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CORDIS - EU research results
CORDIS

Pan-European Training, research and education network on Electromagnetic Risk management

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Overview of EMI-relevant IEC61508 techniques & measures (opens in new window)
Experimentally validated EMI-aware IEC61508 techniques and measures (opens in new window)
Unified ISO26262 electromagnetic risk analysis approach for functional safety and cyber-security (opens in new window)

Unified ISO26262 electromagnetic risk analysis approach for functional safety andcyber-security

Scientific articles: 2 proceedings & 2 journal papers/ESR (opens in new window)
Risk-based EMI certification report of real-life maritime application (opens in new window)
Validated IC-EM and IC-IM models including environmental stress and ageing (opens in new window)
Public engagement: 2/ESR (opens in new window)

Public engagement: 2/ESR (see 2.3.1 for complete overview)

EMI Risk Management Plan for two real-life environments (opens in new window)
Integrated Circuit to measure absorbed energy (opens in new window)
Validated statistical methodology to estimate coupling into enclosure or device (opens in new window)
Description methodology for risk prediction from IC to system level (opens in new window)
Validation report electromagnetic risk assessment methodologies (opens in new window)
Basic description statistical electromagnetic risk assessment (opens in new window)
Guidelines for electromagnetic protection of critical infrastructures (opens in new window)
Flow-diagram for an EMI-aware safety case (opens in new window)
EMI fault-tolerant automotive IC (opens in new window)
Dedicated EMI Risk Management and Design Plan for display systems in medical environment (opens in new window)
EMI-aware risk identification and assessment of vehicular communication systems (opens in new window)

Publications

Study of Random Field Coupling onto a Scooter following the Risk-based EMC Approach (opens in new window)

Author(s): V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in: 2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Publisher: IEEE
DOI: 10.1109/emceurope51680.2022.9900924

Risk-based EMC System Analysis Platform of Automotive Environments (opens in new window)

Author(s): V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559385

A Methodology for Estimating the Criticality of Energy Infrastructures in the Context of IEMI (opens in new window)

Author(s): F. R. Arduini, M. Lanzrath, T. Pusch, M. Suhrke and H. Garbe
Published in: IEEE Int. Joint EMC/SI/PI and EMC Europe Symp., 2021, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559348

Resilience of Reed-Solomon Codes Against Harsh Electromagnetic Disturbances: Influence of Over-Voltage Detection (opens in new window)

Author(s): P. Memar, J. Vankeirsbilck, D. Vanoost, T. Holvoet, J. Boydens
Published in: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559336

Time-efficient EMI Risk Evaluation Method in a Hospital Environment (opens in new window)

Author(s): Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher: IEEE Xplore
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559356

Susceptibility of Power Line Communication (PLC) Channel to DS, AM and Jamming Intentional Electromagnetic Interferences (opens in new window)

Author(s): A. Nateghi, M. Schaarschmidt, S. Fisahn, H. Garbe
Published in: Asia-Pacific Int. Symp. On Electromagnetic Compatibility (APEMC), 2021
Publisher: IEEE
DOI: 10.1109/apemc49932.2021.9596789

Digital and Analogue Hardware Design of an On-Board EMI Detector (opens in new window)

Author(s): Hasan Habib, Tin Claeys, Richard Perdriau. Davy, Pissoort
Published in: International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Issue 13, 2022
Publisher: IEEE
DOI: 10.1109/emccompo52133.2022.9758598

Definition And Characterization Of An Electromagnetic Operational Domain Model (opens in new window)

Author(s): M. Tishehzan, M. Nicholson, and J. F. Dawson
Published in: Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2023, 2023
Publisher: IEEE
DOI: 10.1109/emceurope57790.2023.10274226

Development of an EMI Detector Based on an Inverted Data Pair with Reduced Number of False Negatives (opens in new window)

Author(s): Hasan Habib, Tim Claeys, Dries Vanoost, Guy A. E. Vandenbosch, Davy Pissoort
Published in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Issue 23-25 Sept. 2020, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher: IEEE
DOI: 10.1109/emceurope48519.2020.9245715

