Deliverables
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Publications
Author(s): Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Publisher: ICP
Author(s): Thomas Olschewski
Published in: arXiv, 2021
Publisher: TUDresden
DOI: 10.48550/arxiv.2111.03727
Author(s): Klaus Pressel
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
Author(s): J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Published in: EUROCORR 2021, 2021
Publisher: European Federation of Corrosion
Author(s): D. Kostynski, S. Sack, M. Sievers
Published in: 12th International Conference on Integrated Power Electronics Systems, 2022
Publisher: ETG Energietechnische Gesellschaft im VDE
Author(s): J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Published in: AOFKA 2021, 2021
Publisher: Chemnitz University of Technology
Author(s): Thomas Krivec et al.
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
Author(s): Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Publisher: ICP
Author(s): Susan Zhao
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
Author(s): Jason Zi Jie Chia et. al.
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
Author(s): Olschewski, Thomas
Published in: 1, 2021
Publisher: TU Dresden
Author(s): Thomas Krivec
Published in: 8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Publisher: EPoSS
Author(s): Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Published in: Colloquim Spectroscopicum Internationale XLII, 2022
Publisher: CSI
Author(s): Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Published in: electronics, 2021, ISSN 2079-9292
Publisher: MDPI
DOI: 10.3390/electronics10182303
Author(s): Miroslav Hagara, Radovan Stojanović, Alexander Šatka, Peter Kubinec, Oldřich Ondráček,
Published in: Microprocessors and Microsystems,, 01419331, 2022, ISSN 0141-9331
Publisher: Elsevier BV
DOI: 10.1016/j.micpro.2022.104669
Author(s): F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, A. Gerosa, G. Meneghesso, E. Zanoni, M. Meneghini
Published in: Microelectronics Reliability, 00262714, 2022, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2022.114735
Author(s): López de la Rosa, F.; Sánchez-Reolid, R.; Gómez-Sirvent, J.L.; Morales, R.; Fernández-Caballero, A.
Published in: applied science, 20763417, 2021, ISSN 2076-3417
Publisher: MDPI
DOI: 10.3390/app11209508
Author(s): M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Published in: IEEE Transactions on Electron Devices, 2021, Page(s) 1-6, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3111144
Author(s): Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Published in: Information and Software Technology, 126, 2020, Page(s) 106351, ISSN 0950-5849
Publisher: Elsevier BV
DOI: 10.1016/j.infsof.2020.106351
Author(s): Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Published in: Journal of Applied Physics, 2021, ISSN 0021-8979
Publisher: American Institute of Physics
DOI: 10.1063/5.0061354
Author(s): Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Published in: Sensors, 21/3, 2021, Page(s) 908, ISSN 1424-8220
Publisher: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s21030908
Author(s): Francisco López de la Rosa, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, Antonio Fernández-Caballero,
Published in: Expert Systems with Applications, 09574174, 2022, ISSN 0957-4174
Publisher: Pergamon Press Ltd.
DOI: 10.1016/j.eswa.2022.117731
Author(s): A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Published in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3134928
Author(s): Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero,
Published in: Applied Soft Computing, 15684946, 2022, ISSN 1568-4946
Publisher: Elsevier BV
DOI: 10.1016/j.asoc.2022.109743
Author(s): N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Published in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Publisher: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3184622
Author(s): N. Modoloa, M. Fregolent, F. Masin, A. Benato, A. Bettini, M. Buffolo, C. De Santi, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, D. Vogrig, A. Neviani, G. Meneghesso, E. Zanoni, M. Meneghini
Published in: Microelectronics Reliability, 00262714, 2022, ISSN 0026-2714
Publisher: Elsevier BV
DOI: 10.1016/j.microrel.2022.114708
Author(s): Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Published in: 2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Page(s) 311-318, ISBN 978-1-6654-2703-6
Publisher: IEEE
DOI: 10.1109/dsd53832.2021.00054
Author(s): F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Published in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764510
Author(s): Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Published in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Publisher: IEEE
DOI: 10.1109/eurosime54907.2022.9758893
Author(s): M. Hagara, P. Kubinec, A. Šatka and R. Stojanović
Published in: 11th Mediterranean Conference on Embedded Computing (MECO), 2022
Publisher: IEEE
DOI: 10.1109/meco55406.2022.9797132
Author(s): Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Published in: European Workshop on laser Ablation Poster Abstracts, 2022
Publisher: University of Bern
Author(s): Chenyang Lai, Piero Baralid, Ibrahim Ahmed, Enrico Zio, Alejandro del Cueto, Javier Gil, Sergio Llorente
Published in: Proceedings of the 32nd European Safety and Reliability Conference (ESREL), 2022
Publisher: Research Publishing, Singapore
Author(s): M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Published in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Publisher: IEEE
DOI: 10.1109/eurosime54907.2022.9758866
Author(s): P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Published in: 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Publisher: IEEE
DOI: 10.1109/sslchinaifws54608.2021.9675170
Author(s): P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Published in: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Publisher: ASME
DOI: 10.1115/ipack2021-72293
Author(s): Fatemeh Hosseinpour, Ibrahim Ahmed, Piero Baraldi, Mehdi Behzad, Enrico Zio, Horst Lewitschnig
Published in: Proceedings of the 32nd European Safety and Reliability Conference (ESREL 2022), 2022
Publisher: Research Publishing, Singapore
Author(s): H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka
Published in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Publisher: IEEE
DOI: 10.1109/estc55720.2022.9939391
Author(s): J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Page(s) 1-7, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410833
Author(s): M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Published in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Publisher: IEEE
DOI: 10.1109/irps48227.2022.9764592
Author(s): Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Published in: IEEE International Integrated Reliability Workshop (IIRW), 2021
Publisher: IEEE
DOI: 10.1109/iirw53245.2021.9635606
Author(s): J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Published in: Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Publisher: TU Chemnitz and TU Bergakademie Freiberg
Author(s): Mustafa Onur Izmitlioglu, Mujdat Soyturk
Published in: A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing, 2022
Publisher: IEEE
Author(s): Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Page(s) 1-4, ISBN 978-1-6654-1373-2
Publisher: IEEE
DOI: 10.1109/eurosime52062.2021.9410861
Author(s): Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Published in: 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Publisher: IEEE
DOI: 10.1109/prime55000.2022.9816827
Author(s): J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Published in: Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Publisher: University of Zilina in EDIS-Publishing Centre of UZ
Author(s): Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Published in: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Page(s) 2619-2626, ISBN 978-981-18-2016-8
Publisher: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_763-cd
Author(s): Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Published in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Publisher: IEEE
DOI: 10.1109/iccve52871.2022.9742916
Author(s): Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Published in: IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Publisher: IEEE
DOI: 10.1109/wipda49284.2021.9645151
Author(s): Stephanie Grubmüller; Pamela Innerwinkler
Published in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Publisher: IEEE
DOI: 10.1109/iccve52871.2022.9742765
Author(s): Coşkun, K., Kumralbaş, Z., Çavuş, H., Tümer, B.
Published in: Pattern Recognition. DAGM GCPR 2022. Lecture Notes in Computer Science, 2022
Publisher: Springer
DOI: 10.1007/978-3-031-16788-1_8
Author(s): W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Published in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Publisher: Springer
DOI: 10.1007/978-3-030-81576-9_7
Author(s): Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Published in: Communications in Computer and Information Science, 2, 2021, ISBN 9783030853464
Publisher: Springer Nature Switzerland AG
DOI: 10.1007/978-3-030-85347-1_24
Author(s): W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Published in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Page(s) 535–538
Publisher: Springer
DOI: 10.1007/978-3-030-81576-9_17