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CORDIS

Challenging environments tolerant Smart systems for IoT and AI

CORDIS provides links to public deliverables and publications of HORIZON projects.

Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .

Deliverables

Guidelines for reliability testing on circuit level (opens in new window)

Document which contains instructions how to perform reliability testing for developed technology on circuit level. With these instructions, reliability testing can be performed on circuit level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Guidelines for reliability testing on module level (opens in new window)

Document which contains instructions how to perform reliability testing for developed technology on package level With these instructions reliability testing can be performed on package level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on system level (opens in new window)

Document which contains instructions how to perform reliability testing for developed technology on system level With these instructions reliability testing can be performed on system level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on component level (opens in new window)

Document which contains instructions how to perform reliability testing for developed technology on component level. With these instructions, reliability testing can be performed on component level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Plan for Use and Dissemination of the Foreground (PUDF) (opens in new window)

Publications

Analog Vector-Matrix Multiplier Based on Programmable Current Mirrors for Neural Network Integrated Circuits (opens in new window)

Author(s): Maksym Paliy, Sebastiano Strangio, Piero Ruiu, Tommaso Rizzo, Giuseppe Iannaccone
Published in: IEEE Access, Issue 8, 2021, Page(s) 203525-203537, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3037017

Novel Pulsed WPT System with Data Transfer Capability for Condition Monitoring of Industrial Rotating Equipment (opens in new window)

Author(s): R. SALVATI, V. PALAZZI, F. ALIMENTIP. MEZZANOTTE, L. ROSELLI, A. FABA, E. CARDELLI
Published in: IEEE Access, 2024, Page(s) 1, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3383545

Development of a Screening Platform for Optimizing Chemical Nanosensor Materials (opens in new window)

Author(s): Larissa Egger, Lisbeth Reiner, Florentyna Sosada-Ludwikowska, Anton Köck, Hendrik Schlicke, Sören Becker, Öznur Tokmak, Jan Steffen Niehaus, Alexander Blümel, Karl Popovic, Martin Tscherner
Published in: Sensors, Issue 24, 2025, Page(s) 5565, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s24175565

Data Loggers for High-Temperature Industrial Environments (opens in new window)

Author(s): Roberto Cecchi, Alessandro Catania, Christian Sbrana, Massimo Macucci, Sebastiano Strangio, Giuseppe Iannaccone
Published in: IEEE Access, Issue 12, 2024, Page(s) 180726-180737, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3509581

Energy-Efficient Harmonic Transponder Based on On-Off Keying Modulation for Both Identification and Sensing (opens in new window)

Author(s): Luca Roselli; Valentina Palazzi; Paolo MEZZANOTTE; Manos Tentzeris; Federico ALIMENTI
Published in: Sensors, Issue 1, 2022, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22020620

A 0.6V–1.8V Compact Temperature Sensor With 0.24 °C Resolution, ±1.4 °C Inaccuracy and 1.06nJ per Conversion (opens in new window)

Author(s): B. Zambrano, E. Garzón, S. Strangio, G. Iannaccone, M. Lanuzza
Published in: IEEE Sensors Journal, Issue 3, 2022, Page(s) 8, ISSN 1558-1748
Publisher: IEEE
DOI: 10.1109/jsen.2022.3171106

Efficient Screening of Hybrid Nanomaterials for Optimizing Chemical Sensor Devices (opens in new window)

Author(s): Larissa Egger, Lisbeth Reiner,Florentyna Sosada-Ludwikowska, Florentyna Sosada-Ludwikowska, Anton Köck,Jan Steffen Niehaus,Sören Becker,Öznur Tokmak,Hendrik Schlicke,Alexander Blümel,Karl Popovic and Martin Tscherner
Published in: MDPI Engineering Proceedings, Issue VOlume 21, Issue 1, 2022, Page(s) 21, ISSN 2673-4591
Publisher: MDPI Publishing
DOI: 10.3390/engproc2022021030

Accounting for spatial variations during photopolymerization of 1,6‐hexane‐diol diacrylate in the presence of oxygen (opens in new window)

Author(s): Alaa El Halabi, Kaveh Abdi, Anh‐Duong Dieu Vo, Ardalan Ebrahimzadeh, Jasper F. van den Hoek, Luuk van der Velden, Robin X. E. Willemse, Marjolein N. van der Linden, Piet D. Iedema, Kimberley B. McAuley
Published in: AIChE Journal, 2024, ISSN 0001-1541
Publisher: American Institute of Chemical Engineers
DOI: 10.1002/aic.18490

Affordable Motion Tracking System for Intuitive Programming of Industrial Robots (opens in new window)

Author(s): Martin Švejda; Martin Goubej; Arnold Jáger; Jan Reitinger; Ondřej Severa
Published in: Sensors; Volume 22; Issue 13; Pages: 4962, Issue 1, 2022, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22134962

Design Criteria of High-Temperature Integrated Circuits Using Standard SOI CMOS Process up to 300°C (opens in new window)

Author(s): Christian Sbrana; Alessandro Catania; Maksym Paliy; Stefano Di Pascoli; Sebastiano Strangio; Massimo Macucci; Giuseppe Iannaccone
Published in: IEEE Xplore, Issue 12, 2024, Page(s) 57236 - 57249, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3387714

All-Analog Silicon Integration of Image Sensor and Neural Computing Engine for Image Classification (opens in new window)

Author(s): Benjamin Zambrano; Sebastiano Strangio; Tommaso Rizzo; Esteban Garzon; Marco Lanuzza; Giuseppe Iannaccone
Published in: IEEE Access, Issue 6, 2022, Page(s) 94417 - 94430, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3203394

GUIDELINES FOR RELIABILITY TESTING ON CIRCUIT LEVEL

Author(s): Mika Mört, Soile Sääski
Published in: 2022, ISBN 978-952-316-405-5
Publisher: LUAS

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