A new TRL/TRM PCB-based Calibration Method for On-Board Devices Under Test (DUTs) (opens in new window)

Author(s): A. Ramezani, Q. M. Khan, H. Pues
Published in: 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022
Publisher: IEEE Xplore
DOI: 10.1109/emccompo52133.2022.9758617

IEMI Vulnerability Analysis for Different Smart Grid-enabled Devices (opens in new window)

Author(s): F. R. Arduini, A. Nateghi, M. Schaarschmidt, M. Lanzrath and M. Suhrke
Published in: EMV Kongress 2022. Aachen, 2022
Publisher: Apprimus
DOI: 10.15488/12553

Vulnerability of Wireless Smart Meter to Electromagnetic Interference Sweep Frequency Jamming Signals (opens in new window)

Author(s): A. Nateghi, M. Schaarschmidt, S. Fisahn, H. Garbe
Published in: IEEE Int. Joint EMC/SI/PI and EMC Europe Symposium, 2021, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559200

Providing Assurance that Risks Associated with Electromagnetic Disturbances are Sufficiently Managed (opens in new window)

Author(s): Mohammad Tishehzan; Mark Nicholson; John F. Dawson; Davy Pissoort
Published in: Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2022
Publisher: IEEE
DOI: 10.1109/emceurope51680.2022.9900989

System Level Risk Analysis for Immunity in Automotive Functional Safety Analyses (opens in new window)

Author(s): Lokesh Devaraj, Alastair R. Ruddle, Alistair P. Duffy
Published in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher: IEEE
DOI: 10.1109/emceurope48519.2020.9245692

EMI Aspects of Low Voltage Power Distribution Systems for Ships (opens in new window)

Author(s): N. Omollo, R. A. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Published in: Int. Symp. On Electromagnetic Compatibility (EMC Europe), 2020
Publisher: IEEE
DOI: 10.1109/emceurope48519.2020.9245796

Studying the Probability of EMI through Time-Variance Behavior of Environment on Medical Devices (opens in new window)

Author(s): Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in: 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021
Publisher: IEEE Xplore
DOI: 10.1109/apemc49932.2021.9596842

A Comparative Study of On-Chip CMOS S&H Voltage Sensors for Power Integrity: SOI vs. Bulk (opens in new window)

Author(s): Q. M. Khan, R. Perdriau, M. Ramdani, M. Koohestani
Published in: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021
Publisher: IEEE Xplore
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559242

Investigating the EMC Performance of a Matrix Converter and Measures to Improve It (opens in new window)

Author(s): N. Omollo, R. Vogt-Ardatjes, J. K. van der Ven, F. Leferink
Published in: Asia-Pacific Int. Symp. On Electromagnetic Compatibility (APEMC), 2021
Publisher: IEEE
DOI: 10.1109/apemc49932.2021.9596817

Determining the Electromagnetic Environment on Board Ships for Risk-based Approach EMC Analysis (opens in new window)

Author(s): N. Omollo, J. K. van der Ven, R. A. Vogt-Ardatjew, F. Leferink
Published in: IEEE Int. Symp. On Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020
Publisher: IEEE
DOI: 10.1109/emcsi38923.2020.9191557

Risk assessment approach for EM resilience in complex systems using Bayesian Networks (opens in new window)

Author(s): Lokesh Devaraj, Alastair R. Ruddle, Alistair P. Duffy and Anthony J. M. Martin
Published in: Proceedings of 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, Page(s) pp. 760-764
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559243

EMI risk estimation for system-level functions using probabilistic graphical models (opens in new window)

Author(s): Lokesh Devaraj, Alastair R. Ruddle and Alistair P. Duffy
Published in: Proceedings of 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 2021, Page(s) 851-856
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559291

Effects of the MHz Frequency Range Electromagnetic Immunity of the Swept Frequency Pulse Coupled on the kHz Frequency Range G3 Power Line Communication (opens in new window)

Author(s): A. Nateghi, N. Moonen, M. Schaarschmidt, S. Fisahn, H. Garbe
Published in: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher: IEEE
DOI: 10.1109/emcsi39492.2022.9889619

