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Risultati finali
Document which contains instructions how to perform reliability testing for developed technology on circuit level. With these instructions, reliability testing can be performed on circuit level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.
Guidelines for reliability testing on module level (si apre in una nuova finestra)Document which contains instructions how to perform reliability testing for developed technology on package level With these instructions reliability testing can be performed on package level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology
Guidelines for reliability testing on system level (si apre in una nuova finestra)Document which contains instructions how to perform reliability testing for developed technology on system level With these instructions reliability testing can be performed on system level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology
Guidelines for reliability testing on component level (si apre in una nuova finestra)Document which contains instructions how to perform reliability testing for developed technology on component level. With these instructions, reliability testing can be performed on component level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.
Plan for Use and Dissemination of the Foreground (PUDF) (si apre in una nuova finestra)Pubblicazioni
Autori:
Maksym Paliy, Sebastiano Strangio, Piero Ruiu, Tommaso Rizzo, Giuseppe Iannaccone
Pubblicato in:
IEEE Access, Numero 8, 2021, Pagina/e 203525-203537, ISSN 2169-3536
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2020.3037017
Autori:
R. SALVATI, V. PALAZZI, F. ALIMENTIP. MEZZANOTTE, L. ROSELLI, A. FABA, E. CARDELLI
Pubblicato in:
IEEE Access, 2024, Pagina/e 1, ISSN 2169-3536
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2024.3383545
Autori:
Larissa Egger, Lisbeth Reiner, Florentyna Sosada-Ludwikowska, Anton Köck, Hendrik Schlicke, Sören Becker, Öznur Tokmak, Jan Steffen Niehaus, Alexander Blümel, Karl Popovic, Martin Tscherner
Pubblicato in:
Sensors, Numero 24, 2025, Pagina/e 5565, ISSN 1424-8220
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s24175565
Autori:
Roberto Cecchi, Alessandro Catania, Christian Sbrana, Massimo Macucci, Sebastiano Strangio, Giuseppe Iannaccone
Pubblicato in:
IEEE Access, Numero 12, 2024, Pagina/e 180726-180737, ISSN 2169-3536
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2024.3509581
Autori:
Luca Roselli; Valentina Palazzi; Paolo MEZZANOTTE; Manos Tentzeris; Federico ALIMENTI
Pubblicato in:
Sensors, Numero 1, 2022, ISSN 1424-8220
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22020620
Autori:
B. Zambrano, E. Garzón, S. Strangio, G. Iannaccone, M. Lanuzza
Pubblicato in:
IEEE Sensors Journal, Numero 3, 2022, Pagina/e 8, ISSN 1558-1748
Editore:
IEEE
DOI:
10.1109/jsen.2022.3171106
Autori:
Larissa Egger, Lisbeth Reiner,Florentyna Sosada-Ludwikowska, Florentyna Sosada-Ludwikowska, Anton Köck,Jan Steffen Niehaus,Sören Becker,Öznur Tokmak,Hendrik Schlicke,Alexander Blümel,Karl Popovic and Martin Tscherner
Pubblicato in:
MDPI Engineering Proceedings, Numero VOlume 21, Numero 1, 2022, Pagina/e 21, ISSN 2673-4591
Editore:
MDPI Publishing
DOI:
10.3390/engproc2022021030
Autori:
Alaa El Halabi, Kaveh Abdi, Anh‐Duong Dieu Vo, Ardalan Ebrahimzadeh, Jasper F. van den Hoek, Luuk van der Velden, Robin X. E. Willemse, Marjolein N. van der Linden, Piet D. Iedema, Kimberley B. McAuley
Pubblicato in:
AIChE Journal, 2024, ISSN 0001-1541
Editore:
American Institute of Chemical Engineers
DOI:
10.1002/aic.18490
Autori:
Martin Švejda; Martin Goubej; Arnold Jáger; Jan Reitinger; Ondřej Severa
Pubblicato in:
Sensors; Volume 22; Numero 13; Pages: 4962, Numero 1, 2022, ISSN 1424-8220
Editore:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s22134962
Autori:
Christian Sbrana; Alessandro Catania; Maksym Paliy; Stefano Di Pascoli; Sebastiano Strangio; Massimo Macucci; Giuseppe Iannaccone
Pubblicato in:
IEEE Xplore, Numero 12, 2024, Pagina/e 57236 - 57249, ISSN 2169-3536
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2024.3387714
Autori:
Benjamin Zambrano; Sebastiano Strangio; Tommaso Rizzo; Esteban Garzon; Marco Lanuzza; Giuseppe Iannaccone
Pubblicato in:
IEEE Access, Numero 6, 2022, Pagina/e 94417 - 94430, ISSN 2169-3536
Editore:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2022.3203394
Autori:
Mika Mört, Soile Sääski
Pubblicato in:
2022, ISBN 978-952-316-405-5
Editore:
LUAS
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