Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Informazioni relative al progetto

APPLAUSE

ID dell’accordo di sovvenzione: 826588

DOI 10.3030/826588

Progetto chiuso

Data della firma CE 23 Maggio 2019

Data di avvio 1 Maggio 2019

Data di completamento 31 Ottobre 2022

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale € 33 739 697,16

Contributo UE € 8 403 154,96

Coordinato da

ICOS VISION SYSTEMS NV
Belgium

Risultati finali

Documents, reports (1)

Report on communications and disseminations activities

Report including realized communication and dissemination activities during the project

Pubblicazioni

Peer reviewed articles (9)

Mathematical Model and Synthetic Data Generation for Infra-Red Sensors

Autori: Laura Leja,Vitālijs Purlans, Rihards Novickis, Andrejs Cvetkovs and Kaspars Ozols
Pubblicato in: Sensors, 2022, ISSN 1424-8220
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22239458

Versatile Externally Modulated Lasers Technology for Multiple Telecommunication Applications

Autori: Xing Dai, Helene Debregeas, Guillaume Da Rold, David Carrara, Kevin Louarn, Elena Duran Valdeiglesias, Francois Lelarge
Pubblicato in: IEEE Journal of Selected Topics in Quantum Electronics, Numero 27/3, 2021, Pagina/e 1-12, ISSN 1077-260X
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2020.3029394

Squeeze-out and bond strength of patterned Cusingle bondSn SLID seal-frames

Autori: Papatzacos, P. H., Nguyen, H. V., Roy, A., Hoivik, N., Broaddus, P., & Ohlckers, P.
Pubblicato in: Microelectronics Reliability, 2022, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2022.114692

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

Autori: Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel
Pubblicato in: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 12, NO. 5, MAY 2022, 2022, ISSN 2156-3950
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2022.3170082

Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays

Autori: H. Xia, A. Roy, H.-V. Nguyen, Z. Ramic, K.E. Aasmundtveit, P. Ohlckers
Pubblicato in: Microelectronics Reliability, 2022, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2022.114712

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Autori: Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
Pubblicato in: Scripta Materialia, Volume 222, 1 January 2023, 114998, 2023, ISSN 1359-6462
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.scriptamat.2022.114998

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

Autori: V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
Pubblicato in: Journal of Electronic Materials, 2020, ISSN 0361-5235
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1007/s11664-020-08530-y

Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays

Autori: Hexin Xia, Muhammad Nadeem Akram, Avisek Roy, Eivind Bardalen, Hoang-Vu Nguyen,Nils Høivik, Knut Eilif Aasmundtveit and Per Ohlckers
Pubblicato in: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. December 2021. (Early access), 2021, ISSN 2156-3950
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3135081

Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding

Autori: Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Pubblicato in: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, Pagina/e 1-1, ISSN 2156-3950
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3111345

Conference proceedings (8)

Simulated effects of wet-etched induced surface roughness on IR transmission and reflection

Autori: Phillip Papatzacos, M. Nadeem Akram, Eivind Bardalen, Per Ohlckers
Pubblicato in: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Pagina/e 1-4, ISBN 978-1-7281-6293-5
Editore: IEEE
DOI: 10.1109/estc48849.2020.9229821

Vacuum Packaging of MEMS-based Infrared Detectors

Autori: Avisek Roy; Hoang-Vu Nguyen; Hexin Xia; Phillip Papatzacos; Per Ohlckers; Knut Eilif Aasmundtveit
Pubblicato in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE
DOI: 10.1109/estc55720.2022.9939461

High-speed ultra-accurate direct C2W bonding

Autori: Birgit Brandstatter, Daniel Aschenwald, Benedikt Auer, Norbert Bilewicz, Ruurd Boomsma, Christoph Kroll, Andreas Mayr, Richard Neumayr, Hannes Rieser, Mario Schernthaner, Hubert Selhofer, Florian Speer, Peter Unterwaditzer, Andras Videki, Martin Widauer, Thomas Widmann
Pubblicato in: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, Pagina/e 1943-1949, ISBN 978-1-7281-6180-8
Editore: IEEE
DOI: 10.1109/ectc32862.2020.00303

Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds

Autori: Xia, A. Roy, E. Bardalen, H. -V. Nguyen, K. E. Aasmundtveit and P. Ohlckers
Pubblicato in: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021
Editore: IEEE
DOI: 10.23919/empc53418.2021.9584992

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Autori: Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Pubblicato in: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Pagina/e 1-5, ISBN 978-1-7281-6293-5
Editore: IEEE
DOI: 10.1109/estc48849.2020.9229696

Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

Autori: P. Papatzacos, N. Tiwary, N. Hoivik, H. V. Nguyen, A. Roy, and K. E. Aasmundtveit
Pubblicato in: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Editore: IEEE
DOI: 10.23919/empc53418.2021.9584990

Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays

Autori: Hexin Xia, Muhammed Nadeem Akram, Eivind Bardalen, Avisek Roy, Knut Eilif Aasmundtveit, Per Ohlckers
Pubblicato in: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Pagina/e 1-5, ISBN 978-1-7281-6293-5
Editore: IEEE
DOI: 10.1109/estc48849.2020.9229710

Low-temperature Metal Bonding for Optical Device Packaging

Autori: Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Ross Glenn, Mervi Paulasto-Kröckel
Pubblicato in: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Editore: IEEE
DOI: 10.23919/empc53418.2021.9585007

Diritti di proprietà intellettuale

Patent (4)

Elektromedizinische Elektrode

Numero candidatura/pubblicazione: 10 2021100688
Data: 2021-01-14
Candidato/i: OSYPKA AG

Elektromedizinische Elektrode

Numero candidatura/pubblicazione: 10 2021100685
Data: 2021-01-14
Candidato/i: OSYPKA AG

SEMICONDUCTOR DEVICES FOR EMITTING MODULATED LIGHT AND METHODS FOR FABRICATING SUCH DEVICES

Numero candidatura/pubblicazione: 21 305377
Data: 2021-03-25
Candidato/i: ALMAE TECHNOLOGIES

HIGH FLOW VACUUM CHUCK

Numero candidatura/pubblicazione: 20 21054332
Data: 2021-10-11
Candidato/i: ICOS VISION SYSTEMS NV