Knowledge-based approach for system level electromagnetic safety analysis (opens in new window)

Author(s): Lokesh Devaraj, Alastair R. Ruddle, Qazi Mashaal Khan, Alistair P. Duffy
Published in: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Page(s) 1867-1874, ISBN 978-981-18-2016-8
Publisher: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_203-cd

Investigation of the Mechanisms behind EMI Issues caused by Ready-Made Connecting Devices in Electronic Systems (opens in new window)

Author(s): Z. Chen, T. Claeys, J. Catrysse and D. Pissoort,
Published in: Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2023., 2023
Publisher: IEEE
DOI: 10.1109/emceurope57790.2023.10274381

Obsolescence in EMC Risk Assessment: A Case Study on EFT Immunity of Microcontrollers (opens in new window)

Author(s): Qazi Mashaal Khan, Mohsen Koohestani, Mohamed Ramdani, Richard Perdriau
Published in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher: IEEE
DOI: 10.1109/emceurope48519.2020.9245783

Electromagnetic Environment Measurement Procedure for a Moving Car (opens in new window)

Author(s): R. Aba, V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in: 2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023
Publisher: IEEE
DOI: 10.1109/gemccon57842.2023.10078197

Including Experimental Aging of Shielded Cables into Bulk Current Injection Simulations (opens in new window)

Author(s): O. Leppäaho, F. Lafon, B. Ferreri, P. Fernandez-Lopez, M. Stojanovic, R. Perdriau, M. Ramdani
Published in: 2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Publisher: IEEE
DOI: 10.1109/emceurope51680.2022.9901089

Sensitivity of Shielded Cable Transfer Impedance Measurement to Triaxial Cell Diameter (opens in new window)

Author(s): O. Leppäaho, F. Lafon, P. Fernandez-Lopez, M. Stojanovic, R. Perdriau, M. Ramdani
Published in: 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Issue 26 July-13 Aug. 2021, 2021, Page(s) 917-921
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559176

The threat of Intentional Electromagnetic Interference to Maritime Vessels (opens in new window)

Author(s): F. R. Arduini, CJJ van der Ven, M. Lanzrath, M. Suhrke
Published in: International Ship Control Systems Symposium, 2022
Publisher: IMarEST
DOI: 10.24868/10723

Implementation of Inverted-Pair EMI Detector using a Monte-Carlo Based Simulation Framework (opens in new window)

Author(s): Hasan Habib, Tim Claeys, Jonas Lannoo, Dries Vanoost, Guy A. E. Vandenbosch, Davy Pissoort
Published in: 2020 XXIX International Scientific Conference Electronics (ET), Issue 16-18 Sept. 2020, 2020, Page(s) 1-4, ISBN 978-1-7281-7426-6
Publisher: IEEE
DOI: 10.1109/et50336.2020.9238167

Detection of EMI Issues Caused by Differential-Mode Voltages on an Electric Scooter (opens in new window)

Author(s): V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in: 2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023
Publisher: IEEE
DOI: 10.1109/gemccon57842.2023.10078199

Comparing simulated impact of single frequency and multitone EMI for an integrated circuit (opens in new window)

Author(s): Lokesh Devaraj, Alastair R. Ruddle, Qazi Mashaal Khan, Alistair P. Duff
Published in: Proceedings of 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022, Page(s) 107-111
Publisher: IEEE
DOI: 10.1109/emccompo52133.2022.9758612

Assuring Shielded Cables as EMI Mitigation in Automotive ADAS (opens in new window)

Author(s): O. Leppäaho, M. Nicholson, F. Lafon, M. Ramdani
Published in: 31st European Safety and Reliability Conference, Issue 22/09/2021, 2021, Page(s) 1859-1866
Publisher: Research Publishing (S) Pte Ltd.
DOI: 10.3850/978-981-18-2016-8_263-c

Risk-based EMC Approach in Hospital Environment (opens in new window)

