Intelligent Reliability 4.0

Conference Presentation: Quantitative Assessment of Sulfur Uptake from Polymers Aged in Harsh Environments via LA-ICP-MS

Autorzy: Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Opublikowane w: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Wydawca: ICP

Poster: Characterization of the corrosion behavior of copper in sulfur-containing environments using LA-ICP-MS and LIBS

Autorzy: Lukas, Brunnbauer, Jakob Willner, Günter Fafilek, Silvia Larisegger, Andreas Limbeck
Opublikowane w: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Wydawca: EWCPS

Poster:

Autorzy: Fabio A. Velarde Gonzalez, Lukas Hahne, Katrin Ortstein, André Lange, Sonja Crocoll
Opublikowane w: 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, 2023
Wydawca: IEEE

Presentation: Concepts for reliability improvements of AMR current sensor devices and modules

Autorzy: Heiko Knoll, Pascal Hille, Lukas Rauber, Matthias Brusius
Opublikowane w: 16. XMR-Symposium, 2023
Wydawca: Sensitec

Preprint: Defect Detection on Semiconductor Wafers by Distribution Analysis

Autorzy: Thomas Olschewski
Opublikowane w: arXiv, 2021
Wydawca: TUDresden
DOI: 10.48550/arxiv.2111.03727

Presentation: Intelligent Manufacturing – From the Chip – Package – Board/System: Impact on reliability

Autorzy: Klaus Pressel
Opublikowane w: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Wydawca: IEEE

Presentation: Investigation of reconstruction stability and limitations for combined dithering-compressed-sensing processing of spectral imaging interferometric data in white-light interferometric surface profiling

Autorzy: Ch. Taudt, S. Gruner, P. Hartmann
Opublikowane w: SPIE Photonics West 2023 - OPTO part, 2023
Wydawca: SPIE

Conference Presentation: Determination of protection capabilities of selected polymers against atmospheric corrosion in harsh environments

Autorzy: J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Opublikowane w: EUROCORR 2021, 2021
Wydawca: European Federation of Corrosion

Poster: Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

Autorzy: D. Kostynski, S. Sack, M. Sievers
Opublikowane w: 12th International Conference on Integrated Power Electronics Systems, 2022
Wydawca: ETG Energietechnische Gesellschaft im VDE

Poster: Implementation of a new heating stage for in-situ LIBS analysis of temperature induced processes

Autorzy: Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Opublikowane w: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Wydawca: EWCPS

Presentation: Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Autorzy: J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Opublikowane w: AOFKA 2021, 2021
Wydawca: Chemnitz University of Technology

Poster: Investigation of metal diffusion into polymer films by measurement of quantitative LA-ICP-MS depth profiles

Autorzy: Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Opublikowane w: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Wydawca: EWCPS

Poster: Simulation driven investigation of production and aging related thermo-mechanical effects for the behavior of a SO16 System-in-Package sensor

Autorzy: Heiner Moeller, Heiko Knoll, Pascal Hille, Sven Rzepka
Opublikowane w: Smart Systems Integration Conference and Exhibition 2023, 2023
Wydawca: EPoss

Presentation: Virtual Design for Life Time optimization of M2X Modules – A Use Case from the IRel40 project

Autorzy: Thomas Krivec et al.
Opublikowane w: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Wydawca: IEEE

Poster: Spectrally resolved temporal coherence of spectrally narrowband filtered high-power supercontinuum light source versus an appropriately treated laser-driven plasma light source

Autorzy: Tobias Baselt, Christopher Taudt, Daniel Ruf, Peter Hartmann
Opublikowane w: SPIE Photonics West 2023 - Proceedings Volume 12417, Optical Components and Materials XX; 1241716 (2023), 2023
Wydawca: Society of Photo-Optical Instrumentation Engineers
DOI: 10.1117/12.2650033

Conference Presentation: Humidity and temperature dependence of the Sulfur uptake behavior of different polymers examined via LA-ICP-MS depth profile measurements

Autorzy: Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Opublikowane w: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Wydawca: ICP

Presentation: Holistic Testing in iRel40 and Impact on Reliability

Autorzy: Susan Zhao
Opublikowane w: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Wydawca: IEEE

Presentation: AI applied to CSAM Images

Autorzy: Jason Zi Jie Chia et. al.
Opublikowane w: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Wydawca: IEEE

