Intelligent Reliability 4.0

Conference Presentation: Quantitative Assessment of Sulfur Uptake from Polymers Aged in Harsh Environments via LA-ICP-MS

Author(s): Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Publisher: ICP

Poster: Characterization of the corrosion behavior of copper in sulfur-containing environments using LA-ICP-MS and LIBS

Author(s): Lukas, Brunnbauer, Jakob Willner, Günter Fafilek, Silvia Larisegger, Andreas Limbeck
Published in: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Publisher: EWCPS

Poster:

Author(s): Fabio A. Velarde Gonzalez, Lukas Hahne, Katrin Ortstein, André Lange, Sonja Crocoll
Published in: 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, 2023
Publisher: IEEE

Presentation: Concepts for reliability improvements of AMR current sensor devices and modules

Author(s): Heiko Knoll, Pascal Hille, Lukas Rauber, Matthias Brusius
Published in: 16. XMR-Symposium, 2023
Publisher: Sensitec

Preprint: Defect Detection on Semiconductor Wafers by Distribution Analysis

Author(s): Thomas Olschewski
Published in: arXiv, 2021
Publisher: TUDresden
DOI: 10.48550/arxiv.2111.03727

Presentation: Intelligent Manufacturing – From the Chip – Package – Board/System: Impact on reliability

Author(s): Klaus Pressel
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE

Presentation: Investigation of reconstruction stability and limitations for combined dithering-compressed-sensing processing of spectral imaging interferometric data in white-light interferometric surface profiling

Author(s): Ch. Taudt, S. Gruner, P. Hartmann
Published in: SPIE Photonics West 2023 - OPTO part, 2023
Publisher: SPIE

Conference Presentation: Determination of protection capabilities of selected polymers against atmospheric corrosion in harsh environments

Author(s): J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Published in: EUROCORR 2021, 2021
Publisher: European Federation of Corrosion

Poster: Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

Author(s): D. Kostynski, S. Sack, M. Sievers
Published in: 12th International Conference on Integrated Power Electronics Systems, 2022
Publisher: ETG Energietechnische Gesellschaft im VDE

Poster: Implementation of a new heating stage for in-situ LIBS analysis of temperature induced processes

Author(s): Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Published in: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Publisher: EWCPS

Presentation: Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Author(s): J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Published in: AOFKA 2021, 2021
Publisher: Chemnitz University of Technology

Poster: Investigation of metal diffusion into polymer films by measurement of quantitative LA-ICP-MS depth profiles

Author(s): Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Published in: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Publisher: EWCPS

Poster: Simulation driven investigation of production and aging related thermo-mechanical effects for the behavior of a SO16 System-in-Package sensor

Author(s): Heiner Moeller, Heiko Knoll, Pascal Hille, Sven Rzepka
Published in: Smart Systems Integration Conference and Exhibition 2023, 2023
Publisher: EPoss

Presentation: Virtual Design for Life Time optimization of M2X Modules – A Use Case from the IRel40 project

Author(s): Thomas Krivec et al.
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE

Poster: Spectrally resolved temporal coherence of spectrally narrowband filtered high-power supercontinuum light source versus an appropriately treated laser-driven plasma light source

Author(s): Tobias Baselt, Christopher Taudt, Daniel Ruf, Peter Hartmann
Published in: SPIE Photonics West 2023 - Proceedings Volume 12417, Optical Components and Materials XX; 1241716 (2023), 2023
Publisher: Society of Photo-Optical Instrumentation Engineers
DOI: 10.1117/12.2650033

Conference Presentation: Humidity and temperature dependence of the Sulfur uptake behavior of different polymers examined via LA-ICP-MS depth profile measurements

Author(s): Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Publisher: ICP

Presentation: Holistic Testing in iRel40 and Impact on Reliability

Author(s): Susan Zhao
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE

Presentation: AI applied to CSAM Images

Author(s): Jason Zi Jie Chia et. al.
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE

Fast Accurate Defect Detection in Wafer Fabrication

Author(s): Olschewski, Thomas
Published in: Issue 1, 2021
Publisher: TU Dresden

Presentation: Virtual Assessement of Power Packages

Author(s): Thomas Krivec
Published in: 8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Publisher: EPoSS

Poster: Investigating the corrosion behaviour of copper in sulphur containing atmospheres

Author(s): Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Published in: Colloquim Spectroscopicum Internationale XLII, 2022
Publisher: CSI

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Author(s): L. Du, X. Zhao, P. Watté, R. Poelma, W. Van Driel and G. Zhang
Published in: 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Publisher: IEEE
DOI: 10.1109/iecon49645.2022.9968578

The H2020-ECSEL Project “iRel40” (Intelligent Reliability 4.0)

Author(s): Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Published in: 2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Page(s) 311-318, ISBN 978-1-6654-2703-6
Publisher: IEEE
DOI: 10.1109/dsd53832.2021.00054

Data-Centric Model Development to Improve the CNN Classification of Defect Density SEM Images

Author(s): C. Kofler, C. A. Dohr, J. Dohr and A. Zernig
Published in: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Publisher: IEEE
DOI: 10.1109/iecon49645.2022.9968911

Ab initio derived force field potential for the accurate simulation of thermal transport in AlN

Author(s): S. Fernbach, E. Kraker and N. Bedoya-Martínez
Published in: nternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Publisher: IEEE
DOI: 10.1109/eurosime56861.2023.10100760

Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)

Author(s): I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer
Published in: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, ISBN 978-1-6654-8948-5
Publisher: IEEE
DOI: 10.1109/estc55720.2022.9939400

GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse

Author(s): F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Published in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764510

Super-Twisting Algorithm-based Sliding Mode Observer for Open-Circuit Fault Diagnosis in PWM Voltage Source Inverter in an In-Wheel Motor Drive System

Author(s): M. Hashemi, M. Stolz and D. Watzenig
Published in: 2023 IEEE International Conference on Mechatronics (ICM), 2023
Publisher: IEEE
DOI: 10.1109/icm54990.2023.10102000

Modelling Thermal Fatigue in Power Electronics

Author(s): Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Published in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Publisher: IEEE
DOI: 10.1109/eurosime54907.2022.9758893

Size Scaling of Brittle Strength using Multi-Mode Weibull Distribution

Author(s): S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar
Published in: "S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar, ""Size Scaling of Brittle Strength usi24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", 2023
Publisher: IEEE
DOI: 10.1109/eurosime56861.2023.10100803

FPGA implementation of histogram-based thresholding

Author(s): M. Hagara, P. Kubinec, A. Šatka and R. Stojanović
Published in: 11th Mediterranean Conference on Embedded Computing (MECO), 2022
Publisher: IEEE
DOI: 10.1109/meco55406.2022.9797132

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Author(s): Fahimeh Emadi; Vesa Vuorinen; Mervi Paulasto-Krockel
Published in: Electronics System-Integration Technology Conference (ESTC), Issue 1, 2022
Publisher: IEEE
DOI: 10.1109/estc55720.2022.9939539

On suitability of the customized measuring device for electric motor

Author(s): Rok Hribar; Gasper Petelin; Margarita Antoniou; Anton Biasizzo; Stanko Ciglaric; Gregor Papa
Published in: Annual Conference of Industrial Electronics Society, 2022., Issue 1, 2022
Publisher: IEEE
DOI: 10.1109/iecon49645.2022.9968876

Influence of the quality of material models on warpage and lifetime prediction by finite element simulation

Author(s): J. Zündel, M. Weninger, T. Krivec, M. Frewein and S. Waschnig
Published in: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Publisher: IEEE
DOI: 10.1109/eurosime56861.2023.10100777

An AI-based Architecture Framework for Improving End-of-line Reliability Tests of Electric Motors

Author(s): Müjdat Soytürk; Kutalmış Coşkun; Onur İzmitlioğlu; Borahan Tümer; Deniz Güneş; Sinan Saraçoğlu; Barış Bulut; Hasan Burak Ketmen; İsmethan Hanedar; Taşemir Aşan; Eray Aydın
Published in: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Publisher: IEEE
DOI: 10.1109/iecon49645.2022.9968853