Author(s): Mumpy Das, Robert Vogt-Ardatjew, Barbel van den Berg, Frank Leferink
Published in: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020, Page(s) 676-680, ISBN 978-1-7281-7430-3
Publisher: IEEE
DOI: 10.1109/emcsi38923.2020.9191637

On-Site Automotive Environment Measurements for a Risk-based EMC Approach (opens in new window)

Author(s): V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher: IEEE
DOI: 10.1109/emcsi39492.2022.9889626

Coupling of Energy Into PCB Traces in a Reverberant Environment: Absorption Cross-section and Probability of Susceptibility (opens in new window)

Author(s): Arunkumar H. Venkateshaiah, Haiyan Xie, John F. Dawson, Andrew C. Marvin, Linda Dawson, Martin P. Robinson
Published in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher: IEEE
DOI: 10.1109/emceurope48519.2020.9245804

Resilience of Reed-Solomon Codes Against Single-Frequency Electromagnetic Disturbances: Fault Elimination Through Encoder Tuning (opens in new window)

Author(s): P Memar, J Vankeirsbilck, D Vanoost, T Holvoet, J Boydens
Published in: IEEE International Symposium on Electromagnetic Compatibility (EMC), 2022
Publisher: IEEE
DOI: 10.1109/emcsi39492.2022.9889646

Risk Management Plan For the Hospital Environment (opens in new window)

Author(s): Mumpy Das, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in: 2022 International Symposium on Electromagnetic Compatibility – EMC Europe, 2022
Publisher: IEEE Xplore
DOI: 10.1109/emceurope51680.2022.9901309

Mutual Influence Of Cavity Resonances Of A Shielding Enclosure On The Resonance Of A Dipole Inside That Enclosure (opens in new window)

Author(s): Zhao CHEN, Tim Claeys, Ronny Deseine, Davy Pissoort
Published in: EMC+SIPI 2021 Virtual Symposium, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559267

Effectiveness of Forward Error Corrections Over Different Wired Communication Channels in Harsh Electromagnetic Environments (opens in new window)

Author(s): P. Memar, H. Habib, Z. Chen, D. Vanoost, R. Vogt-Ardatjew, B. van den Berg, T. Holvoet, D. Pissoort, J. Boydens
Published in: 2022 International Symposium on Electromagnetic Compatibility–EMC Europe, 2022
Publisher: IEEE
DOI: 10.1109/emceurope51680.2022.9901094

Risk-based EMC Approach for the Ship's Semi enclosed Reverberant Indoor Environment to evaluate EMI generated by Wireless Devices (opens in new window)

Author(s): Mumpy Das, Robert Vogt-Ardatjew, Frank Leferink
Published in: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher: IEEE Xplore
DOI: 10.1109/emcsi39492.2022.9889589

Analysis and Estimation of Electromagnetic Energy Coupled into IC packages (opens in new window)

Author(s): H. Tang, A. H. Venkateshaiah, J. F. Dawson, A. C. Marvin, M. P. Robinson and J. Ge
Published in: IEEE Int. Joint EMC/SI/PI and EMC Europe Symp, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559238

A Comparison Among DPI Immunities of Multi-Stage CSVCOs and Ring Oscillators (opens in new window)

Author(s): Q. M. Khan, A. Ramezani, M. Koohestani, M. Ramdani, R. Perdriau
Published in: 13th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2022
Publisher: IEEE Xplore
DOI: 10.1109/emccompo52133.2022.9758599

Introduction of Wireless Services and Devices in a Hospital Environment Following a Risk-based EMC Approach (opens in new window)

Author(s): Mumpy Das, Silvo Jeunink, Robert Vogt-Ardatjew, Barbel van den Berg, Frank Leferink
Published in: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020, Page(s) 1-6, ISBN 978-1-7281-5579-1
Publisher: IEEE
DOI: 10.1109/emceurope48519.2020.9245878

Electromagnetic Interference Risk Assessment for the Use of LED Lights on Board of Ships (opens in new window)

Author(s): N. Omollo, R. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Published in: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022
Publisher: IEEE
DOI: 10.1109/emcsi39492.2022.9889312