Fast Accurate Defect Detection in Wafer Fabrication

Autorzy: Olschewski, Thomas
Opublikowane w: Numer 1, 2021
Wydawca: TU Dresden

Presentation: Virtual Assessement of Power Packages

Autorzy: Thomas Krivec
Opublikowane w: 8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Wydawca: EPoSS

Poster: Investigating the corrosion behaviour of copper in sulphur containing atmospheres

Autorzy: Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Opublikowane w: Colloquim Spectroscopicum Internationale XLII, 2022
Wydawca: CSI

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Autorzy: L. Du, X. Zhao, P. Watté, R. Poelma, W. Van Driel and G. Zhang
Opublikowane w: 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Wydawca: IEEE
DOI: 10.1109/iecon49645.2022.9968578

The H2020-ECSEL Project “iRel40” (Intelligent Reliability 4.0)

Autorzy: Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Opublikowane w: 2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Strona(/y) 311-318, ISBN 978-1-6654-2703-6
Wydawca: IEEE
DOI: 10.1109/dsd53832.2021.00054

Data-Centric Model Development to Improve the CNN Classification of Defect Density SEM Images

Autorzy: C. Kofler, C. A. Dohr, J. Dohr and A. Zernig
Opublikowane w: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Wydawca: IEEE
DOI: 10.1109/iecon49645.2022.9968911

Ab initio derived force field potential for the accurate simulation of thermal transport in AlN

Autorzy: S. Fernbach, E. Kraker and N. Bedoya-Martínez
Opublikowane w: nternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Wydawca: IEEE
DOI: 10.1109/eurosime56861.2023.10100760

Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)

Autorzy: I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer
Opublikowane w: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, ISBN 978-1-6654-8948-5
Wydawca: IEEE
DOI: 10.1109/estc55720.2022.9939400

GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse

Autorzy: F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Opublikowane w: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Wydawca: IEEE
DOI: 10.1109/irps48227.2022.9764510

Super-Twisting Algorithm-based Sliding Mode Observer for Open-Circuit Fault Diagnosis in PWM Voltage Source Inverter in an In-Wheel Motor Drive System

Autorzy: M. Hashemi, M. Stolz and D. Watzenig
Opublikowane w: 2023 IEEE International Conference on Mechatronics (ICM), 2023
Wydawca: IEEE
DOI: 10.1109/icm54990.2023.10102000

Modelling Thermal Fatigue in Power Electronics

Autorzy: Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Opublikowane w: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Wydawca: IEEE
DOI: 10.1109/eurosime54907.2022.9758893

Size Scaling of Brittle Strength using Multi-Mode Weibull Distribution

Autorzy: S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar
Opublikowane w: "S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar, ""Size Scaling of Brittle Strength usi24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", 2023
Wydawca: IEEE
DOI: 10.1109/eurosime56861.2023.10100803

FPGA implementation of histogram-based thresholding

Autorzy: M. Hagara, P. Kubinec, A. Šatka and R. Stojanović
Opublikowane w: 11th Mediterranean Conference on Embedded Computing (MECO), 2022
Wydawca: IEEE
DOI: 10.1109/meco55406.2022.9797132

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Autorzy: Fahimeh Emadi; Vesa Vuorinen; Mervi Paulasto-Krockel
Opublikowane w: Electronics System-Integration Technology Conference (ESTC), Numer 1, 2022
Wydawca: IEEE
DOI: 10.1109/estc55720.2022.9939539

On suitability of the customized measuring device for electric motor

Autorzy: Rok Hribar; Gasper Petelin; Margarita Antoniou; Anton Biasizzo; Stanko Ciglaric; Gregor Papa
Opublikowane w: Annual Conference of Industrial Electronics Society, 2022., Numer 1, 2022
Wydawca: IEEE
DOI: 10.1109/iecon49645.2022.9968876

Influence of the quality of material models on warpage and lifetime prediction by finite element simulation

Autorzy: J. Zündel, M. Weninger, T. Krivec, M. Frewein and S. Waschnig
Opublikowane w: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Wydawca: IEEE
DOI: 10.1109/eurosime56861.2023.10100777

An AI-based Architecture Framework for Improving End-of-line Reliability Tests of Electric Motors

Autorzy: Müjdat Soytürk; Kutalmış Coşkun; Onur İzmitlioğlu; Borahan Tümer; Deniz Güneş; Sinan Saraçoğlu; Barış Bulut; Hasan Burak Ketmen; İsmethan Hanedar; Taşemir Aşan; Eray Aydın
Opublikowane w: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Wydawca: IEEE
DOI: 10.1109/iecon49645.2022.9968853

