Resultado final
Report including realized communication and dissemination activities during the project
Demonstration report for UC5
UC2 demonstration reportDemonstration report for UC2
UC3 demonstration reportDemonstration report for UC3
UC4 demonstration reportDemonstration report for UC4
UC1 demonstration reportDemonstration report for UC1
Publicaciones
Autores:
Laura Leja,Vitālijs Purlans, Rihards Novickis, Andrejs Cvetkovs and Kaspars Ozols
Publicado en:
Sensors, 2022, ISSN 1424-8220
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22239458
Autores:
Xing Dai, Helene Debregeas, Guillaume Da Rold, David Carrara, Kevin Louarn, Elena Duran Valdeiglesias, Francois Lelarge
Publicado en:
IEEE Journal of Selected Topics in Quantum Electronics, Edición 27/3, 2021, Página(s) 1-12, ISSN 1077-260X
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/jstqe.2020.3029394
Autores:
Papatzacos, P. H., Nguyen, H. V., Roy, A., Hoivik, N., Broaddus, P., & Ohlckers, P.
Publicado en:
Microelectronics Reliability, 2022, ISSN 0026-2714
Editor:
Elsevier BV
DOI:
10.1016/j.microrel.2022.114692
Autores:
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel
Publicado en:
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 12, NO. 5, MAY 2022, 2022, ISSN 2156-3950
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2022.3170082
Autores:
H. Xia, A. Roy, H.-V. Nguyen, Z. Ramic, K.E. Aasmundtveit, P. Ohlckers
Publicado en:
Microelectronics Reliability, 2022, ISSN 0026-2714
Editor:
Elsevier BV
DOI:
10.1016/j.microrel.2022.114712
Autores:
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
Publicado en:
Scripta Materialia, Volume 222, 1 January 2023, 114998, 2023, ISSN 1359-6462
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.scriptamat.2022.114998
Autores:
V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
Publicado en:
Journal of Electronic Materials, 2020, ISSN 0361-5235
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1007/s11664-020-08530-y
Autores:
Hexin Xia, Muhammad Nadeem Akram, Avisek Roy, Eivind Bardalen, Hoang-Vu Nguyen,Nils Høivik, Knut Eilif Aasmundtveit and Per Ohlckers
Publicado en:
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. December 2021. (Early access), 2021, ISSN 2156-3950
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2021.3135081
Autores:
Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Publicado en:
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, Página(s) 1-1, ISSN 2156-3950
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/tcpmt.2021.3111345
Autores:
Phillip Papatzacos, M. Nadeem Akram, Eivind Bardalen, Per Ohlckers
Publicado en:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Página(s) 1-4, ISBN 978-1-7281-6293-5
Editor:
IEEE
DOI:
10.1109/estc48849.2020.9229821
Autores:
Avisek Roy; Hoang-Vu Nguyen; Hexin Xia; Phillip Papatzacos; Per Ohlckers; Knut Eilif Aasmundtveit
Publicado en:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
DOI:
10.1109/estc55720.2022.9939461
Autores:
Birgit Brandstatter, Daniel Aschenwald, Benedikt Auer, Norbert Bilewicz, Ruurd Boomsma, Christoph Kroll, Andreas Mayr, Richard Neumayr, Hannes Rieser, Mario Schernthaner, Hubert Selhofer, Florian Speer, Peter Unterwaditzer, Andras Videki, Martin Widauer, Thomas Widmann
Publicado en:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, Página(s) 1943-1949, ISBN 978-1-7281-6180-8
Editor:
IEEE
DOI:
10.1109/ectc32862.2020.00303
Autores:
Xia, A. Roy, E. Bardalen, H. -V. Nguyen, K. E. Aasmundtveit and P. Ohlckers
Publicado en:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021
Editor:
IEEE
DOI:
10.23919/empc53418.2021.9584992
Autores:
Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Publicado en:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Página(s) 1-5, ISBN 978-1-7281-6293-5
Editor:
IEEE
DOI:
10.1109/estc48849.2020.9229696
Autores:
P. Papatzacos, N. Tiwary, N. Hoivik, H. V. Nguyen, A. Roy, and K. E. Aasmundtveit
Publicado en:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Editor:
IEEE
DOI:
10.23919/empc53418.2021.9584990
Autores:
Hexin Xia, Muhammed Nadeem Akram, Eivind Bardalen, Avisek Roy, Knut Eilif Aasmundtveit, Per Ohlckers
Publicado en:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Página(s) 1-5, ISBN 978-1-7281-6293-5
Editor:
IEEE
DOI:
10.1109/estc48849.2020.9229710
Autores:
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Ross Glenn, Mervi Paulasto-Kröckel
Publicado en:
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Editor:
IEEE
DOI:
10.23919/empc53418.2021.9585007
Derechos de propiedad intelectual
Número de solicitud/publicación:
10
2021100688
Fecha:
2021-01-14
Solicitante(s):
OSYPKA AG
Número de solicitud/publicación:
10
2021100685
Fecha:
2021-01-14
Solicitante(s):
OSYPKA AG
Número de solicitud/publicación:
21
305377
Fecha:
2021-03-25
Solicitante(s):
ALMAE TECHNOLOGIES
Número de solicitud/publicación:
20
21054332
Fecha:
2021-10-11
Solicitante(s):
ICOS VISION SYSTEMS NV
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