A System’s Perspective on the Use of EMI Detection and Correction Methods in Safety Critical Systems (opens in new window)

Author(s): T. Claeys, H. Tirmizi, H. Habib, D. Vanoost, G. Vandenbosch, D. Pissoort
Published in: 2021 Joint IEEE Symposium on EMC+SIPI and EMC Europe, 2021
Publisher: IEEE
DOI: 10.1109/emc/si/pi/emceurope52599.2021.9559314

Combining Fast Field Probes with an EMI Detector to reveal Bit Errors induced by ElectroMagnetic Disturbances (opens in new window)

Author(s): Hasan Habib, Tim Claeys, Robert Vogt-Ardatjew, Bärbel van den Berg, Guy A. E. Vandenbosch, Davy Pissoort
Published in: 2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue 20+, 2022
Publisher: IEEE
DOI: 10.1109/emceurope51680.2022.9901010

Vulnerability of Smart Grid-based Protection Systems to Ultra-Wide Band IEMI Sources (opens in new window)

Author(s): F. R. Arduini, M. Suhrke, T. Pusch and H. Garbe
Published in: Int. Symp. on Electromagnetic Compatibility (EMC Europe), 2022
Publisher: IEEE
DOI: 10.1109/emceurope51680.2022.9901132

Evaluation of EM Vehicle Environment Measurement Methods for Risk-Based EMC Analysis (opens in new window)

Author(s): V. Gkatsi, R. Vogt-Ardatjew, F. Leferink
Published in: 2022 ESA Workshop on Aerospace EMC (Aerospace EMC), 2022
Publisher: IEEE
DOI: 10.23919/aerospaceemc54301.2022.9828833

Case Study of Electromagnetic Interference in Surgery Environment (opens in new window)

Author(s): Zhao Chen, Johan Catrysse, Ronny Deseine, Tim Claeys, Davy Pissoort
Published in: 2022 XXXI International Scientific Conference Electronics (ET), 2022
Publisher: IEEE
DOI: 10.1109/et55967.2022.9920274

Resilience of Reed-Solomon Codes against Single-Frequency Electromagnetic Disturbances: Fault Mechanisms and Fault Elimination through Symbol Inversion (opens in new window)

Author(s): P. Memar, J. Vankeirsbilck, D. Vanoost, T. Claeys, D. Pissoort, J. Boydens
Published in: Electronics, Issue 11(9), 2022, Page(s) 1292, ISSN 2079-9292
Publisher: MDPI
DOI: 10.3390/electronics11091292

A Comparative Performance Analysis of 6T & 9T SRAM Integrated Circuits: SOI vs. Bulk (opens in new window)

Author(s): Q. M. Khan, R. Perdriau, M. Ramdani, M. Koohestani
Published in: IEEE Letters on Electromagnetic Compatibility Practice and Applications, Issue vol.4, no. 2, 2022, Page(s) pp 25-30, ISSN 2637-6423
Publisher: IEEE
DOI: 10.1109/lemcpa.2022.3163963

Validation of IC Conducted Emission and Immunity Models Including Aging and Thermal Stress (opens in new window)

Author(s): Q. M. Khan, M. Koohestani, J. -L. Levant, M. Ramdani, R. Perdriau
Published in: IEEE Transactions on Electromagnetic Compatibility, 2023, ISSN 1558-187X
Publisher: IEEE
DOI: 10.1109/temc.2023.3253385

Electromagnetic Risk Analysis for EMI Impact on Functional Safety With Probabilistic Graphical Models and Fuzzy Logic (opens in new window)

Author(s): L. Devaraj, A. R. Ruddle, A. P. Duffy
Published in: IEEE Letters on Electromagnetic Compatibility Practice and Applications, Issue Volume: 2, Issue: 4, Dec. 2020, 2020, Page(s) 96 - 100, ISSN 2637-6423
Publisher: IEEE
DOI: 10.1109/lemcpa.2020.3017483

Fast and Curious: Exposure of EMI Vulnerability of an Electric Scooter for a Risk-based EMC Approach (opens in new window)