Depth-Resolved LA-ICP-MS investigations for the Determination of Diffusion Coefficients of SO2 in thin Polymer films

Autorzy: Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Opublikowane w: European Workshop on laser Ablation Poster Abstracts, 2022
Wydawca: University of Bern

Monitoring Degradation of Insulated Gate Bipolar Transistors in Induction Cooktops by Artificial Neural Networks

Autorzy: Chenyang Lai, Piero Baralid, Ibrahim Ahmed, Enrico Zio, Alejandro del Cueto, Javier Gil, Sergio Llorente
Opublikowane w: Proceedings of the 32nd European Safety and Reliability Conference (ESREL), 2022
Wydawca: Research Publishing, Singapore

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Autorzy: M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Opublikowane w: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Wydawca: IEEE
DOI: 10.1109/eurosime54907.2022.9758866

Reliability of Electronic Drivers: An Industrial Approach

Autorzy: P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Opublikowane w: 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Wydawca: IEEE
DOI: 10.1109/sslchinaifws54608.2021.9675170

Optical pulse generation in nanosecond range with conventional high-power LED modules for metrology and calibration purposes

Autorzy: E. Kabardiadi-Virkovski, A. Kabardiadi-Virkovski P. Hartmann
Opublikowane w: SPIE Photonics West 2023 - OPTO part, 2023
Wydawca: SPIE
DOI: 10.1117/12.2649796

Reliability of Electronic Drivers: An Industrial Approach

Autorzy: P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Opublikowane w: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Wydawca: ASME
DOI: 10.1115/ipack2021-72293

An Unsupervised Method for Anomaly Detection in Multi-Stage Production Systems Based on LSTM Autoencoders

Autorzy: Fatemeh Hosseinpour, Ibrahim Ahmed, Piero Baraldi, Mehdi Behzad, Enrico Zio, Horst Lewitschnig
Opublikowane w: Proceedings of the 32nd European Safety and Reliability Conference (ESREL 2022), 2022
Wydawca: Research Publishing, Singapore

Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach

Autorzy: H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka
Opublikowane w: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Wydawca: IEEE
DOI: 10.1109/estc55720.2022.9939391

Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Autorzy: J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Opublikowane w: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Strona(/y) 1-7, ISBN 978-1-6654-1373-2
Wydawca: IEEE
DOI: 10.1109/eurosime52062.2021.9410833

Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition

Autorzy: M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Opublikowane w: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Wydawca: IEEE
DOI: 10.1109/irps48227.2022.9764592

ReliaVision: In-circuit transistor reliability investigation using XML-based technology reliability information in PDKs

Autorzy: Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Opublikowane w: IEEE International Integrated Reliability Workshop (IIRW), 2021
Wydawca: IEEE
DOI: 10.1109/iirw53245.2021.9635606

Dopant Incomplete Ionization Role in SiC Schottky Diode Edge Termination under Current Over-Stress

Autorzy: O. Aviñó, F. Bonet, M. Vellvehí, P. Godignon, X. Jordà and X. Perpiñà
Opublikowane w: IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe), 2022
Wydawca: IEEE
DOI: 10.1109/wipdaeurope55971.2022.9936256

Prognostics and Health Management for Power Electronics and Electrical Power Systems

Autorzy: Robert Ross
Opublikowane w: International Conference on Condition Monitoring and Diagnosis (CMD), 2022
Wydawca: IEEE
DOI: 10.23919/cmd54214.2022.9991683

Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Autorzy: J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Opublikowane w: Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Wydawca: TU Chemnitz and TU Bergakademie Freiberg

Assets’ Reliability Management Model for a Decision Making in Different Operational Contexts

Autorzy: Uribetxebarria, J., Zubizarreta, A., Rodríguez, Á., Leturiondo, U.
Opublikowane w: WCEAM Proceedings. WCEAM 2022. Lecture Notes in Mechanical Engineering, 2023
Wydawca: Springer
DOI: 10.1007/978-3-031-25448-2_3

A Multi-Channel System for Active Thermal Cycling of Discrete Power Semiconductors Based on Mission Profiles

Autorzy: D. Kostynski, S. Sack, P. Kolter and M. Glavanovics
Opublikowane w: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Wydawca: IEEE
DOI: 10.1109/asdam55965.2022.9966759

A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing

Autorzy: Mustafa Onur Izmitlioglu, Mujdat Soyturk
Opublikowane w: A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing, 2022
Wydawca: IEEE