Depth-Resolved LA-ICP-MS investigations for the Determination of Diffusion Coefficients of SO2 in thin Polymer films

Author(s): Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: European Workshop on laser Ablation Poster Abstracts, 2022
Publisher: University of Bern

Monitoring Degradation of Insulated Gate Bipolar Transistors in Induction Cooktops by Artificial Neural Networks

Author(s): Chenyang Lai, Piero Baralid, Ibrahim Ahmed, Enrico Zio, Alejandro del Cueto, Javier Gil, Sergio Llorente
Published in: Proceedings of the 32nd European Safety and Reliability Conference (ESREL), 2022
Publisher: Research Publishing, Singapore

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Author(s): M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Published in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Publisher: IEEE
DOI: 10.1109/eurosime54907.2022.9758866

Reliability of Electronic Drivers: An Industrial Approach

Author(s): P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Published in: 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Publisher: IEEE
DOI: 10.1109/sslchinaifws54608.2021.9675170

Optical pulse generation in nanosecond range with conventional high-power LED modules for metrology and calibration purposes

Author(s): E. Kabardiadi-Virkovski, A. Kabardiadi-Virkovski P. Hartmann
Published in: SPIE Photonics West 2023 - OPTO part, 2023
Publisher: SPIE
DOI: 10.1117/12.2649796

Reliability of Electronic Drivers: An Industrial Approach

Author(s): P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Published in: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Publisher: ASME
DOI: 10.1115/ipack2021-72293

An Unsupervised Method for Anomaly Detection in Multi-Stage Production Systems Based on LSTM Autoencoders

Author(s): Fatemeh Hosseinpour, Ibrahim Ahmed, Piero Baraldi, Mehdi Behzad, Enrico Zio, Horst Lewitschnig
Published in: Proceedings of the 32nd European Safety and Reliability Conference (ESREL 2022), 2022
Publisher: Research Publishing, Singapore

Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach

Author(s): H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
DOI: 10.1109/estc55720.2022.9939391

Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Author(s): J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Page(s) 1-7, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410833

Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition

Author(s): M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Published in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764592

ReliaVision: In-circuit transistor reliability investigation using XML-based technology reliability information in PDKs

Author(s): Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Published in: IEEE International Integrated Reliability Workshop (IIRW), 2021
Publisher: IEEE
DOI: 10.1109/iirw53245.2021.9635606

Dopant Incomplete Ionization Role in SiC Schottky Diode Edge Termination under Current Over-Stress

Author(s): O. Aviñó, F. Bonet, M. Vellvehí, P. Godignon, X. Jordà and X. Perpiñà
Published in: IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe), 2022
Publisher: IEEE
DOI: 10.1109/wipdaeurope55971.2022.9936256

Prognostics and Health Management for Power Electronics and Electrical Power Systems

Author(s): Robert Ross
Published in: International Conference on Condition Monitoring and Diagnosis (CMD), 2022
Publisher: IEEE
DOI: 10.23919/cmd54214.2022.9991683

Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Author(s): J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Published in: Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Publisher: TU Chemnitz and TU Bergakademie Freiberg

Assets’ Reliability Management Model for a Decision Making in Different Operational Contexts

Author(s): Uribetxebarria, J., Zubizarreta, A., Rodríguez, Á., Leturiondo, U.
Published in: WCEAM Proceedings. WCEAM 2022. Lecture Notes in Mechanical Engineering, 2023
Publisher: Springer
DOI: 10.1007/978-3-031-25448-2_3

A Multi-Channel System for Active Thermal Cycling of Discrete Power Semiconductors Based on Mission Profiles

Author(s): D. Kostynski, S. Sack, P. Kolter and M. Glavanovics
Published in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Publisher: IEEE
DOI: 10.1109/asdam55965.2022.9966759