Author(s): V. Gkatsi, R. Vogt-Ardatjew, and F. Leferink
Published in: IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2023, ISSN 2637-6423
Publisher: IEEE
DOI: 10.1109/lemcpa.2023.3284232

Application of Probabilistic Models for Multitone Electromagnetic Immunity Analysis (opens in new window)

Author(s): L. Devaraj, Q. M. Khan, A. R. Ruddle, A. P. Duffy, R. Perdriau and M. Koohestani
Published in: IEEE Transactions on Electromagnetic Compatibility, Issue 64 (6), 2022, Page(s) 2067-2079, ISSN 1558-187X
Publisher: IEEE
DOI: 10.1109/temc.2022.3211458

Advanced Design of a Robust and Effective EMI Detector for Wired Communication Channels (opens in new window)

Author(s): Habib, H., Claeys, T., Vandenbosch, G., Pissoort, D.
Published in: IEEE Transactions on Electromagnetic Compatibility, Issue Volume: 65, Issue: 2, April 2023, 2023, Page(s) 595-598, ISSN 1558-187X
Publisher: IEEE
DOI: 10.1109/temc.2022.3228822

Influences of Wiring inside Ready-Made Connecting Devices on EMI in Medical Electronic Systems (opens in new window)

Author(s): Z. Chen, T. Claeys, R. Deseine, J. Catrysse and D. Pissoort
Published in: EEE Letters on Electromagnetic Compatibility Practice and Applications, Issue 2023, 2023, ISSN 2637-6423
Publisher: IEEE
DOI: 10.1109/lemcpa.2023.3286727

Triaxial Cell for Determining Shielded Cable Transfer Impedance During Environmental Stress (opens in new window)

Author(s): O. Leppäaho, F. Lafon, P. Fernández-López, M. Stojanovic, T. Claeys, R. Perdriau, M. Ramdani
Published in: IEEE Transactions on Electromagnetic Compatibility, Issue Volume: 65, Issue: 2, April 2023, 2023, Page(s) 395-405, ISSN 0018-9375
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/temc.2023.3244061

Synergistic Effect of Multi-Tone EMI on the Conducted Immunity of Integrated Oscillators (opens in new window)

Author(s): Q. M. Khan, L. Devaraj, M. Koohestani, A. R. Ruddle, M. Ramdani, R. Perdriau
Published in: IEEE Letters on Electromagnetic Compatibility Practice and Applications, 2022, ISSN 2637-6423
Publisher: IEEE
DOI: 10.1109/lemcpa.2022.3175433

Influence of Temperature on the EFT Immunity of Multistage Integrated Oscillators (opens in new window)

Author(s): Q. M. Khan, M. Koohestani, R. Perdriau
Published in: IEEE Transactions on Electromagnetic Compatibility, 2022, ISSN 1558-187X
Publisher: IEEE
DOI: 10.1109/temc.2022.3225540

Vulnerability of Smart Grid-enabled protection relays to IEMI (opens in new window)

Author(s): F. R. Arduini, M. Lanzrath, S. Ghosalkar, A. Nateghi, S. Fisahn and M. Schaarschmidt
Published in: Advances in Radio Science, 2023, ISSN 1684-9973
Publisher: Copernicus
DOI: 10.5194/ars-20-131-2023

Experimental Characterization of Multitone EM Immunity of Integrated Oscillators Under Thermal Stress (opens in new window)

Author(s): Q. M. Khan, L. Devaraj, R. Perdriau, A. R. Ruddle, T. Claeys, M. Ramdani, M. Koohestani
Published in: IEEE Access, Issue vol.10, 2022, Page(s) pp. 83898-83915, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3197659

Evaluation of the A&S and the Advanced EMI Detectors Based on Modeling Frameworks With Appropriate Condition Assessment (opens in new window)

Author(s): Habib, H., Claeys, T., Vandenbosch, G., Pissoort, D.
Published in: IEEE Access, Issue IEEE Access ( Volume: 11), 2023, Page(s) 72537-72551, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2023.3296095

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