Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Información del proyecto

APPLAUSE

Identificador del acuerdo de subvención: 826588

DOI 10.3030/826588

Proyecto cerrado

Fecha de la firma de la CE 23 Mayo 2019

Fecha de inicio 1 Mayo 2019

Fecha de finalización 31 Octubre 2022

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total € 33 739 697,16

Aportación de la UE € 8 403 154,96

Coordinado por

ICOS VISION SYSTEMS NV
Belgium

Resultado final

Documents, reports (1)

Report on communications and disseminations activities

Report including realized communication and dissemination activities during the project

Publicaciones

Peer reviewed articles (9)

Mathematical Model and Synthetic Data Generation for Infra-Red Sensors

Autores: Laura Leja,Vitālijs Purlans, Rihards Novickis, Andrejs Cvetkovs and Kaspars Ozols
Publicado en: Sensors, 2022, ISSN 1424-8220
Editor: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22239458

Versatile Externally Modulated Lasers Technology for Multiple Telecommunication Applications

Autores: Xing Dai, Helene Debregeas, Guillaume Da Rold, David Carrara, Kevin Louarn, Elena Duran Valdeiglesias, Francois Lelarge
Publicado en: IEEE Journal of Selected Topics in Quantum Electronics, Edición 27/3, 2021, Página(s) 1-12, ISSN 1077-260X
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2020.3029394

Squeeze-out and bond strength of patterned Cusingle bondSn SLID seal-frames

Autores: Papatzacos, P. H., Nguyen, H. V., Roy, A., Hoivik, N., Broaddus, P., & Ohlckers, P.
Publicado en: Microelectronics Reliability, 2022, ISSN 0026-2714
Editor: Elsevier BV
DOI: 10.1016/j.microrel.2022.114692

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

Autores: Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel
Publicado en: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 12, NO. 5, MAY 2022, 2022, ISSN 2156-3950
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2022.3170082

Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays

Autores: H. Xia, A. Roy, H.-V. Nguyen, Z. Ramic, K.E. Aasmundtveit, P. Ohlckers
Publicado en: Microelectronics Reliability, 2022, ISSN 0026-2714
Editor: Elsevier BV
DOI: 10.1016/j.microrel.2022.114712

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Autores: Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
Publicado en: Scripta Materialia, Volume 222, 1 January 2023, 114998, 2023, ISSN 1359-6462
Editor: Pergamon Press Ltd.
DOI: 10.1016/j.scriptamat.2022.114998

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

Autores: V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
Publicado en: Journal of Electronic Materials, 2020, ISSN 0361-5235
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1007/s11664-020-08530-y

Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays

Autores: Hexin Xia, Muhammad Nadeem Akram, Avisek Roy, Eivind Bardalen, Hoang-Vu Nguyen,Nils Høivik, Knut Eilif Aasmundtveit and Per Ohlckers
Publicado en: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. December 2021. (Early access), 2021, ISSN 2156-3950
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3135081

Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding

Autores: Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Publicado en: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, Página(s) 1-1, ISSN 2156-3950
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3111345

Conference proceedings (8)

Simulated effects of wet-etched induced surface roughness on IR transmission and reflection

Autores: Phillip Papatzacos, M. Nadeem Akram, Eivind Bardalen, Per Ohlckers
Publicado en: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Página(s) 1-4, ISBN 978-1-7281-6293-5
Editor: IEEE
DOI: 10.1109/estc48849.2020.9229821

Vacuum Packaging of MEMS-based Infrared Detectors

Autores: Avisek Roy; Hoang-Vu Nguyen; Hexin Xia; Phillip Papatzacos; Per Ohlckers; Knut Eilif Aasmundtveit
Publicado en: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE
DOI: 10.1109/estc55720.2022.9939461

High-speed ultra-accurate direct C2W bonding

Autores: Birgit Brandstatter, Daniel Aschenwald, Benedikt Auer, Norbert Bilewicz, Ruurd Boomsma, Christoph Kroll, Andreas Mayr, Richard Neumayr, Hannes Rieser, Mario Schernthaner, Hubert Selhofer, Florian Speer, Peter Unterwaditzer, Andras Videki, Martin Widauer, Thomas Widmann
Publicado en: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, Página(s) 1943-1949, ISBN 978-1-7281-6180-8
Editor: IEEE
DOI: 10.1109/ectc32862.2020.00303

Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds

Autores: Xia, A. Roy, E. Bardalen, H. -V. Nguyen, K. E. Aasmundtveit and P. Ohlckers
Publicado en: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021
Editor: IEEE
DOI: 10.23919/empc53418.2021.9584992

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Autores: Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Publicado en: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Página(s) 1-5, ISBN 978-1-7281-6293-5
Editor: IEEE
DOI: 10.1109/estc48849.2020.9229696

Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

Autores: P. Papatzacos, N. Tiwary, N. Hoivik, H. V. Nguyen, A. Roy, and K. E. Aasmundtveit
Publicado en: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Editor: IEEE
DOI: 10.23919/empc53418.2021.9584990

Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays

Autores: Hexin Xia, Muhammed Nadeem Akram, Eivind Bardalen, Avisek Roy, Knut Eilif Aasmundtveit, Per Ohlckers
Publicado en: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Página(s) 1-5, ISBN 978-1-7281-6293-5
Editor: IEEE
DOI: 10.1109/estc48849.2020.9229710

Low-temperature Metal Bonding for Optical Device Packaging

Autores: Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Ross Glenn, Mervi Paulasto-Kröckel
Publicado en: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Editor: IEEE
DOI: 10.23919/empc53418.2021.9585007

Derechos de propiedad intelectual

Patent (4)

Elektromedizinische Elektrode

Número de solicitud/publicación: 10 2021100688
Fecha: 2021-01-14
Solicitante(s): OSYPKA AG

Elektromedizinische Elektrode

Número de solicitud/publicación: 10 2021100685
Fecha: 2021-01-14
Solicitante(s): OSYPKA AG

SEMICONDUCTOR DEVICES FOR EMITTING MODULATED LIGHT AND METHODS FOR FABRICATING SUCH DEVICES

Número de solicitud/publicación: 21 305377
Fecha: 2021-03-25
Solicitante(s): ALMAE TECHNOLOGIES

HIGH FLOW VACUUM CHUCK

Número de solicitud/publicación: 20 21054332
Fecha: 2021-10-11
Solicitante(s): ICOS VISION SYSTEMS NV