A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing

Author(s): Mustafa Onur Izmitlioglu, Mujdat Soyturk
Published in: A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing, 2022
Publisher: IEEE

Reliability of LED-based Systems

Author(s): Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Page(s) 1-4, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410861

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

Author(s): F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen and M. Paulasto-Kröckel
Published in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Publisher: IEEE
DOI: 10.1109/asdam55965.2022.9966765

Reliability along the Value Chain – from Chip to Board/System

Author(s): K. Pressel and J. Moser
Published in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Publisher: IEEE
DOI: 10.1109/asdam55965.2022.9966780

A novel approach to analyze the reliability of GaN power HEMTs operating in a DC-DC Buck converter

Author(s): G. Capasso, M. Zanuccoli, A. N. Tallarico and C. Fiegna
Published in: IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Publisher: IEEE
DOI: 10.1109/essderc55479.2022.9947200

Analysis and Design of a Fully-Integrated Pulsed LiDAR Driver in 100V-GaN IC Technology

Author(s): Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Published in: 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Publisher: IEEE
DOI: 10.1109/prime55000.2022.9816827

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Author(s): M. Weninger, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst
Published in: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Publisher: IEEE
DOI: 10.1109/eurosime56861.2023.10100800

POWER SIC MOSFET UNDER REPETITIVE UIS AND SHORT CIRCUIT STRESS

Author(s): J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Published in: Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Publisher: University of Zilina in EDIS-Publishing Centre of UZ

Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

Author(s): A. Chvála, J. Marek, A. Šatka and J. Chen
Published in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Publisher: IEEE
DOI: 10.1109/asdam55965.2022.9966769

A Method Based on Gaussian Process Regression for Modelling Burn-in of Semiconductor Devices

Author(s): Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Published in: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Page(s) 2619-2626, ISBN 978-981-18-2016-8
Publisher: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_763-cd

A Robust Approach for Inter-Turn Fault Detection of PMSM Used for Autonomous Vehicles

Author(s): Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Published in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Publisher: IEEE
DOI: 10.1109/iccve52871.2022.9742916

Two Algorithms for Defect Detection in Wafer Fabricatio

Author(s): Thomas Olschewski
Published in: The 33rd European Safety and Reliability Conference (ESREL 2023), 2023
Publisher: ESREL
DOI: 10.3850/978-981-18-8071-1_p237-cd

Reliable force field potential for modelling thermal transport in AlN

Author(s): S. Fernbach, E. Kraker, E. Zojer, N. Bedoya-Martinez
Published in: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2022
Publisher: IEEE
DOI: 10.1109/therminic57263.2022.9950668

Microstructural Degradation Investigations of OFF-State Stressed 0.15 μm RF AlGaN/GaN HEMTs: Failure Mode related Breakdown

Author(s): Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Published in: IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Publisher: IEEE
DOI: 10.1109/wipda49284.2021.9645151

A Framework for the Determination of realistic Usage Profiles for Automated Shuttle Pods

Author(s): Stephanie Grubmüller; Pamela Innerwinkler
Published in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Publisher: IEEE
DOI: 10.1109/iccve52871.2022.9742765

SAC305 solder fatigue crack propagation under 3-point bending cycle test condition

Author(s): M. Zhang, J. Heilmann, Y. Sing Chan, M. Richard Niessner, P. Altieri-Weimar and B. Wunderle
Published in: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
DOI: 10.1109/estc55720.2022.9939510

Towards Realization of a Low-Voltage Class-AB VCII with High Current Drive Capability

Author(s): Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Published in: electronics, 2021, ISSN 2079-9292
Publisher: MDPI
DOI: 10.3390/electronics10182303

Modified algorithm of unimodal thresholding for FPGA implementation

Author(s): Miroslav Hagara, Radovan Stojanović, Alexander Šatka, Peter Kubinec, Oldřich Ondráček,
Published in: Microprocessors and Microsystems,, Issue 01419331, 2022, ISSN 0141-9331
Publisher: Elsevier BV
DOI: 10.1016/j.micpro.2022.104669