Reliability of LED-based Systems

Autorzy: Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Opublikowane w: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Strona(/y) 1-4, ISBN 978-1-6654-1373-2
Wydawca: IEEE
DOI: 10.1109/eurosime52062.2021.9410861

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

Autorzy: F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen and M. Paulasto-Kröckel
Opublikowane w: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Wydawca: IEEE
DOI: 10.1109/asdam55965.2022.9966765

Reliability along the Value Chain – from Chip to Board/System

Autorzy: K. Pressel and J. Moser
Opublikowane w: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Wydawca: IEEE
DOI: 10.1109/asdam55965.2022.9966780

A novel approach to analyze the reliability of GaN power HEMTs operating in a DC-DC Buck converter

Autorzy: G. Capasso, M. Zanuccoli, A. N. Tallarico and C. Fiegna
Opublikowane w: IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Wydawca: IEEE
DOI: 10.1109/essderc55479.2022.9947200

Analysis and Design of a Fully-Integrated Pulsed LiDAR Driver in 100V-GaN IC Technology

Autorzy: Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Opublikowane w: 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Wydawca: IEEE
DOI: 10.1109/prime55000.2022.9816827

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Autorzy: M. Weninger, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst
Opublikowane w: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Wydawca: IEEE
DOI: 10.1109/eurosime56861.2023.10100800

POWER SIC MOSFET UNDER REPETITIVE UIS AND SHORT CIRCUIT STRESS

Autorzy: J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Opublikowane w: Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Wydawca: University of Zilina in EDIS-Publishing Centre of UZ

Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

Autorzy: A. Chvála, J. Marek, A. Šatka and J. Chen
Opublikowane w: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Wydawca: IEEE
DOI: 10.1109/asdam55965.2022.9966769

A Method Based on Gaussian Process Regression for Modelling Burn-in of Semiconductor Devices

Autorzy: Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Opublikowane w: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Strona(/y) 2619-2626, ISBN 978-981-18-2016-8
Wydawca: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_763-cd

A Robust Approach for Inter-Turn Fault Detection of PMSM Used for Autonomous Vehicles

Autorzy: Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Opublikowane w: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Wydawca: IEEE
DOI: 10.1109/iccve52871.2022.9742916

Two Algorithms for Defect Detection in Wafer Fabricatio

Autorzy: Thomas Olschewski
Opublikowane w: The 33rd European Safety and Reliability Conference (ESREL 2023), 2023
Wydawca: ESREL
DOI: 10.3850/978-981-18-8071-1_p237-cd

Reliable force field potential for modelling thermal transport in AlN

Autorzy: S. Fernbach, E. Kraker, E. Zojer, N. Bedoya-Martinez
Opublikowane w: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2022
Wydawca: IEEE
DOI: 10.1109/therminic57263.2022.9950668

Microstructural Degradation Investigations of OFF-State Stressed 0.15 μm RF AlGaN/GaN HEMTs: Failure Mode related Breakdown

Autorzy: Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Opublikowane w: IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Wydawca: IEEE
DOI: 10.1109/wipda49284.2021.9645151

A Framework for the Determination of realistic Usage Profiles for Automated Shuttle Pods

Autorzy: Stephanie Grubmüller; Pamela Innerwinkler
Opublikowane w: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Wydawca: IEEE
DOI: 10.1109/iccve52871.2022.9742765

SAC305 solder fatigue crack propagation under 3-point bending cycle test condition

Autorzy: M. Zhang, J. Heilmann, Y. Sing Chan, M. Richard Niessner, P. Altieri-Weimar and B. Wunderle
Opublikowane w: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Wydawca: IEEE
DOI: 10.1109/estc55720.2022.9939510

Towards Realization of a Low-Voltage Class-AB VCII with High Current Drive Capability

Autorzy: Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Opublikowane w: electronics, 2021, ISSN 2079-9292
Wydawca: MDPI
DOI: 10.3390/electronics10182303

Modified algorithm of unimodal thresholding for FPGA implementation

Autorzy: Miroslav Hagara, Radovan Stojanović, Alexander Šatka, Peter Kubinec, Oldřich Ondráček,
Opublikowane w: Microprocessors and Microsystems,, Numer 01419331, 2022, ISSN 0141-9331
Wydawca: Elsevier BV
DOI: 10.1016/j.micpro.2022.104669

Study of the influence of gate etching and passivation on current dispersion, trapping and reliability in RF 0.15 μm AlGaN/GaN HEMTs

