Skip to main content
European Commission logo
English English
CORDIS - EU research results
CORDIS
CORDIS Web 30th anniversary CORDIS Web 30th anniversary

Next generation of memory for the age of IoT

Project description

New technology for future IoT devices

Beyond the laptop and smartphones, there are billions of devices that are connected to the internet, such as a smart refrigerator that can create grocery lists. At the heart of any IoT device is a microcontroller (MCU), which has logic transistors for processing data and embedded non-volatile memory (eNVM) for storing data. Most MCUs are manufactured at 40 nm nodes or above. Smaller technology nodes, like 28 nm, promise lower power and lower cost, which is critical for IoT adoption. In this context, the EU-funded IoTMemory project will search for a solution – a new eNVM technology. Specifically, researchers will carve out a clear path to eNVM cells even at the 7 nm node – the most advanced technology node available today.

Objective

Serving the €17bn microcontroller industry: Every IoT device needs a microcontroller (MCU). Each MCU has logic transistors for processing data and eNVM (flash) for storing data, among other components. Most microcontrollers today are manufactured at 40nm nodes or above. Smaller technology nodes, like 28nm, promise lower power and lower cost, critical for IoT adoption. Logic transistor scale down fine to 28nm and below. But Flash does not scale down to smaller technology nodes – the effects of Moore’s law have hit a physical limit at 28nm for Flash memory; writing data will destroy them. Consequentially, the benefits of 28nm will be denied to MCU vendors, unless a new eNVM technology is found.
FeFET, the ferroelectric field effect transistor by FMC, is based on the discovery that hafnium oxide, the gate material of modern logic transistors, can be modified such that it becomes ferro-electric. By applying a positive or negative voltage, the material can store a 0 or 1. The gate remembers the state even when power is turned off – the transistor becomes a non-volatile memory cell. As hafnium oxide retains ferro electricity to at least 2nm film thickness, we have clear path to eNVM cells even at the 7nm node – the most advanced technology node available today.
In Phase 1, FMC wants to better understand the technical requirements in various sectors of the microcontroller market, develop a communication approach, and develop a detailed plan how to meet their application specific functional and performance requirements.
Today, FMC is focused on advancing its technology from TRL5 to TRL6 to satisfy minimum viable product properties ahead of commencing prototype production. In Phase 2, FMC will use the base technology to create a range of custom-specific memory macros that satisfy the requirement of different market segments and customer types (TRL7-8).
The company should reach more than 115M€ revenues by 2024 provided it can raise the required financing.

Call for proposal

H2020-EIC-SMEInst-2018-2020

See other projects for this call

Sub call

H2020-SMEInst-2018-2020-1

Coordinator

FERROELECTRIC MEMORY GMBH
Net EU contribution
€ 50 000,00
Address
CHARLOTTE-BUHLER-STR. 12
01099 Dresden
Germany

See on map

SME

The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.

Yes
Region
Sachsen Dresden Dresden, Kreisfreie Stadt
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Links
Total cost
€ 71 429,00