Deliverables
Experimentally validated EMI-aware IEC61508 techniques and measures
Unified ISO26262 electromagnetic risk analysis approach for functional safety and cyber-security
Unified ISO26262 electromagnetic risk analysis approach for functional safety andcyber-security
Scientific articles: 2 proceedings & 2 journal papers/ESRRisk-based EMI certification report of real-life maritime application
Validated IC-EM and IC-IM models including environmental stress and ageing
Public engagement: 2/ESR
Public engagement: 2/ESR (see 2.3.1 for complete overview)
EMI Risk Management Plan for two real-life environmentsIntegrated Circuit to measure absorbed energy
Validated statistical methodology to estimate coupling into enclosure or device
Description methodology for risk prediction from IC to system level
Validation report electromagnetic risk assessment methodologies
Basic description statistical electromagnetic risk assessment
Guidelines for electromagnetic protection of critical infrastructures
Flow-diagram for an EMI-aware safety case
EMI fault-tolerant automotive IC
Dedicated EMI Risk Management and Design Plan for display systems in medical environment
EMI-aware risk identification and assessment of vehicular communication systems
PETER Special Session at the Safety Critical Systems Symposium
PETER special sessions/workshops IIIPETER Workshop at Joint IEEE EMC Symposium
PETER Training School IVPETER Training School III
PETER Training School II
PETER special sessions/workshops V
PETER Workshop at the IET International Conference on Systems Safety and Cyber-Security
PETER special sessions/workshops IIPETER Workshop at the EMC Europe Symposium
PETER Kick-Off Meeting/PETER Training School IPETER Training School V
PETER special sessions/workshops IV
PETER Special Session at the EMC Compo Conference
Project website (www.etn-peter.eu)
Publications
Author(s):
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9900924
Author(s):
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559385
Author(s):
F. R. Arduini, M. Lanzrath, T. Pusch, M. Suhrke and H. Garbe
Published in:
IEEE Int. Joint EMC/SI/PI and EMC Europe Symp., 2021, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559348
Author(s):
P. Memar, J. Vankeirsbilck, D. Vanoost, T. Holvoet, J. Boydens
Published in:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559336
Author(s):
Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher:
IEEE Xplore
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559356
Author(s):
A. Nateghi, M. Schaarschmidt, S. Fisahn, H. Garbe
Published in:
Asia-Pacific Int. Symp. On Electromagnetic Compatibility (APEMC), 2021
Publisher:
IEEE
DOI:
10.1109/apemc49932.2021.9596789
Author(s):
Hasan Habib, Tin Claeys, Richard Perdriau. Davy, Pissoort
Published in:
International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Issue 13, 2022
Publisher:
IEEE
DOI:
10.1109/emccompo52133.2022.9758598
Author(s):
M. Tishehzan, M. Nicholson, and J. F. Dawson
Published in:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2023, 2023
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274226
Author(s):
Hasan Habib, Tim Claeys, Dries Vanoost, Guy A. E. Vandenbosch, Davy Pissoort
Published in:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Issue 23-25 Sept. 2020, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher:
IEEE
DOI:
10.1109/emceurope48519.2020.9245715
Author(s):
A. Ramezani, Q. M. Khan, H. Pues
Published in:
13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022
Publisher:
IEEE Xplore
DOI:
10.1109/emccompo52133.2022.9758617
Author(s):
F. R. Arduini, A. Nateghi, M. Schaarschmidt, M. Lanzrath and M. Suhrke
Published in:
EMV Kongress 2022. Aachen, 2022
Publisher:
Apprimus
DOI:
10.15488/12553
Author(s):
A. Nateghi, M. Schaarschmidt, S. Fisahn, H. Garbe
Published in:
IEEE Int. Joint EMC/SI/PI and EMC Europe Symposium, 2021, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559200
Author(s):
Mohammad Tishehzan; Mark Nicholson; John F. Dawson; Davy Pissoort
Published in:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2022
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9900989
Author(s):
Lokesh Devaraj, Alastair R. Ruddle, Alistair P. Duffy