Autorzy: F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, A. Gerosa, G. Meneghesso, E. Zanoni, M. Meneghini
Opublikowane w: Microelectronics Reliability, Numer 00262714, 2022, ISSN 0026-2714
Wydawca: Elsevier BV
DOI: 10.1016/j.microrel.2022.114735

A Review on Machine and Deep Learning for Semiconductor Defect Classification in Scanning Electron Microscope Images

Autorzy: López de la Rosa, F.; Sánchez-Reolid, R.; Gómez-Sirvent, J.L.; Morales, R.; Fernández-Caballero, A.
Opublikowane w: applied science, Numer 20763417, 2021, ISSN 2076-3417
Wydawca: MDPI
DOI: 10.3390/app11209508

Facial Emotion Recognition from an Unmanned Flying Social Robot for Home Care of Dependent People

Autorzy: Anselmo Martínez; Lidia M. Belmonte; Arturo S. García; Antonio Fernández-Caballero; Rafael Morales
Opublikowane w: Electronics, Vol 10, Iss 868, p 868 (2021), Numer 3, 2021, ISSN 2079-9292
Wydawca: MDPI
DOI: 10.3390/electronics10070868

High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs

Autorzy: M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Opublikowane w: IEEE Transactions on Electron Devices, 2021, Strona(/y) 1-6, ISSN 0018-9383
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3111144

An empirical evaluation of the use of models to improve the understanding of safety compliance needs

Autorzy: Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Opublikowane w: Information and Software Technology, Numer 126, 2020, Strona(/y) 106351, ISSN 0950-5849
Wydawca: Elsevier BV
DOI: 10.1016/j.infsof.2020.106351

GaN-based power devices: Physics, reliability, and perspectives

Autorzy: Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Opublikowane w: Journal of Applied Physics, 2021, ISSN 0021-8979
Wydawca: American Institute of Physics
DOI: 10.1063/5.0061354

Giant Magneto-Resistive (GMR) Sensors for Non-Contacting Partial Discharge Detection

Autorzy: Y. Chen, L. C. C. Heredia, J. J. Smit, M. G. Niasar and R. Ross
Opublikowane w: Transactions on Instrumentation and Measurement,, 2023, ISSN 1557-9662
Wydawca: IEEE
DOI: 10.1109/tim.2023.3268485

The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs

Autorzy: M. Millesimo; M. Borga; B. Bakeroot; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Opublikowane w: IEEE Electron Device Letters, 2022, ISSN 1558-0563
Wydawca: IEEE
DOI: 10.1109/led.2022.3206610

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes Under Current Crowding

Autorzy: F. Bonet, O. Aviñó-Salvadó, M. Vellvehi, X. Jordà, P. Godignon and X. Perpiñà
Opublikowane w: Electron Device Letters, 2022, ISSN 1558-0563
Wydawca: IEEE
DOI: 10.1109/led.2022.3171112

UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips

Autorzy: Joshua Lommes, Gesa Patzelt, Volkmar Stenzel,
Opublikowane w: Microelectronics Engineering, 2023, ISSN 0167-9317
Wydawca: Elsevier BV
DOI: 10.1016/j.mee.2023.112014

Generalised Proportional Integral Control for Magnetic Levitation Systems Using a Tangent Linearisation Approach

Autorzy: Lidia M. Belmonte; Eva Segura; Antonio Fernández-Caballero; José A. Somolinos; Rafael Morales
Opublikowane w: Mathematics, Vol 9, Iss 1424, p 1424 (2021), Numer 3, 2021, ISSN 2227-7390
Wydawca: MDPI (Multidisciplinary Digital Publishing Institute)
DOI: 10.3390/math9121424

A versatile approach for the preparation of matrix-matched standards for LA-ICP-MS analysis – Standard addition by the spraying of liquid standards

Autorzy: Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, Andreas Limbeck
Opublikowane w: Talanta, 2023, ISSN 0039-9140
Wydawca: Elsevier BV
DOI: 10.1016/j.talanta.2023.124305

Feeling of Safety and Comfort towards a Socially Assistive Unmanned Aerial Vehicle That Monitors People in a Virtual Home

Autorzy: Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Opublikowane w: Sensors, Numer 21/3, 2021, Strona(/y) 908, ISSN 1424-8220
Wydawca: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s21030908

