistair P. Duffy
Publicado en:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Página(s) 1-6, ISBN 978-1-7281-5579-1
Editor:
IEEE
DOI:
10.1109/emceurope48519.2020.9245692
Autores:
N. Omollo, R. A. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Publicado en:
Int. Symp. On Electromagnetic Compatibility (EMC Europe), 2020
Editor:
IEEE
DOI:
10.1109/emceurope48519.2020.9245796
Autores:
Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Publicado en:
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021
Editor:
IEEE Xplore
DOI:
10.1109/apemc49932.2021.9596842
Autores:
Q. M. Khan, R. Perdriau, M. Ramdani, M. Koohestani
Publicado en:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Editor:
IEEE Xplore
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559242
Autores:
N. Omollo, R. Vogt-Ardatjes, J. K. van der Ven, F. Leferink
Publicado en:
Asia-Pacific Int. Symp. On Electromagnetic Compatibility (APEMC), 2021
Editor:
IEEE
DOI:
10.1109/apemc49932.2021.9596817
Autores:
N. Omollo, J. K. van der Ven, R. A. Vogt-Ardatjew, F. Leferink
Publicado en:
IEEE Int. Symp. On Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020
Editor:
IEEE
DOI:
10.1109/emcsi38923.2020.9191557
Autores:
Lokesh Devaraj, Alastair R. Ruddle, Alistair P. Duffy and Anthony J. M. Martin
Publicado en:
Proceedings of 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, Página(s) pp. 760-764
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559243
Autores:
Lokesh Devaraj, Alastair R. Ruddle and Alistair P. Duffy
Publicado en:
Proceedings of 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, Página(s) 851-856
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559291
Autores:
A. Nateghi, N. Moonen, M. Schaarschmidt, S. Fisahn, H. Garbe
Publicado en:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Editor:
IEEE
DOI:
10.1109/emcsi39492.2022.9889619
Autores:
Lokesh Devaraj, Alastair R. Ruddle, Qazi Mashaal Khan, Alistair P. Duffy
Publicado en:
Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Página(s) 1867-1874, ISBN 978-981-18-2016-8
Editor:
Research Publishing Services
DOI:
10.3850/978-981-18-2016-8_203-cd
Autores:
Z. Chen, T. Claeys, J. Catrysse and D. Pissoort,
Publicado en:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2023., 2023
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274381
Autores:
Qazi Mashaal Khan, Mohsen Koohestani, Mohamed Ramdani, Richard Perdriau
Publicado en:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Página(s) 1-6, ISBN 978-1-7281-5579-1
Editor:
IEEE
DOI:
10.1109/emceurope48519.2020.9245783
Autores:
R. Aba, V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Publicado en:
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023
Editor:
IEEE
DOI:
10.1109/gemccon57842.2023.10078197
Autores:
O. Leppäaho, F. Lafon, B. Ferreri, P. Fernandez-Lopez, M. Stojanovic, R. Perdriau, M. Ramdani
Publicado en:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9901089
Autores:
O. Leppäaho, F. Lafon, P. Fernandez-Lopez, M. Stojanovic, R. Perdriau, M. Ramdani
Publicado en:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Edición 26 July-13 Aug. 2021, 2021, Página(s) 917-921
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559176
Autores:
F. R. Arduini, CJJ van der Ven, M. Lanzrath, M. Suhrke
Publicado en:
International Ship Control Systems Symposium, 2022
Editor:
IMarEST
DOI:
10.24868/10723
Autores:
Hasan Habib, Tim Claeys, Jonas Lannoo, Dries Vanoost, Guy A. E. Vandenbosch, Davy Pissoort
Publicado en:
2020 XXIX International Scientific Conference Electronics (ET), Edición 16-18 Sept. 2020, 2020, Página(s) 1-4, ISBN 978-1-7281-7426-6
Editor:
IEEE
DOI:
10.1109/et50336.2020.9238167
Autores:
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Publicado en:
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023
Editor:
IEEE
DOI:
10.1109/gemccon57842.2023.10078199
Autores:
Lokesh Devaraj, Alastair R. Ruddle, Qazi Mashaal Khan, Alistair P. Duff
Publicado en:
Proceedings of 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022, Página(s) 107-111
Editor:
IEEE
DOI:
10.1109/emccompo52133.2022.9758612
Autores:
O. Leppäaho, M. Nicholson, F. Lafon, M. Ramdani
Publicado en:
31st European Safety and Reliability Conference, Edición 22/09/2021, 2021, Página(s) 1859-1866
Editor:
Research Publishing (S) Pte Ltd.
