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Pilot Integration of 3nm Semiconducter technology

Publications

A Benchmark Study of Complementary-Field Effect Transistor (CFET) Process Integration Options Done by Virtual Fabrication

Author(s): B. Vincent, J. Boemmels, J. Ryckaert and J. Ervin
Published in: IEEE Journal of the Electron Devices Society, 2020, ISSN 2168-6734
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/jeds.2020.2990718

Mask defect detection with hybrid deep learning network

Author(s): Peter Evanschitzky, Nicole Auth, Tilmann Heil, Christian Felix Hermanns, Andreas Erdmann
Published in: Journal of Micro/Nanopatterning, Materials, and Metrology, 2021, ISSN 1932-5150
Publisher: S P I E - International Society for Optical Engineering
DOI: 10.1117/1.jmm.20.4.041205

High Rate Deposition of Piezoelectric AlScN Films by ReactiveMagnetron Sputtering from AlSc Alloy Targets on Large Area

Author(s): Stephan Barth, Tom Schreiber , Steffen Cornelius , Olaf Zywitzki, Thomas Modes, Hagen Bartzsch
Published in: micromachines, Issue Micromachines 2022, 13, 2022, Page(s) 1561, ISSN 2072-666X
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/mi13101561

High-NA EUV lithography optics becomes reality

Author(s): Lars Wischmeier, Paul Gräupner, Peter Kürz, Winfried Kaiser, Jan Van Schoot, Jörg Mallmann, Joost de Pee, Judon Stoeldraijer
Published in: Extreme Ultraviolet (EUV) Lithography XI, 2020, Page(s) 4, ISBN 9781510634145
Publisher: SPIE
DOI: 10.1117/12.2543308

3D mask defect and repair simulation based on SEM images

Author(s): Vlad Medvedev, Peter Evanschitzky, Andreas Erdmann
Published in: SPIE Proceedings, Issue Proc. SPIE 12472, 37th European Mask and Lithography Conference, 1247208 (1 November 2022), 2022
Publisher: SPIE
DOI: 10.1117/12.2637978

Automated (S)TEM Metrology Characterization of Gate-All-Around and 3D NAND Devices

Author(s): Michael Strauss, Chen Lib, Chris Hakalaa, Xiaoting Gua, Antonio Manib, Zhenxin Zhonga
Published in: SPIE Proceedings, 2023
Publisher: SPIE

Metrology of thin resist for high NA EUVL

Author(s): Gian Francesco Lorusso, Christophe Beral, Janusz Bogdanowicz, Danilo De Simone, Mahmudul Hasan, Christiane Jehoul, Alain Moussa, Mohamed Saib, Mohamed Zidan, Joren Severi, Vincent Truffert, Dieter Van den Heuvel, Alex Goldenshtein, Kevin Houchens, Gaetano Santoro, Daniel Fischer, Angelika Muellender, Joey Hung, Roy Koret, Igor Turovets, Kit Ausschnitt, Chris Mack, Tsuyoshi Kondo, Tomoyasu Shohjoh,
Published in: SPIE Advanced Lithography + Patterning, 2022, ISBN 978-1-5106-4981-1
Publisher: Society of Photo-Optical Instrumentation Engineers (SPIE)
DOI: 10.1117/12.2614046

High-NA EUV lithography exposure tool: advantages and program progress

Author(s): Jan Van Schoot, Sjoerd Lok, Eelco van Setten, Ruben Maas, Kars Troost, Rudy Peeters, Jo Finders, Judon Stoeldraijer, Jos Benschop, Paul Graeupner, Peter Kuerz, Winfried Kaiser
Published in: SPIE Photomask Technology + EUV Lithography, Issue Proceedings Volume 11517, Extreme Ultraviolet Lithography 2020, 2020
Publisher: SPIE
DOI: 10.1117/12.2572932

High NA EUV optics: preparing lithography for the next big step

Author(s): Paul Graeupner, Peter Kuerz, Jan Van Schoot, Judon Stoeldraijer
Published in: SPIE Photomask Technology + EUV Lithography, Issue Proceedings Volume 11854, International Conference on Extreme Ultraviolet Lithography 2021, 2021
Publisher: SPIE
DOI: 10.1117/12.2600962

Vertical travelling scatterometry formetrology on fully integrated devices

Author(s): D. Schmidt, M. Medikonda, M. Rizzolo, C. Silvestre, J. Frougier, A. Greene, M. Breton, A. Cepler, J. Ofek, I. Kaplan, R. Koret, I. Turovets
Published in: Proc. SPIE 12053, Metrology, Inspection, and Process Control, Issue XXXVI, 120530S (26 May 2022), 2022
Publisher: SPIE (IBM & NOVA)

EUV Mask Defect Inspection for the 3nm Technology Node

Author(s): Yannick Hermans, Tilmann Heil, Maksym Kompaniiets, Daniel Boecker, Bartholomaeus Szafranek, Daniel Rhinow, Gerson Mette, Christian Felix Hermanns, Renzo Capelli, Thomas Marschner, Patrick Salg, Luc Halipre, Darko Trivkovic, Sandip Halder
Published in: Abstract submitted to EMLC Conference 2023, 2023
Publisher: SPIE

Intellectual Property Rights

Verfahren zur Herstellung eines Kühlkörpers für eine Baugruppe eines optischen Systems

Application/Publication number: 10 2020204665
Date: 2020-04-14
Applicant(s): CARL ZEISS SMT GMBH

OPTISCHES SYSTEM, LITHOGRAPHIEANLAGE UND VERFAHREN ZUM BETREIBEN EINES OPTISCHEN SYSTEMS

Application/Publication number: 10 2021206953
Date: 2021-07-02
Applicant(s): CARL ZEISS SMT GMBH

THERMISCHE AKTUATORANORDNUNG

Application/Publication number: 10 2022209852
Date: 2022-09-19
Applicant(s): CARL ZEISS SMT GMBH

NETZWERK FÜR EINE LITHOGRAPHIEANLAGE, LITHOGRAPHIEANLAGE UND VERFAHREN ZUM BETREIBEN EINES NETZWERKS

Application/Publication number: 10 2019219691
Date: 2019-12-16
Applicant(s): CARL ZEISS SMT GMBH

ABSTÜTZEN EINER KOMPONENTE EINER OPTISCHEN ABBILDUNGSEINRICHTUNG

Application/Publication number: 10 2021212823
Date: 2021-11-15
Applicant(s): CARL ZEISS SMT GMBH

FLUID PURGING SYSTEM

Application/Publication number: 20 21062269
Date: 2021-05-10
Applicant(s): ASML NETHERLANDS B.V.

FLUID PURGING SYSTEM

Application/Publication number: 20 21062269
Date: 2021-05-10
Applicant(s): ASML NETHERLANDS B.V.

ADAPTIVE OPTICAL ELEMENT FOR MICROLITHOGRAPHY

Application/Publication number: 20 21077485
Date: 2021-10-06
Applicant(s): CARL ZEISS SMT GMBH

Kontaktierung einer elektrischen Komponente in einem optischen Element

Application/Publication number: 10 2022211559
Date: 2022-11-02
Applicant(s): CARL ZEISS SMT GMBH

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