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Intelligent Reliability 4.0

Deliverables

Project newsletter No.1, No.2, No. 3

Report on all recent news and activities from the project

Communication channels and project website

Project website and communication channels (Social Media and others)

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Publications

Conference Presentation: Quantitative Assessment of Sulfur Uptake from Polymers Aged in Harsh Environments via LA-ICP-MS

Author(s): Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Publisher: ICP

Preprint: Defect Detection on Semiconductor Wafers by Distribution Analysis

Author(s): Thomas Olschewski
Published in: arXiv, 2021
Publisher: TUDresden
DOI: 10.48550/arxiv.2111.03727

Conference Presentation: Determination of protection capabilities of selected polymers against atmospheric corrosion in harsh environments

Author(s): J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Published in: EUROCORR 2021, 2021
Publisher: European Federation of Corrosion

Poster: Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

Author(s): D. Kostynski, S. Sack, M. Sievers
Published in: 12th International Conference on Integrated Power Electronics Systems, 2022
Publisher: ETG Energietechnische Gesellschaft im VDE

Presentation: Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Author(s): J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Published in: AOFKA 2021, 2021
Publisher: Chemnitz University of Technology

Conference Presentation: Humidity and temperature dependence of the Sulfur uptake behavior of different polymers examined via LA-ICP-MS depth profile measurements

Author(s): Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Publisher: ICP

Fast Accurate Defect Detection in Wafer Fabrication

Author(s): Olschewski, Thomas
Published in: 1, 2021
Publisher: TU Dresden

Presentation: Virtual Assessement of Power Packages

Author(s): Thomas Krivec
Published in: 8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Publisher: EPoSS

Poster: Investigating the corrosion behaviour of copper in sulphur containing atmospheres

Author(s): Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Published in: Colloquim Spectroscopicum Internationale XLII, 2022
Publisher: CSI

Towards Realization of a Low-Voltage Class-AB VCII with High Current Drive Capability

Author(s): Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Published in: electronics, 2021, ISSN 2079-9292
Publisher: MDPI
DOI: 10.3390/electronics10182303

High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs

Author(s): M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Published in: IEEE Transactions on Electron Devices, 2021, Page(s) 1-6, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3111144

An empirical evaluation of the use of models to improve the understanding of safety compliance needs

Author(s): Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Published in: Information and Software Technology, 126, 2020, Page(s) 106351, ISSN 0950-5849
Publisher: Elsevier BV
DOI: 10.1016/j.infsof.2020.106351

GaN-based power devices: Physics, reliability, and perspectives

Author(s): Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Published in: Journal of Applied Physics, 2021, ISSN 0021-8979
Publisher: American Institute of Physics
DOI: 10.1063/5.0061354

Feeling of Safety and Comfort towards a Socially Assistive Unmanned Aerial Vehicle That Monitors People in a Virtual Home

Author(s): Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Published in: Sensors, 21/3, 2021, Page(s) 908, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s21030908

TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs

Author(s): A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Published in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3134928

Compact Modeling of Non-Ideal Trapping/Detrapping Processes in GaN Power Devices

Author(s): N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Published in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3184622

The H2020-ECSEL Project “iRel40” (Intelligent Reliability 4.0)

Author(s): Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Published in: 2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Page(s) 311-318, ISBN 978-1-6654-2703-6
Publisher: IEEE
DOI: 10.1109/dsd53832.2021.00054

GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse

Author(s): F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Published in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764510

Modelling Thermal Fatigue in Power Electronics

Author(s): Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Published in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Publisher: IEEE
DOI: 10.1109/eurosime54907.2022.9758893

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Author(s): M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Published in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Publisher: IEEE
DOI: 10.1109/eurosime54907.2022.9758866

Reliability of Electronic Drivers: An Industrial Approach

Author(s): P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Published in: 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Publisher: IEEE
DOI: 10.1109/sslchinaifws54608.2021.9675170

Reliability of Electronic Drivers: An Industrial Approach

Author(s): P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Published in: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Publisher: ASME
DOI: 10.1115/ipack2021-72293

Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Author(s): J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Page(s) 1-7, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410833

Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition

Author(s): M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Published in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764592

ReliaVision: In-circuit transistor reliability investigation using XML-based technology reliability information in PDKs

Author(s): Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Published in: IEEE International Integrated Reliability Workshop (IIRW), 2021
Publisher: IEEE
DOI: 10.1109/iirw53245.2021.9635606

Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Author(s): J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Published in: Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Publisher: TU Chemnitz and TU Bergakademie Freiberg

Reliability of LED-based Systems

Author(s): Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Page(s) 1-4, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410861

Analysis and Design of a Fully-Integrated Pulsed LiDAR Driver in 100V-GaN IC Technology

Author(s): Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Published in: 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Publisher: IEEE
DOI: 10.1109/prime55000.2022.9816827

POWER SIC MOSFET UNDER REPETITIVE UIS AND SHORT CIRCUIT STRESS

Author(s): J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Published in: Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Publisher: University of Zilina in EDIS-Publishing Centre of UZ

A Method Based on Gaussian Process Regression for Modelling Burn-in of Semiconductor Devices

Author(s): Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Published in: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Page(s) 2619-2626, ISBN 978-981-18-2016-8
Publisher: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_763-cd

A Robust Approach for Inter-Turn Fault Detection of PMSM Used for Autonomous Vehicles

Author(s): Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Published in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Publisher: IEEE
DOI: 10.1109/iccve52871.2022.9742916

Microstructural Degradation Investigations of OFF-State Stressed 0.15 μm RF AlGaN/GaN HEMTs: Failure Mode related Breakdown

Author(s): Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Published in: IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Publisher: IEEE
DOI: 10.1109/wipda49284.2021.9645151

A Framework for the Determination of realistic Usage Profiles for Automated Shuttle Pods

Author(s): Stephanie Grubmüller; Pamela Innerwinkler
Published in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Publisher: IEEE
DOI: 10.1109/iccve52871.2022.9742765

Reliability and Failures in Solid State Lighting Systems

Author(s): W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Published in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Publisher: Springer
DOI: 10.1007/978-3-030-81576-9_7

A Proposal for the Classification of Methods for Verification and Validation of Safety, Cybersecurity, and Privacy of Automated Systems.

Author(s): Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Published in: Communications in Computer and Information Science, 2, 2021, ISBN 9783030853464
Publisher: Springer Nature Switzerland AG
DOI: 10.1007/978-3-030-85347-1_24

Outlook: From Physics of Failure to Physics of Degradation

Author(s): W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Published in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Page(s) 535–538
Publisher: Springer
DOI: 10.1007/978-3-030-81576-9_17