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

Autorzy: F. Emadi; V. Vuorinen; G. Ross; M. Paulasto-Kröckel
Opublikowane w: Materials Science & Engineering: A, Numer 2, 2023, ISSN 0921-5093
Wydawca: Elsevier BV
DOI: 10.1016/j.msea.2023.145398

Geometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a ResNet50 convolutional neural network

Autorzy: Francisco López de la Rosa, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, Antonio Fernández-Caballero,
Opublikowane w: Expert Systems with Applications, Numer 09574174, 2022, ISSN 0957-4174
Wydawca: Pergamon Press Ltd.
DOI: 10.1016/j.eswa.2022.117731

TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs

Autorzy: A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Opublikowane w: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3134928

A deep residual neural network for semiconductor defect classification in imbalanced scanning electron microscope datasets

Autorzy: Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero,
Opublikowane w: Applied Soft Computing, Numer 15684946, 2022, ISSN 1568-4946
Wydawca: Elsevier BV
DOI: 10.1016/j.asoc.2022.109743

An Empirical Evaluation of Enhanced Performance Softmax Function in Deep Learning

Autorzy: S. Mehra, G. Raut, R. D. Purkayastha, S. K. Vishvakarma and A. Biasizzo
Opublikowane w: IEEE Access, 2023, ISSN 2169-3536
Wydawca: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2023.3265327

A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology

Autorzy: Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt
Opublikowane w: IEEE Electron Device Letters, 2023, ISSN 0741-3106
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2023.3268334

Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet

Autorzy: Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero
Opublikowane w: Computers & Industrial Engineering, 2023, ISSN 0360-8352
Wydawca: Pergamon Press Ltd.
DOI: 10.1016/j.cie.2023.109549

Compact Modeling of Non-Ideal Trapping/Detrapping Processes in GaN Power Devices

Autorzy: N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Opublikowane w: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3184622

Comprehensive Degradation Analysis of NCA Li-Ion Batteries via Methods of Electrochemical Characterisation for Various Stress-Inducing Scenarios

Autorzy: Martin Kemeny, Peter Ondrejka, Miroslav Mikolasek
Opublikowane w: Batteries, 2023, ISSN 2313-0105
Wydawca: MDPI
DOI: 10.3390/batteries9010033

Learning under concept drift and non-stationary noise: Introduction of the concept of persistence

Autorzy: Kutalmış Coşkun, Borahan Tümer
Opublikowane w: Engineering Applications of Artificial Intelligence, 2023, ISSN 0952-1976
Wydawca: Pergamon Press Ltd.
DOI: 10.1016/j.engappai.2023.106363

Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs

Autorzy: N. Modoloa, M. Fregolent, F. Masin, A. Benato, A. Bettini, M. Buffolo, C. De Santi, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, D. Vogrig, A. Neviani, G. Meneghesso, E. Zanoni, M. Meneghini
Opublikowane w: Microelectronics Reliability, Numer 00262714, 2022, ISSN 0026-2714
Wydawca: Elsevier BV
DOI: 10.1016/j.microrel.2022.114708

A Syntactic Pattern Recognition Based Approach to Online Anomaly Detection and Identification on Electric Motors

Autorzy: Coşkun, K., Kumralbaş, Z., Çavuş, H., Tümer, B.
Opublikowane w: Pattern Recognition. DAGM GCPR 2022. Lecture Notes in Computer Science, 2022
Wydawca: Springer
DOI: 10.1007/978-3-031-16788-1_8

Anomaly Detection using Audio Signals

Autorzy: B.S.Çağlar, H.B.Ketmen, B. Bulut
Opublikowane w: International Aegean Scientific Research Symposium 2021 Proceedings Book, 2022, ISBN 978-605-74014-2-7
Wydawca: Kocaeli University

Reliability and Failures in Solid State Lighting Systems

Autorzy: W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Opublikowane w: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Wydawca: Springer
DOI: 10.1007/978-3-030-81576-9_7

A Proposal for the Classification of Methods for Verification and Validation of Safety, Cybersecurity, and Privacy of Automated Systems.

Autorzy: Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Opublikowane w: Communications in Computer and Information Science, Numer 2, 2021, ISBN 9783030853464
Wydawca: Springer Nature Switzerland AG
DOI: 10.1007/978-3-030-85347-1_24

Outlook: From Physics of Failure to Physics of Degradation

Autorzy: W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Opublikowane w: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Strona(/y) 535–538
Wydawca: Springer
DOI: 10.1007/978-3-030-81576-9_17

Rezultaty

Publikacje

Udostępnij tę stronę

Pobierz