Challenging environments tolerant Smart systems for IoT and AI

Projektinformationen

CHARM

ID Finanzhilfevereinbarung: 876362

DOI

10.3030/876362

Projekt abgeschlossen

EK-Unterschriftsdatum 19 Mai 2020

Startdatum 1 Juni 2020

Enddatum 29 Februar 2024

Finanziert unter

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Gesamtkosten

€ 27 863 436,25

EU-Beitrag

€ 7 269 829,08

Koordiniert durch

VALMET TECHNOLOGIES OY
Finland

CORDIS bietet Links zu öffentlichen Ergebnissen und Veröffentlichungen von HORIZONT-Projekten.

Links zu Ergebnissen und Veröffentlichungen von RP7-Projekten sowie Links zu einigen Typen spezifischer Ergebnisse wie Datensätzen und Software werden dynamisch von OpenAIRE abgerufen.

Leistungen

Documents, reports (5)

Guidelines for reliability testing on circuit level

Document which contains instructions how to perform reliability testing for developed technology on circuit level. With these instructions, reliability testing can be performed on circuit level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Guidelines for reliability testing on module level

Document which contains instructions how to perform reliability testing for developed technology on package level With these instructions reliability testing can be performed on package level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on system level

Document which contains instructions how to perform reliability testing for developed technology on system level With these instructions reliability testing can be performed on system level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on component level

Document which contains instructions how to perform reliability testing for developed technology on component level. With these instructions, reliability testing can be performed on component level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Plan for Use and Dissemination of the Foreground (PUDF)

Veröffentlichungen

Peer reviewed articles (11)

Analog Vector-Matrix Multiplier Based on Programmable Current Mirrors for Neural Network Integrated Circuits

Autoren: Maksym Paliy, Sebastiano Strangio, Piero Ruiu, Tommaso Rizzo, Giuseppe Iannaccone
Veröffentlicht in: IEEE Access, Ausgabe 8, 2021, Seite(n) 203525-203537, ISSN 2169-3536
Herausgeber: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3037017

Novel Pulsed WPT System with Data Transfer Capability for Condition Monitoring of Industrial Rotating Equipment

Autoren: R. SALVATI, V. PALAZZI, F. ALIMENTIP. MEZZANOTTE, L. ROSELLI, A. FABA, E. CARDELLI
Veröffentlicht in: IEEE Access, 2024, Seite(n) 1, ISSN 2169-3536
Herausgeber: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3383545

Development of a Screening Platform for Optimizing Chemical Nanosensor Materials

Autoren: Larissa Egger, Lisbeth Reiner, Florentyna Sosada-Ludwikowska, Anton Köck, Hendrik Schlicke, Sören Becker, Öznur Tokmak, Jan Steffen Niehaus, Alexander Blümel, Karl Popovic, Martin Tscherner
Veröffentlicht in: Sensors, Ausgabe 24, 2025, Seite(n) 5565, ISSN 1424-8220
Herausgeber: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s24175565

Data Loggers for High-Temperature Industrial Environments

Autoren: Roberto Cecchi, Alessandro Catania, Christian Sbrana, Massimo Macucci, Sebastiano Strangio, Giuseppe Iannaccone
Veröffentlicht in: IEEE Access, Ausgabe 12, 2024, Seite(n) 180726-180737, ISSN 2169-3536
Herausgeber: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3509581

Energy-Efficient Harmonic Transponder Based on On-Off Keying Modulation for Both Identification and Sensing

Autoren: Luca Roselli; Valentina Palazzi; Paolo MEZZANOTTE; Manos Tentzeris; Federico ALIMENTI
Veröffentlicht in: Sensors, Ausgabe 1, 2022, ISSN 1424-8220
Herausgeber: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22020620

A 0.6V–1.8V Compact Temperature Sensor With 0.24 °C Resolution, ±1.4 °C Inaccuracy and 1.06nJ per Conversion

Autoren: B. Zambrano, E. Garzón, S. Strangio, G. Iannaccone, M. Lanuzza
Veröffentlicht in: IEEE Sensors Journal, Ausgabe 3, 2022, Seite(n) 8, ISSN 1558-1748
Herausgeber: IEEE
DOI: 10.1109/jsen.2022.3171106

Efficient Screening of Hybrid Nanomaterials for Optimizing Chemical Sensor Devices

Autoren: Larissa Egger, Lisbeth Reiner,Florentyna Sosada-Ludwikowska, Florentyna Sosada-Ludwikowska, Anton Köck,Jan Steffen Niehaus,Sören Becker,Öznur Tokmak,Hendrik Schlicke,Alexander Blümel,Karl Popovic and Martin Tscherner
Veröffentlicht in: MDPI Engineering Proceedings, Ausgabe VOlume 21, Ausgabe 1, 2022, Seite(n) 21, ISSN 2673-4591
Herausgeber: MDPI Publishing
DOI: 10.3390/engproc2022021030

Accounting for spatial variations during photopolymerization of 1,6‐hexane‐diol diacrylate in the presence of oxygen

Autoren: Alaa El Halabi, Kaveh Abdi, Anh‐Duong Dieu Vo, Ardalan Ebrahimzadeh, Jasper F. van den Hoek, Luuk van der Velden, Robin X. E. Willemse, Marjolein N. van der Linden, Piet D. Iedema, Kimberley B. McAuley
Veröffentlicht in: AIChE Journal, 2024, ISSN 0001-1541
Herausgeber: American Institute of Chemical Engineers
DOI: 10.1002/aic.18490

Affordable Motion Tracking System for Intuitive Programming of Industrial Robots

Autoren: Martin Švejda; Martin Goubej; Arnold Jáger; Jan Reitinger; Ondřej Severa
Veröffentlicht in: Sensors; Volume 22; Ausgabe 13; Pages: 4962, Ausgabe 1, 2022, ISSN 1424-8220
Herausgeber: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22134962

Design Criteria of High-Temperature Integrated Circuits Using Standard SOI CMOS Process up to 300°C

Autoren: Christian Sbrana; Alessandro Catania; Maksym Paliy; Stefano Di Pascoli; Sebastiano Strangio; Massimo Macucci; Giuseppe Iannaccone
Veröffentlicht in: IEEE Xplore, Ausgabe 12, 2024, Seite(n) 57236 - 57249, ISSN 2169-3536
Herausgeber: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3387714

All-Analog Silicon Integration of Image Sensor and Neural Computing Engine for Image Classification

Autoren: Benjamin Zambrano; Sebastiano Strangio; Tommaso Rizzo; Esteban Garzon; Marco Lanuzza; Giuseppe Iannaccone
Veröffentlicht in: IEEE Access, Ausgabe 6, 2022, Seite(n) 94417 - 94430, ISSN 2169-3536
Herausgeber: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3203394

Other (1)

GUIDELINES FOR RELIABILITY TESTING ON CIRCUIT LEVEL

Autoren: Mika Mört, Soile Sääski
Veröffentlicht in: 2022, ISBN 978-952-316-405-5
Herausgeber: LUAS