CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
Report including realized communication and dissemination activities during the project
Demonstration report for UC5
UC2 demonstration reportDemonstration report for UC2
UC3 demonstration reportDemonstration report for UC3
UC4 demonstration reportDemonstration report for UC4
UC1 demonstration reportDemonstration report for UC1
Publications
Author(s):
Laura Leja,Vitālijs Purlans, Rihards Novickis, Andrejs Cvetkovs and Kaspars Ozols
Published in:
Sensors, 2022, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22239458
Author(s):
Xing Dai, Helene Debregeas, Guillaume Da Rold, David Carrara, Kevin Louarn, Elena Duran Valdeiglesias, Francois Lelarge
Published in:
IEEE Journal of Selected Topics in Quantum Electronics, Issue 27/3, 2021, Page(s) 1-12, ISSN 1077-260X
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/jstqe.2020.3029394
Author(s):
Papatzacos, P. H., Nguyen, H. V., Roy, A., Hoivik, N., Broaddus, P., & Ohlckers, P.
Published in:
Microelectronics Reliability, 2022, ISSN 0026-2714
Publisher:
Elsevier BV
DOI:
10.1016/j.microrel.2022.114692
Author(s):
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel
Published in:
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 12, NO. 5, MAY 2022, 2022, ISSN 2156-3950
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2022.3170082
Author(s):
H. Xia, A. Roy, H.-V. Nguyen, Z. Ramic, K.E. Aasmundtveit, P. Ohlckers
Published in:
Microelectronics Reliability, 2022, ISSN 0026-2714
Publisher:
Elsevier BV
DOI:
10.1016/j.microrel.2022.114712
Author(s):
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
Published in:
Scripta Materialia, Volume 222, 1 January 2023, 114998, 2023, ISSN 1359-6462
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.scriptamat.2022.114998
Author(s):
V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
Published in:
Journal of Electronic Materials, 2020, ISSN 0361-5235
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1007/s11664-020-08530-y
Author(s):
Hexin Xia, Muhammad Nadeem Akram, Avisek Roy, Eivind Bardalen, Hoang-Vu Nguyen,Nils Høivik, Knut Eilif Aasmundtveit and Per Ohlckers
Published in:
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. December 2021. (Early access), 2021, ISSN 2156-3950
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2021.3135081
Author(s):
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Published in:
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, Page(s) 1-1, ISSN 2156-3950
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2021.3111345
Author(s):
Phillip Papatzacos, M. Nadeem Akram, Eivind Bardalen, Per Ohlckers
Published in:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-4, ISBN 978-1-7281-6293-5
Publisher:
IEEE
DOI:
10.1109/estc48849.2020.9229821
Author(s):
Avisek Roy; Hoang-Vu Nguyen; Hexin Xia; Phillip Papatzacos; Per Ohlckers; Knut Eilif Aasmundtveit
Published in:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher:
IEEE
DOI:
10.1109/estc55720.2022.9939461
Author(s):
Birgit Brandstatter, Daniel Aschenwald, Benedikt Auer, Norbert Bilewicz, Ruurd Boomsma, Christoph Kroll, Andreas Mayr, Richard Neumayr, Hannes Rieser, Mario Schernthaner, Hubert Selhofer, Florian Speer, Peter Unterwaditzer, Andras Videki, Martin Widauer, Thomas Widmann
Published in:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, Page(s) 1943-1949, ISBN 978-1-7281-6180-8
Publisher:
IEEE
DOI:
10.1109/ectc32862.2020.00303
Author(s):
Xia, A. Roy, E. Bardalen, H. -V. Nguyen, K. E. Aasmundtveit and P. Ohlckers
Published in:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021
Publisher:
IEEE
DOI:
10.23919/empc53418.2021.9584992
Author(s):
Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Published in:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-5, ISBN 978-1-7281-6293-5
Publisher:
IEEE
DOI:
10.1109/estc48849.2020.9229696
Author(s):
P. Papatzacos, N. Tiwary, N. Hoivik, H. V. Nguyen, A. Roy, and K. E. Aasmundtveit
Published in:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Publisher:
IEEE
DOI:
10.23919/empc53418.2021.9584990
Author(s):
Hexin Xia, Muhammed Nadeem Akram, Eivind Bardalen, Avisek Roy, Knut Eilif Aasmundtveit, Per Ohlckers
Published in:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-5, ISBN 978-1-7281-6293-5
Publisher:
IEEE
DOI:
10.1109/estc48849.2020.9229710
Author(s):
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Ross Glenn, Mervi Paulasto-Kröckel
Published in:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Publisher:
IEEE
DOI:
10.23919/empc53418.2021.9585007
Intellectual Property Rights
Application/Publication number:
10
2021100688
Date:
2021-01-14
Applicant(s):
OSYPKA AG
Application/Publication number:
10
2021100685
Date:
2021-01-14
Applicant(s):
OSYPKA AG
Application/Publication number:
20
21054332
Date:
2021-10-11
Applicant(s):
ICOS VISION SYSTEMS NV
Application/Publication number:
21
305377
Date:
2021-03-25
Applicant(s):
ALMAE TECHNOLOGIES
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