Published in:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher:
IEEE
DOI:
10.1109/emceurope48519.2020.9245692
Author(s):
N. Omollo, R. A. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Published in:
Int. Symp. On Electromagnetic Compatibility (EMC Europe), 2020
Publisher:
IEEE
DOI:
10.1109/emceurope48519.2020.9245796
Author(s):
Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in:
2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021
Publisher:
IEEE Xplore
DOI:
10.1109/apemc49932.2021.9596842
Author(s):
Q. M. Khan, R. Perdriau, M. Ramdani, M. Koohestani
Published in:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher:
IEEE Xplore
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559242
Author(s):
N. Omollo, R. Vogt-Ardatjes, J. K. van der Ven, F. Leferink
Published in:
Asia-Pacific Int. Symp. On Electromagnetic Compatibility (APEMC), 2021
Publisher:
IEEE
DOI:
10.1109/apemc49932.2021.9596817
Author(s):
N. Omollo, J. K. van der Ven, R. A. Vogt-Ardatjew, F. Leferink
Published in:
IEEE Int. Symp. On Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020
Publisher:
IEEE
DOI:
10.1109/emcsi38923.2020.9191557
Author(s):
Lokesh Devaraj, Alastair R. Ruddle, Alistair P. Duffy and Anthony J. M. Martin
Published in:
Proceedings of 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, Page(s) pp. 760-764
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559243
Author(s):
Lokesh Devaraj, Alastair R. Ruddle and Alistair P. Duffy
Published in:
Proceedings of 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, Page(s) 851-856
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559291
Author(s):
A. Nateghi, N. Moonen, M. Schaarschmidt, S. Fisahn, H. Garbe
Published in:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher:
IEEE
DOI:
10.1109/emcsi39492.2022.9889619
Author(s):
Lokesh Devaraj, Alastair R. Ruddle, Qazi Mashaal Khan, Alistair P. Duffy
Published in:
Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Page(s) 1867-1874, ISBN 978-981-18-2016-8
Publisher:
Research Publishing Services
DOI:
10.3850/978-981-18-2016-8_203-cd
Author(s):
Z. Chen, T. Claeys, J. Catrysse and D. Pissoort,
Published in:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2023., 2023
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274381
Author(s):
Qazi Mashaal Khan, Mohsen Koohestani, Mohamed Ramdani, Richard Perdriau
Published in:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher:
IEEE
DOI:
10.1109/emceurope48519.2020.9245783
Author(s):
R. Aba, V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in:
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023
Publisher:
IEEE
DOI:
10.1109/gemccon57842.2023.10078197
Author(s):
O. Leppäaho, F. Lafon, B. Ferreri, P. Fernandez-Lopez, M. Stojanovic, R. Perdriau, M. Ramdani
Published in:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9901089
Author(s):
O. Leppäaho, F. Lafon, P. Fernandez-Lopez, M. Stojanovic, R. Perdriau, M. Ramdani
Published in:
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Issue 26 July-13 Aug. 2021, 2021, Page(s) 917-921
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559176
Author(s):
F. R. Arduini, CJJ van der Ven, M. Lanzrath, M. Suhrke
Published in:
International Ship Control Systems Symposium, 2022
Publisher:
IMarEST
DOI:
10.24868/10723
Author(s):
Hasan Habib, Tim Claeys, Jonas Lannoo, Dries Vanoost, Guy A. E. Vandenbosch, Davy Pissoort
Published in:
2020 XXIX International Scientific Conference Electronics (ET), Issue 16-18 Sept. 2020, 2020, Page(s) 1-4, ISBN 978-1-7281-7426-6
Publisher:
IEEE
DOI:
10.1109/et50336.2020.9238167
Author(s):
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in:
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023
Publisher:
IEEE
DOI:
10.1109/gemccon57842.2023.10078199
Author(s):
Lokesh Devaraj, Alastair R. Ruddle, Qazi Mashaal Khan, Alistair P. Duff
Published in:
Proceedings of 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022, Page(s) 107-111
Publisher:
IEEE
DOI:
10.1109/emccompo52133.2022.9758612
Author(s):
O. Leppäaho, M. Nicholson, F. Lafon, M. Ramdani
Published in:
31st European Safety and Reliability Conference, Issue 22/09/2021, 2021, Page(s) 1859-1866
Publisher:
Research Publishing (S) Pte Ltd.