Study of the influence of gate etching and passivation on current dispersion, trapping and reliability in RF 0.15 μm AlGaN/GaN HEMTs

Author(s): F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, A. Gerosa, G. Meneghesso, E. Zanoni, M. Meneghini
Published in: Microelectronics Reliability, Issue 00262714, 2022, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2022.114735

A Review on Machine and Deep Learning for Semiconductor Defect Classification in Scanning Electron Microscope Images

Author(s): López de la Rosa, F.; Sánchez-Reolid, R.; Gómez-Sirvent, J.L.; Morales, R.; Fernández-Caballero, A.
Published in: applied science, Issue 20763417, 2021, ISSN 2076-3417
Publisher: MDPI
DOI: 10.3390/app11209508

Facial Emotion Recognition from an Unmanned Flying Social Robot for Home Care of Dependent People

Author(s): Anselmo Martínez; Lidia M. Belmonte; Arturo S. García; Antonio Fernández-Caballero; Rafael Morales
Published in: Electronics, Vol 10, Iss 868, p 868 (2021), Issue 3, 2021, ISSN 2079-9292
Publisher: MDPI
DOI: 10.3390/electronics10070868

High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs

Author(s): M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Published in: IEEE Transactions on Electron Devices, 2021, Page(s) 1-6, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3111144

An empirical evaluation of the use of models to improve the understanding of safety compliance needs

Author(s): Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Published in: Information and Software Technology, Issue 126, 2020, Page(s) 106351, ISSN 0950-5849
Publisher: Elsevier BV
DOI: 10.1016/j.infsof.2020.106351

GaN-based power devices: Physics, reliability, and perspectives

Author(s): Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Published in: Journal of Applied Physics, 2021, ISSN 0021-8979
Publisher: American Institute of Physics
DOI: 10.1063/5.0061354

Giant Magneto-Resistive (GMR) Sensors for Non-Contacting Partial Discharge Detection

Author(s): Y. Chen, L. C. C. Heredia, J. J. Smit, M. G. Niasar and R. Ross
Published in: Transactions on Instrumentation and Measurement,, 2023, ISSN 1557-9662
Publisher: IEEE
DOI: 10.1109/tim.2023.3268485

The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs

Author(s): M. Millesimo; M. Borga; B. Bakeroot; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Published in: IEEE Electron Device Letters, 2022, ISSN 1558-0563
Publisher: IEEE
DOI: 10.1109/led.2022.3206610

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes Under Current Crowding

Author(s): F. Bonet, O. Aviñó-Salvadó, M. Vellvehi, X. Jordà, P. Godignon and X. Perpiñà
Published in: Electron Device Letters, 2022, ISSN 1558-0563
Publisher: IEEE
DOI: 10.1109/led.2022.3171112

UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips

Author(s): Joshua Lommes, Gesa Patzelt, Volkmar Stenzel,
Published in: Microelectronics Engineering, 2023, ISSN 0167-9317
Publisher: Elsevier BV
DOI: 10.1016/j.mee.2023.112014

Generalised Proportional Integral Control for Magnetic Levitation Systems Using a Tangent Linearisation Approach

Author(s): Lidia M. Belmonte; Eva Segura; Antonio Fernández-Caballero; José A. Somolinos; Rafael Morales
Published in: Mathematics, Vol 9, Iss 1424, p 1424 (2021), Issue 3, 2021, ISSN 2227-7390
Publisher: MDPI (Multidisciplinary Digital Publishing Institute)
DOI: 10.3390/math9121424

A versatile approach for the preparation of matrix-matched standards for LA-ICP-MS analysis – Standard addition by the spraying of liquid standards

Author(s): Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, Andreas Limbeck
Published in: Talanta, 2023, ISSN 0039-9140
Publisher: Elsevier BV
DOI: 10.1016/j.talanta.2023.124305

Feeling of Safety and Comfort towards a Socially Assistive Unmanned Aerial Vehicle That Monitors People in a Virtual Home

Author(s): Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Published in: Sensors, Issue 21/3, 2021, Page(s) 908, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s21030908