DOI:
10.3850/978-981-18-2016-8_263-c
Autores:
Mumpy Das, Robert Vogt-Ardatjew, Barbel van den Berg, Frank Leferink
Publicado en:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020, Página(s) 676-680, ISBN 978-1-7281-7430-3
Editor:
IEEE
DOI:
10.1109/emcsi38923.2020.9191637
Autores:
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Publicado en:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Editor:
IEEE
DOI:
10.1109/emcsi39492.2022.9889626
Autores:
Arunkumar H. Venkateshaiah, Haiyan Xie, John F. Dawson, Andrew C. Marvin, Linda Dawson, Martin P. Robinson
Publicado en:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Página(s) 1-6, ISBN 978-1-7281-5579-1
Editor:
IEEE
DOI:
10.1109/emceurope48519.2020.9245804
Autores:
P Memar, J Vankeirsbilck, D Vanoost, T Holvoet, J Boydens
Publicado en:
IEEE International Symposium on Electromagnetic Compatibility (EMC), 2022
Editor:
IEEE
DOI:
10.1109/emcsi39492.2022.9889646
Autores:
Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Publicado en:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Editor:
IEEE Xplore
DOI:
10.1109/emceurope51680.2022.9901309
Autores:
Zhao CHEN, Tim Claeys, Ronny Deseine, Davy Pissoort
Publicado en:
EMC+SIPI 2021 Virtual Symposium, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559267
Autores:
P. Memar, H. Habib, Z. Chen, D. Vanoost, R. Vogt-Ardatjew, B. van den Berg, T. Holvoet, D. Pissoort, J. Boydens
Publicado en:
2022 International Symposium on Electromagnetic Compatibility–EMC Europe, 2022
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9901094
Autores:
Mumpy Das, Robert Vogt-Ardatjew, Frank Leferink
Publicado en:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Editor:
IEEE Xplore
DOI:
10.1109/emcsi39492.2022.9889589
Autores:
H. Tang, A. H. Venkateshaiah, J. F. Dawson, A. C. Marvin, M. P. Robinson and J. Ge
Publicado en:
IEEE Int. Joint EMC/SI/PI and EMC Europe Symp, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559238
Autores:
Q. M. Khan, A. Ramezani, M. Koohestani, M. Ramdani, R. Perdriau
Publicado en:
13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022
Editor:
IEEE Xplore
DOI:
10.1109/emccompo52133.2022.9758599
Autores:
Mumpy Das, Silvo Jeunink, Robert Vogt-Ardatjew, Barbel van den Berg, Frank Leferink
Publicado en:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Página(s) 1-6, ISBN 978-1-7281-5579-1
Editor:
IEEE
DOI:
10.1109/emceurope48519.2020.9245878
Autores:
N. Omollo, R. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Publicado en:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Editor:
IEEE
DOI:
10.1109/emcsi39492.2022.9889312
Autores:
T. Claeys, H. Tirmizi, H. Habib, D. Vanoost, G. Vandenbosch, D. Pissoort
Publicado en:
2021 Joint IEEE Symposium on EMC+SIPI and EMC Europe, 2021
Editor:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559314
Autores:
Hasan Habib, Tim Claeys, Robert Vogt-Ardatjew, Bärbel van den Berg, Guy A. E. Vandenbosch, Davy Pissoort
Publicado en:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición 20+, 2022
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9901010
Autores:
F. R. Arduini, M. Suhrke, T. Pusch and H. Garbe
Publicado en:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2022
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9901132
Autores:
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Publicado en:
2022 ESA Workshop on Aerospace EMC (Aerospace EMC), 2022
Editor:
IEEE
DOI:
10.23919/aerospaceemc54301.2022.9828833
Autores:
Zhao Chen, Johan Catrysse, Ronny Deseine, Tim Claeys, Davy Pissoort
Publicado en:
2022 XXXI International Scientific Conference Electronics (ET), 2022
Editor:
IEEE
DOI:
10.1109/et55967.2022.9920274
Autores:
P. Memar, J. Vankeirsbilck, D. Vanoost, T. Claeys, D. Pissoort, J. Boydens
Publicado en:
Electronics, Edición 11(9), 2022, Página(s) 1292, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics11091292
Autores:
Q. M. Khan, R. Perdriau, M. Ramdani, M. Koohestani
Publicado en:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, Edición vol.4, no. 2, 2022, Página(s) pp 25-30, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2022.3163963
Autores:
Q. M. Khan, M. Koohestani, J. -L. Levant, M. Ramdani, R. Perdriau
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, 2023, ISSN 1558-187X
Editor:
IEEE
DOI:
10.1109/temc.2023.3253385
Autores:
L. Devaraj, A. R. Ruddle, A. P. Duffy
Publicado en:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, Edición Volume: 2, Edición: 4, Dec. 2020, 2020, Página(s) 96 - 100, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2020.3017483
Autores:
V. Gkatsi, R. Vogt-Ardatjew, and F. Leferink
Publicado en:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2023.3284232
Autores:
L. Devaraj, Q. M. Khan, A. R. Ruddle, A. P. Duffy, R. Perdriau and M. Koohestani
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, Edición 64 (6), 2022, Página(s) 2067-2079, ISSN 1558-187X
Editor:
IEEE
DOI:
10.1109/temc.2022.3211458
Autores:
Habib, H., Claeys, T., Vandenbosch, G., Pissoort, D.
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, Edición Volume: 65, Edición: 2, April 2023, 2023, Página(s) 595-598, ISSN 1558-187X
Editor:
IEEE
DOI:
10.1109/temc.2022.3228822
Autores:
Z. Chen, T. Claeys, R. Deseine, J. Catrysse and D. Pissoort
Publicado en:
EEE Letters on Electromagnetic Compatibility Practice and Applications, Edición 2023, 2023, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2023.3286727
Autores:
O. Leppäaho, F. Lafon, P. Fernández-López, M. Stojanovic, T. Claeys, R. Perdriau, M. Ramdani
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, Edición Volume: 65, Edición: 2, April 2023, 2023, Página(s) 395-405, ISSN 0018-9375
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2023.3244061
Autores:
Q. M. Khan, L. Devaraj, M. Koohestani, A. R. Ruddle, M. Ramdani, R. Perdriau
Publicado en:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2022, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2022.3175433
Autores:
Q. M. Khan, M. Koohestani, R. Perdriau
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, 2022, ISSN 1558-187X
Editor:
IEEE
DOI:
10.1109/temc.2022.3225540
Autores:
F. R. Arduini, M. Lanzrath, S. Ghosalkar, A. Nateghi, S. Fisahn and M. Schaarschmidt
Publicado en:
Advances in Radio Science, 2023, ISSN 1684-9973
Editor:
Copernicus
DOI:
10.5194/ars-20-131-2023
Autores:
Q. M. Khan, L. Devaraj, R. Perdriau, A. R. Ruddle, T. Claeys, M. Ramdani, M. Koohestani
Publicado en:
IEEE Access, Edición vol.10, 2022, Página(s) pp. 83898-83915, ISSN 2169-3536
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2022.3197659
Autores:
Habib, H., Claeys, T., Vandenbosch, G., Pissoort, D.
Publicado en:
IEEE Access, Edición IEEE Access ( Volume: 11), 2023, Página(s) 72537-72551, ISSN 2169-3536
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2023.3296095
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