Challenging environments tolerant Smart systems for IoT and AI

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Guidelines for reliability testing on circuit level

Document which contains instructions how to perform reliability testing for developed technology on circuit level. With these instructions, reliability testing can be performed on circuit level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Guidelines for reliability testing on module level

Document which contains instructions how to perform reliability testing for developed technology on package level With these instructions reliability testing can be performed on package level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on system level

Document which contains instructions how to perform reliability testing for developed technology on system level With these instructions reliability testing can be performed on system level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on component level

Document which contains instructions how to perform reliability testing for developed technology on component level. With these instructions, reliability testing can be performed on component level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Plan for Use and Dissemination of the Foreground (PUDF)

Publications

GUIDELINES FOR RELIABILITY TESTING ON CIRCUIT LEVEL

Auteurs: Mika Mört, Soile Sääski
Publié dans: 2022, ISBN 978-952-316-405-5
Éditeur: LUAS

Novel Pulsed WPT System with Data Transfer Capability for Condition Monitoring of Industrial Rotating Equipment

Auteurs: R. SALVATI, V. PALAZZI, F. ALIMENTIP. MEZZANOTTE, L. ROSELLI, A. FABA, E. CARDELLI
Publié dans: IEEE Access, 2024, Page(s) 1, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3383545

Energy-Efficient Harmonic Transponder Based on On-Off Keying Modulation for Both Identification and Sensing

Auteurs: Luca Roselli; Valentina Palazzi; Paolo MEZZANOTTE; Manos Tentzeris; Federico ALIMENTI
Publié dans: Sensors, Numéro 1, 2022, ISSN 1424-8220
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22020620

A 0.6V–1.8V Compact Temperature Sensor With 0.24 °C Resolution, ±1.4 °C Inaccuracy and 1.06nJ per Conversion

Auteurs: B. Zambrano, E. Garzón, S. Strangio, G. Iannaccone, M. Lanuzza
Publié dans: IEEE Sensors Journal, Numéro 3, 2022, Page(s) 8, ISSN 1558-1748
Éditeur: IEEE
DOI: 10.1109/jsen.2022.3171106

Efficient Screening of Hybrid Nanomaterials for Optimizing Chemical Sensor Devices

Auteurs: Larissa Egger, Lisbeth Reiner,Florentyna Sosada-Ludwikowska, Florentyna Sosada-Ludwikowska, Anton Köck,Jan Steffen Niehaus,Sören Becker,Öznur Tokmak,Hendrik Schlicke,Alexander Blümel,Karl Popovic and Martin Tscherner
Publié dans: MDPI Engineering Proceedings, Numéro VOlume 21, Numéro 1, 2022, Page(s) 21, ISSN 2673-4591
Éditeur: MDPI Publishing
DOI: 10.3390/engproc2022021030

Accounting for spatial variations during photopolymerization of 1,6‐hexane‐diol diacrylate in the presence of oxygen

Auteurs: Alaa El Halabi, Kaveh Abdi, Anh‐Duong Dieu Vo, Ardalan Ebrahimzadeh, Jasper F. van den Hoek, Luuk van der Velden, Robin X. E. Willemse, Marjolein N. van der Linden, Piet D. Iedema, Kimberley B. McAuley
Publié dans: AIChE Journal, 2024, ISSN 0001-1541
Éditeur: American Institute of Chemical Engineers
DOI: 10.1002/aic.18490

Affordable Motion Tracking System for Intuitive Programming of Industrial Robots

Auteurs: Martin Švejda; Martin Goubej; Arnold Jáger; Jan Reitinger; Ondřej Severa
Publié dans: Sensors; Volume 22; Numéro 13; Pages: 4962, Numéro 1, 2022, ISSN 1424-8220
Éditeur: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22134962

Design Criteria of High-Temperature Integrated Circuits Using Standard SOI CMOS Process up to 300°C

Auteurs: Christian Sbrana; Alessandro Catania; Maksym Paliy; Stefano Di Pascoli; Sebastiano Strangio; Massimo Macucci; Giuseppe Iannaccone
Publié dans: IEEE Xplore, Numéro 12, 2024, Page(s) 57236 - 57249, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3387714

All-Analog Silicon Integration of Image Sensor and Neural Computing Engine for Image Classification

Auteurs: Benjamin Zambrano; Sebastiano Strangio; Tommaso Rizzo; Esteban Garzon; Marco Lanuzza; Giuseppe Iannaccone
Publié dans: IEEE Access, Numéro 6, 2022, Page(s) 94417 - 94430, ISSN 2169-3536
Éditeur: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3203394

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