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

Author(s): F. Emadi; V. Vuorinen; G. Ross; M. Paulasto-Kröckel
Published in: Materials Science & Engineering: A, Issue 2, 2023, ISSN 0921-5093
Publisher: Elsevier BV
DOI: 10.1016/j.msea.2023.145398

Geometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a ResNet50 convolutional neural network

Author(s): Francisco López de la Rosa, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, Antonio Fernández-Caballero,
Published in: Expert Systems with Applications, Issue 09574174, 2022, ISSN 0957-4174
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.eswa.2022.117731

TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs

Author(s): A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Published in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3134928

A deep residual neural network for semiconductor defect classification in imbalanced scanning electron microscope datasets

Author(s): Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero,
Published in: Applied Soft Computing, Issue 15684946, 2022, ISSN 1568-4946
Publisher: Elsevier BV
DOI: 10.1016/j.asoc.2022.109743

An Empirical Evaluation of Enhanced Performance Softmax Function in Deep Learning

Author(s): S. Mehra, G. Raut, R. D. Purkayastha, S. K. Vishvakarma and A. Biasizzo
Published in: IEEE Access, 2023, ISSN 2169-3536
Publisher: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2023.3265327

A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology

Author(s): Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt
Published in: IEEE Electron Device Letters, 2023, ISSN 0741-3106
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2023.3268334

Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet

Author(s): Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero
Published in: Computers & Industrial Engineering, 2023, ISSN 0360-8352
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.cie.2023.109549

Compact Modeling of Non-Ideal Trapping/Detrapping Processes in GaN Power Devices

Author(s): N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Published in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3184622

Comprehensive Degradation Analysis of NCA Li-Ion Batteries via Methods of Electrochemical Characterisation for Various Stress-Inducing Scenarios

Author(s): Martin Kemeny, Peter Ondrejka, Miroslav Mikolasek
Published in: Batteries, 2023, ISSN 2313-0105
Publisher: MDPI
DOI: 10.3390/batteries9010033

Learning under concept drift and non-stationary noise: Introduction of the concept of persistence

Author(s): Kutalmış Coşkun, Borahan Tümer
Published in: Engineering Applications of Artificial Intelligence, 2023, ISSN 0952-1976
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.engappai.2023.106363

Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs

Author(s): N. Modoloa, M. Fregolent, F. Masin, A. Benato, A. Bettini, M. Buffolo, C. De Santi, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, D. Vogrig, A. Neviani, G. Meneghesso, E. Zanoni, M. Meneghini
Published in: Microelectronics Reliability, Issue 00262714, 2022, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2022.114708

A Syntactic Pattern Recognition Based Approach to Online Anomaly Detection and Identification on Electric Motors

Author(s): Coşkun, K., Kumralbaş, Z., Çavuş, H., Tümer, B.
Published in: Pattern Recognition. DAGM GCPR 2022. Lecture Notes in Computer Science, 2022
Publisher: Springer
DOI: 10.1007/978-3-031-16788-1_8

Anomaly Detection using Audio Signals

Author(s): B.S.Çağlar, H.B.Ketmen, B. Bulut
Published in: International Aegean Scientific Research Symposium 2021 Proceedings Book, 2022, ISBN 978-605-74014-2-7
Publisher: Kocaeli University

Reliability and Failures in Solid State Lighting Systems

Author(s): W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Published in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Publisher: Springer
DOI: 10.1007/978-3-030-81576-9_7

A Proposal for the Classification of Methods for Verification and Validation of Safety, Cybersecurity, and Privacy of Automated Systems.

Author(s): Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Published in: Communications in Computer and Information Science, Issue 2, 2021, ISBN 9783030853464
Publisher: Springer Nature Switzerland AG
DOI: 10.1007/978-3-030-85347-1_24

Outlook: From Physics of Failure to Physics of Degradation

Author(s): W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Published in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Page(s) 535–538
Publisher: Springer
DOI: 10.1007/978-3-030-81576-9_17

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