Challenging environments tolerant Smart systems for IoT and AI

Información del proyecto

CHARM

Identificador del acuerdo de subvención: 876362

DOI

10.3030/876362

Proyecto cerrado

Fecha de la firma de la CE 19 Mayo 2020

Fecha de inicio 1 Junio 2020

Fecha de finalización 29 Febrero 2024

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total

€ 27 863 436,25

Aportación de la UE

€ 7 269 829,08

Coordinado por

VALMET TECHNOLOGIES OY
Finland

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Documents, reports (5)

Guidelines for reliability testing on circuit level

Document which contains instructions how to perform reliability testing for developed technology on circuit level. With these instructions, reliability testing can be performed on circuit level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Guidelines for reliability testing on module level

Document which contains instructions how to perform reliability testing for developed technology on package level With these instructions reliability testing can be performed on package level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on system level

Document which contains instructions how to perform reliability testing for developed technology on system level With these instructions reliability testing can be performed on system level for technology developed in different Use Cases These instructions work as guidelines which can be further specified to best serve each Use Case This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology

Guidelines for reliability testing on component level

Document which contains instructions how to perform reliability testing for developed technology on component level. With these instructions, reliability testing can be performed on component level for technology developed in different Use Cases. These instructions work as guidelines which can be further specified to best serve each Use Case. This document also contains instructions how to report the results of the tests and how to use the results to make improvements in developed technology.

Plan for Use and Dissemination of the Foreground (PUDF)

Publicaciones

Peer reviewed articles (11)

Analog Vector-Matrix Multiplier Based on Programmable Current Mirrors for Neural Network Integrated Circuits

Autores: Maksym Paliy, Sebastiano Strangio, Piero Ruiu, Tommaso Rizzo, Giuseppe Iannaccone
Publicado en: IEEE Access, Edición 8, 2021, Página(s) 203525-203537, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2020.3037017

Novel Pulsed WPT System with Data Transfer Capability for Condition Monitoring of Industrial Rotating Equipment

Autores: R. SALVATI, V. PALAZZI, F. ALIMENTIP. MEZZANOTTE, L. ROSELLI, A. FABA, E. CARDELLI
Publicado en: IEEE Access, 2024, Página(s) 1, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3383545

Development of a Screening Platform for Optimizing Chemical Nanosensor Materials

Autores: Larissa Egger, Lisbeth Reiner, Florentyna Sosada-Ludwikowska, Anton Köck, Hendrik Schlicke, Sören Becker, Öznur Tokmak, Jan Steffen Niehaus, Alexander Blümel, Karl Popovic, Martin Tscherner
Publicado en: Sensors, Edición 24, 2025, Página(s) 5565, ISSN 1424-8220
Editor: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s24175565

Data Loggers for High-Temperature Industrial Environments

Autores: Roberto Cecchi, Alessandro Catania, Christian Sbrana, Massimo Macucci, Sebastiano Strangio, Giuseppe Iannaccone
Publicado en: IEEE Access, Edición 12, 2024, Página(s) 180726-180737, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3509581

Energy-Efficient Harmonic Transponder Based on On-Off Keying Modulation for Both Identification and Sensing

Autores: Luca Roselli; Valentina Palazzi; Paolo MEZZANOTTE; Manos Tentzeris; Federico ALIMENTI
Publicado en: Sensors, Edición 1, 2022, ISSN 1424-8220
Editor: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22020620

A 0.6V–1.8V Compact Temperature Sensor With 0.24 °C Resolution, ±1.4 °C Inaccuracy and 1.06nJ per Conversion

Autores: B. Zambrano, E. Garzón, S. Strangio, G. Iannaccone, M. Lanuzza
Publicado en: IEEE Sensors Journal, Edición 3, 2022, Página(s) 8, ISSN 1558-1748
Editor: IEEE
DOI: 10.1109/jsen.2022.3171106

Efficient Screening of Hybrid Nanomaterials for Optimizing Chemical Sensor Devices

Autores: Larissa Egger, Lisbeth Reiner,Florentyna Sosada-Ludwikowska, Florentyna Sosada-Ludwikowska, Anton Köck,Jan Steffen Niehaus,Sören Becker,Öznur Tokmak,Hendrik Schlicke,Alexander Blümel,Karl Popovic and Martin Tscherner
Publicado en: MDPI Engineering Proceedings, Edición VOlume 21, Edición 1, 2022, Página(s) 21, ISSN 2673-4591
Editor: MDPI Publishing
DOI: 10.3390/engproc2022021030

Accounting for spatial variations during photopolymerization of 1,6‐hexane‐diol diacrylate in the presence of oxygen

Autores: Alaa El Halabi, Kaveh Abdi, Anh‐Duong Dieu Vo, Ardalan Ebrahimzadeh, Jasper F. van den Hoek, Luuk van der Velden, Robin X. E. Willemse, Marjolein N. van der Linden, Piet D. Iedema, Kimberley B. McAuley
Publicado en: AIChE Journal, 2024, ISSN 0001-1541
Editor: American Institute of Chemical Engineers
DOI: 10.1002/aic.18490

Affordable Motion Tracking System for Intuitive Programming of Industrial Robots

Autores: Martin Švejda; Martin Goubej; Arnold Jáger; Jan Reitinger; Ondřej Severa
Publicado en: Sensors; Volume 22; Edición 13; Pages: 4962, Edición 1, 2022, ISSN 1424-8220
Editor: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s22134962

Design Criteria of High-Temperature Integrated Circuits Using Standard SOI CMOS Process up to 300°C

Autores: Christian Sbrana; Alessandro Catania; Maksym Paliy; Stefano Di Pascoli; Sebastiano Strangio; Massimo Macucci; Giuseppe Iannaccone
Publicado en: IEEE Xplore, Edición 12, 2024, Página(s) 57236 - 57249, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2024.3387714

All-Analog Silicon Integration of Image Sensor and Neural Computing Engine for Image Classification

Autores: Benjamin Zambrano; Sebastiano Strangio; Tommaso Rizzo; Esteban Garzon; Marco Lanuzza; Giuseppe Iannaccone
Publicado en: IEEE Access, Edición 6, 2022, Página(s) 94417 - 94430, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2022.3203394

Other (1)

GUIDELINES FOR RELIABILITY TESTING ON CIRCUIT LEVEL

Autores: Mika Mört, Soile Sääski
Publicado en: 2022, ISBN 978-952-316-405-5
Editor: LUAS