Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Informations projet

APPLAUSE

N° de convention de subvention: 826588

DOI 10.3030/826588

Projet clôturé

Date de signature de la CE 23 Mai 2019

Date de début 1 Mai 2019

Date de fin 31 Octobre 2022

Financé au titre de

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coût total € 33 739 697,16

Contribution de l’UE € 8 403 154,96

Coordonné par

ICOS VISION SYSTEMS NV
Belgium

Livrables

Documents, reports (1)

Report on communications and disseminations activities

Report including realized communication and dissemination activities during the project

Demonstrators, pilots, prototypes (5)

UC5 demonstration report

Demonstration report for UC5

UC2 demonstration report

Demonstration report for UC2

UC3 demonstration report

Demonstration report for UC3

UC4 demonstration report

Demonstration report for UC4

UC1 demonstration report

Demonstration report for UC1

Publications

Peer reviewed articles (9)

Mathematical Model and Synthetic Data Generation for Infra-Red Sensors

Auteurs: Laura Leja,Vitālijs Purlans, Rihards Novickis, Andrejs Cvetkovs and Kaspars Ozols
Publié dans: Sensors, 2022, ISSN 1424-8220
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22239458

Versatile Externally Modulated Lasers Technology for Multiple Telecommunication Applications

Auteurs: Xing Dai, Helene Debregeas, Guillaume Da Rold, David Carrara, Kevin Louarn, Elena Duran Valdeiglesias, Francois Lelarge
Publié dans: IEEE Journal of Selected Topics in Quantum Electronics, Numéro 27/3, 2021, Page(s) 1-12, ISSN 1077-260X
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1109/jstqe.2020.3029394

Squeeze-out and bond strength of patterned Cusingle bondSn SLID seal-frames

Auteurs: Papatzacos, P. H., Nguyen, H. V., Roy, A., Hoivik, N., Broaddus, P., & Ohlckers, P.
Publié dans: Microelectronics Reliability, 2022, ISSN 0026-2714
Éditeur: Elsevier BV
DOI: 10.1016/j.microrel.2022.114692

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

Auteurs: Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Kröckel
Publié dans: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 12, NO. 5, MAY 2022, 2022, ISSN 2156-3950
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2022.3170082

Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays

Auteurs: H. Xia, A. Roy, H.-V. Nguyen, Z. Ramic, K.E. Aasmundtveit, P. Ohlckers
Publié dans: Microelectronics Reliability, 2022, ISSN 0026-2714
Éditeur: Elsevier BV
DOI: 10.1016/j.microrel.2022.114712

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Auteurs: Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
Publié dans: Scripta Materialia, Volume 222, 1 January 2023, 114998, 2023, ISSN 1359-6462
Éditeur: Pergamon Press Ltd.
DOI: 10.1016/j.scriptamat.2022.114998

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

Auteurs: V. Vuorinen, H. Dong, G. Ross, J. Hotchkiss, J. Kaaos, M. Paulasto-Kröckel
Publié dans: Journal of Electronic Materials, 2020, ISSN 0361-5235
Éditeur: Institute of Electrical and Electronics Engineers
DOI: 10.1007/s11664-020-08530-y

Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays

Auteurs: Hexin Xia, Muhammad Nadeem Akram, Avisek Roy, Eivind Bardalen, Hoang-Vu Nguyen,Nils Høivik, Knut Eilif Aasmundtveit and Per Ohlckers
Publié dans: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. December 2021. (Early access), 2021, ISSN 2156-3950
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3135081

Demonstrating 170°C Low Temperature Cu-In-Sn wafer level Solid Liquid Interdiffusion Bonding

Auteurs: Vesa Vuorinen, Glenn Ross, Anton Klami, Hongqun Dong, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Publié dans: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, Page(s) 1-1, ISSN 2156-3950
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/tcpmt.2021.3111345

Conference proceedings (8)

Simulated effects of wet-etched induced surface roughness on IR transmission and reflection

Auteurs: Phillip Papatzacos, M. Nadeem Akram, Eivind Bardalen, Per Ohlckers
Publié dans: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-4, ISBN 978-1-7281-6293-5
Éditeur: IEEE
DOI: 10.1109/estc48849.2020.9229821

Vacuum Packaging of MEMS-based Infrared Detectors

Auteurs: Avisek Roy; Hoang-Vu Nguyen; Hexin Xia; Phillip Papatzacos; Per Ohlckers; Knut Eilif Aasmundtveit
Publié dans: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Éditeur: IEEE
DOI: 10.1109/estc55720.2022.9939461

High-speed ultra-accurate direct C2W bonding

Auteurs: Birgit Brandstatter, Daniel Aschenwald, Benedikt Auer, Norbert Bilewicz, Ruurd Boomsma, Christoph Kroll, Andreas Mayr, Richard Neumayr, Hannes Rieser, Mario Schernthaner, Hubert Selhofer, Florian Speer, Peter Unterwaditzer, Andras Videki, Martin Widauer, Thomas Widmann
Publié dans: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, Page(s) 1943-1949, ISBN 978-1-7281-6180-8
Éditeur: IEEE
DOI: 10.1109/ectc32862.2020.00303

Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds

Auteurs: Xia, A. Roy, E. Bardalen, H. -V. Nguyen, K. E. Aasmundtveit and P. Ohlckers
Publié dans: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021
Éditeur: IEEE
DOI: 10.23919/empc53418.2021.9584992

Study of Cu-Sn-In system for low temperature, wafer level solid liquid inter-diffusion bonding

Auteurs: Joseph Hotchkiss, Vesa Vuorinen, Hongqun Dong, Glenn Ross, Jani Kaaos, Mervi Paulasto-Krockel, Tobias Wernicke, Anneliese Ponninger
Publié dans: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-5, ISBN 978-1-7281-6293-5
Éditeur: IEEE
DOI: 10.1109/estc48849.2020.9229696

Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds

Auteurs: P. Papatzacos, N. Tiwary, N. Hoivik, H. V. Nguyen, A. Roy, and K. E. Aasmundtveit
Publié dans: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Éditeur: IEEE
DOI: 10.23919/empc53418.2021.9584990

Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays

Auteurs: Hexin Xia, Muhammed Nadeem Akram, Eivind Bardalen, Avisek Roy, Knut Eilif Aasmundtveit, Per Ohlckers
Publié dans: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, Page(s) 1-5, ISBN 978-1-7281-6293-5
Éditeur: IEEE
DOI: 10.1109/estc48849.2020.9229710

Low-temperature Metal Bonding for Optical Device Packaging

Auteurs: Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Ross Glenn, Mervi Paulasto-Kröckel
Publié dans: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 13-16 Sept. 2021, 2021
Éditeur: IEEE
DOI: 10.23919/empc53418.2021.9585007

Droits de propriété intellectuelle

Patent (4)

Elektromedizinische Elektrode

Numéro de demande/publication: 10 2021100688
Date: 2021-01-14
Demandeur(s): OSYPKA AG

Elektromedizinische Elektrode

Numéro de demande/publication: 10 2021100685
Date: 2021-01-14
Demandeur(s): OSYPKA AG

SEMICONDUCTOR DEVICES FOR EMITTING MODULATED LIGHT AND METHODS FOR FABRICATING SUCH DEVICES

Numéro de demande/publication: 21 305377
Date: 2021-03-25
Demandeur(s): ALMAE TECHNOLOGIES

HIGH FLOW VACUUM CHUCK

Numéro de demande/publication: 20 21054332
Date: 2021-10-11
Demandeur(s): ICOS VISION SYSTEMS NV