DOI:
10.3850/978-981-18-2016-8_263-c
Author(s):
Mumpy Das, Robert Vogt-Ardatjew, Barbel van den Berg, Frank Leferink
Published in:
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020, Page(s) 676-680, ISBN 978-1-7281-7430-3
Publisher:
IEEE
DOI:
10.1109/emcsi38923.2020.9191637
Author(s):
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher:
IEEE
DOI:
10.1109/emcsi39492.2022.9889626
Author(s):
Arunkumar H. Venkateshaiah, Haiyan Xie, John F. Dawson, Andrew C. Marvin, Linda Dawson, Martin P. Robinson
Published in:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher:
IEEE
DOI:
10.1109/emceurope48519.2020.9245804
Author(s):
P Memar, J Vankeirsbilck, D Vanoost, T Holvoet, J Boydens
Published in:
IEEE International Symposium on Electromagnetic Compatibility (EMC), 2022
Publisher:
IEEE
DOI:
10.1109/emcsi39492.2022.9889646
Author(s):
Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Publisher:
IEEE Xplore
DOI:
10.1109/emceurope51680.2022.9901309
Author(s):
Zhao CHEN, Tim Claeys, Ronny Deseine, Davy Pissoort
Published in:
EMC+SIPI 2021 Virtual Symposium, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559267
Author(s):
P. Memar, H. Habib, Z. Chen, D. Vanoost, R. Vogt-Ardatjew, B. van den Berg, T. Holvoet, D. Pissoort, J. Boydens
Published in:
2022 International Symposium on Electromagnetic Compatibility–EMC Europe, 2022
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9901094
Author(s):
Mumpy Das, Robert Vogt-Ardatjew, Frank Leferink
Published in:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher:
IEEE Xplore
DOI:
10.1109/emcsi39492.2022.9889589
Author(s):
H. Tang, A. H. Venkateshaiah, J. F. Dawson, A. C. Marvin, M. P. Robinson and J. Ge
Published in:
IEEE Int. Joint EMC/SI/PI and EMC Europe Symp, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559238
Author(s):
Q. M. Khan, A. Ramezani, M. Koohestani, M. Ramdani, R. Perdriau
Published in:
13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022
Publisher:
IEEE Xplore
DOI:
10.1109/emccompo52133.2022.9758599
Author(s):
Mumpy Das, Silvo Jeunink, Robert Vogt-Ardatjew, Barbel van den Berg, Frank Leferink
Published in:
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher:
IEEE
DOI:
10.1109/emceurope48519.2020.9245878
Author(s):
N. Omollo, R. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Published in:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher:
IEEE
DOI:
10.1109/emcsi39492.2022.9889312
Author(s):
T. Claeys, H. Tirmizi, H. Habib, D. Vanoost, G. Vandenbosch, D. Pissoort
Published in:
2021 Joint IEEE Symposium on EMC+SIPI and EMC Europe, 2021
Publisher:
IEEE
DOI:
10.1109/emc/si/pi/emceurope52599.2021.9559314
Author(s):
Hasan Habib, Tim Claeys, Robert Vogt-Ardatjew, Bärbel van den Berg, Guy A. E. Vandenbosch, Davy Pissoort
Published in:
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue 20+, 2022
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9901010
Author(s):
F. R. Arduini, M. Suhrke, T. Pusch and H. Garbe
Published in:
Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2022
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9901132
Author(s):
V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in:
2022 ESA Workshop on Aerospace EMC (Aerospace EMC), 2022
Publisher:
IEEE
DOI:
10.23919/aerospaceemc54301.2022.9828833
Author(s):
Zhao Chen, Johan Catrysse, Ronny Deseine, Tim Claeys, Davy Pissoort
Published in:
2022 XXXI International Scientific Conference Electronics (ET), 2022
Publisher:
IEEE
DOI:
10.1109/et55967.2022.9920274
Author(s):
P. Memar, J. Vankeirsbilck, D. Vanoost, T. Claeys, D. Pissoort, J. Boydens
Published in:
Electronics, Issue 11(9), 2022, Page(s) 1292, ISSN 2079-9292
Publisher:
MDPI
DOI:
10.3390/electronics11091292
Author(s):
Q. M. Khan, R. Perdriau, M. Ramdani, M. Koohestani
Published in:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, Issue vol.4, no. 2, 2022, Page(s) pp 25-30, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2022.3163963
Author(s):
Q. M. Khan, M. Koohestani, J. -L. Levant, M. Ramdani, R. Perdriau
Published in:
IEEE Transactions on Electromagnetic Compatibility, 2023, ISSN 1558-187X
Publisher:
IEEE
DOI:
10.1109/temc.2023.3253385
Author(s):
L. Devaraj, A. R. Ruddle, A. P. Duffy
Published in:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, Issue Volume: 2, Issue: 4, Dec. 2020, 2020, Page(s) 96 - 100, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2020.3017483
Author(s):
V. Gkatsi, R. Vogt-Ardatjew, and F. Leferink
Published in:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2023.3284232
Author(s):
L. Devaraj, Q. M. Khan, A. R. Ruddle, A. P. Duffy, R. Perdriau and M. Koohestani
Published in:
IEEE Transactions on Electromagnetic Compatibility, Issue 64 (6), 2022, Page(s) 2067-2079, ISSN 1558-187X
Publisher:
IEEE
DOI:
10.1109/temc.2022.3211458
Author(s):
Habib, H., Claeys, T., Vandenbosch, G., Pissoort, D.
Published in:
IEEE Transactions on Electromagnetic Compatibility, Issue Volume: 65, Issue: 2, April 2023, 2023, Page(s) 595-598, ISSN 1558-187X
Publisher:
IEEE
DOI:
10.1109/temc.2022.3228822
Author(s):
Z. Chen, T. Claeys, R. Deseine, J. Catrysse and D. Pissoort
Published in:
EEE Letters on Electromagnetic Compatibility Practice and Applications, Issue 2023, 2023, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2023.3286727
Author(s):
O. Leppäaho, F. Lafon, P. Fernández-López, M. Stojanovic, T. Claeys, R. Perdriau, M. Ramdani
Published in:
IEEE Transactions on Electromagnetic Compatibility, Issue Volume: 65, Issue: 2, April 2023, 2023, Page(s) 395-405, ISSN 0018-9375
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2023.3244061
Author(s):
Q. M. Khan, L. Devaraj, M. Koohestani, A. R. Ruddle, M. Ramdani, R. Perdriau
Published in:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2022, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2022.3175433
Author(s):
Q. M. Khan, M. Koohestani, R. Perdriau
Published in:
IEEE Transactions on Electromagnetic Compatibility, 2022, ISSN 1558-187X
Publisher:
IEEE
DOI:
10.1109/temc.2022.3225540
Author(s):
F. R. Arduini, M. Lanzrath, S. Ghosalkar, A. Nateghi, S. Fisahn and M. Schaarschmidt
Published in:
Advances in Radio Science, 2023, ISSN 1684-9973
Publisher:
Copernicus
DOI:
10.5194/ars-20-131-2023
Author(s):
Q. M. Khan, L. Devaraj, R. Perdriau, A. R. Ruddle, T. Claeys, M. Ramdani, M. Koohestani
Published in:
IEEE Access, Issue vol.10, 2022, Page(s) pp. 83898-83915, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2022.3197659
Author(s):
Habib, H., Claeys, T., Vandenbosch, G., Pissoort, D.
Published in:
IEEE Access, Issue IEEE Access ( Volume: 11), 2023, Page(s) 72537-72551, ISSN 2169-3536
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2023.3296095
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