Resultado final
Report on all recent news and activities from the project
Communication channels and project websiteProject website and communication channels (Social Media and others)
Publicaciones
Autores:
Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Publicado en:
22nd Winter Conference on Plasma Spectrochemistry, 2022
Editor:
ICP
Autores:
Lukas, Brunnbauer, Jakob Willner, Günter Fafilek, Silvia Larisegger, Andreas Limbeck
Publicado en:
European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editor:
EWCPS
Autores:
Fabio A. Velarde Gonzalez, Lukas Hahne, Katrin Ortstein, André Lange, Sonja Crocoll
Publicado en:
26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, 2023
Editor:
IEEE
Autores:
Heiko Knoll, Pascal Hille, Lukas Rauber, Matthias Brusius
Publicado en:
16. XMR-Symposium, 2023
Editor:
Sensitec
Autores:
Thomas Olschewski
Publicado en:
arXiv, 2021
Editor:
TUDresden
DOI:
10.48550/arxiv.2111.03727
Autores:
Klaus Pressel
Publicado en:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
Autores:
Ch. Taudt, S. Gruner, P. Hartmann
Publicado en:
SPIE Photonics West 2023 - OPTO part, 2023
Editor:
SPIE
Autores:
J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Publicado en:
EUROCORR 2021, 2021
Editor:
European Federation of Corrosion
Autores:
D. Kostynski, S. Sack, M. Sievers
Publicado en:
12th International Conference on Integrated Power Electronics Systems, 2022
Editor:
ETG Energietechnische Gesellschaft im VDE
Autores:
Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Publicado en:
European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editor:
EWCPS
Autores:
J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Publicado en:
AOFKA 2021, 2021
Editor:
Chemnitz University of Technology
Autores:
Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Publicado en:
European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editor:
EWCPS
Autores:
Heiner Moeller, Heiko Knoll, Pascal Hille, Sven Rzepka
Publicado en:
Smart Systems Integration Conference and Exhibition 2023, 2023
Editor:
EPoss
Autores:
Thomas Krivec et al.
Publicado en:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
Autores:
Tobias Baselt, Christopher Taudt, Daniel Ruf, Peter Hartmann
Publicado en:
SPIE Photonics West 2023 - Proceedings Volume 12417, Optical Components and Materials XX; 1241716 (2023), 2023
Editor:
Society of Photo-Optical Instrumentation Engineers
DOI:
10.1117/12.2650033
Autores:
Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Publicado en:
22nd Winter Conference on Plasma Spectrochemistry, 2022
Editor:
ICP
Autores:
Susan Zhao
Publicado en:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
Autores:
Jason Zi Jie Chia et. al.
Publicado en:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
Autores:
Olschewski, Thomas
Publicado en:
Edición 1, 2021
Editor:
TU Dresden
Autores:
Thomas Krivec
Publicado en:
8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Editor:
EPoSS
Autores:
Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Publicado en:
Colloquim Spectroscopicum Internationale XLII, 2022
Editor:
CSI
Autores:
L. Du, X. Zhao, P. Watté, R. Poelma, W. Van Driel and G. Zhang
Publicado en:
48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editor:
IEEE
DOI:
10.1109/iecon49645.2022.9968578
Autores:
Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Publicado en:
2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Página(s) 311-318, ISBN 978-1-6654-2703-6
Editor:
IEEE
DOI:
10.1109/dsd53832.2021.00054
Autores:
C. Kofler, C. A. Dohr, J. Dohr and A. Zernig
Publicado en:
IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editor:
IEEE
DOI:
10.1109/iecon49645.2022.9968911
Autores:
S. Fernbach, E. Kraker and N. Bedoya-Martínez
Publicado en:
nternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editor:
IEEE
DOI:
10.1109/eurosime56861.2023.10100760
Autores:
I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer
Publicado en:
IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, ISBN 978-1-6654-8948-5
Editor:
IEEE
DOI:
10.1109/estc55720.2022.9939400
Autores:
F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Publicado en:
2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Editor:
IEEE
DOI:
10.1109/irps48227.2022.9764510
Autores:
M. Hashemi, M. Stolz and D. Watzenig
Publicado en:
2023 IEEE International Conference on Mechatronics (ICM), 2023
Editor:
IEEE
DOI:
10.1109/icm54990.2023.10102000
Autores:
Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Publicado en:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Editor:
IEEE
DOI:
10.1109/eurosime54907.2022.9758893
Autores:
S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar
Publicado en:
"S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar, ""Size Scaling of Brittle Strength usi24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", 2023
Editor:
IEEE
DOI:
10.1109/eurosime56861.2023.10100803
Autores:
M. Hagara, P. Kubinec, A. Šatka and R. Stojanović
Publicado en:
11th Mediterranean Conference on Embedded Computing (MECO), 2022
Editor:
IEEE
DOI:
10.1109/meco55406.2022.9797132
Autores:
Fahimeh Emadi; Vesa Vuorinen; Mervi Paulasto-Krockel
Publicado en:
Electronics System-Integration Technology Conference (ESTC), Edición 1, 2022
Editor:
IEEE
DOI:
10.1109/estc55720.2022.9939539
Autores:
Rok Hribar; Gasper Petelin; Margarita Antoniou; Anton Biasizzo; Stanko Ciglaric; Gregor Papa
Publicado en:
Annual Conference of Industrial Electronics Society, 2022., Edición 1, 2022
Editor:
IEEE
DOI:
10.1109/iecon49645.2022.9968876
Autores:
J. Zündel, M. Weninger, T. Krivec, M. Frewein and S. Waschnig
Publicado en:
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editor:
IEEE
DOI:
10.1109/eurosime56861.2023.10100777
Autores:
Müjdat Soytürk; Kutalmış Coşkun; Onur İzmitlioğlu; Borahan Tümer; Deniz Güneş; Sinan Saraçoğlu; Barış Bulut; Hasan Burak Ketmen; İsmethan Hanedar; Taşemir Aşan; Eray Aydın
Publicado en:
IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editor:
IEEE
DOI:
10.1109/iecon49645.2022.9968853
Autores:
Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Publicado en:
European Workshop on laser Ablation Poster Abstracts, 2022
Editor:
University of Bern
Autores:
Chenyang Lai, Piero Baralid, Ibrahim Ahmed, Enrico Zio, Alejandro del Cueto, Javier Gil, Sergio Llorente
Publicado en:
Proceedings of the 32nd European Safety and Reliability Conference (ESREL), 2022
Editor:
Research Publishing, Singapore
Autores:
M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Publicado en:
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Editor:
IEEE
DOI:
10.1109/eurosime54907.2022.9758866
Autores:
P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Publicado en:
18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Editor:
IEEE
DOI:
10.1109/sslchinaifws54608.2021.9675170
Autores:
E. Kabardiadi-Virkovski, A. Kabardiadi-Virkovski P. Hartmann
Publicado en:
SPIE Photonics West 2023 - OPTO part, 2023
Editor:
SPIE
DOI:
10.1117/12.2649796
Autores:
P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Publicado en:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Editor:
ASME
DOI:
10.1115/ipack2021-72293
Autores:
Fatemeh Hosseinpour, Ibrahim Ahmed, Piero Baraldi, Mehdi Behzad, Enrico Zio, Horst Lewitschnig
Publicado en:
Proceedings of the 32nd European Safety and Reliability Conference (ESREL 2022), 2022
Editor:
Research Publishing, Singapore
Autores:
H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka
Publicado en:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
DOI:
10.1109/estc55720.2022.9939391
Autores:
J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Publicado en:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Página(s) 1-7, ISBN 978-1-6654-1373-2
Editor:
IEEE
DOI:
10.1109/eurosime52062.2021.9410833
Autores:
M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Publicado en:
2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Editor:
IEEE
DOI:
10.1109/irps48227.2022.9764592
Autores:
Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Publicado en:
IEEE International Integrated Reliability Workshop (IIRW), 2021
Editor:
IEEE
DOI:
10.1109/iirw53245.2021.9635606
Autores:
O. Aviñó, F. Bonet, M. Vellvehí, P. Godignon, X. Jordà and X. Perpiñà
Publicado en:
IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe), 2022
Editor:
IEEE
DOI:
10.1109/wipdaeurope55971.2022.9936256
Autores:
Robert Ross
Publicado en:
International Conference on Condition Monitoring and Diagnosis (CMD), 2022
Editor:
IEEE
DOI:
10.23919/cmd54214.2022.9991683
Autores:
J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Publicado en:
Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Editor:
TU Chemnitz and TU Bergakademie Freiberg
Autores:
Uribetxebarria, J., Zubizarreta, A., Rodríguez, Á., Leturiondo, U.
Publicado en:
WCEAM Proceedings. WCEAM 2022. Lecture Notes in Mechanical Engineering, 2023
Editor:
Springer
DOI:
10.1007/978-3-031-25448-2_3
Autores:
D. Kostynski, S. Sack, P. Kolter and M. Glavanovics
Publicado en:
14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor:
IEEE
DOI:
10.1109/asdam55965.2022.9966759
Autores:
Mustafa Onur Izmitlioglu, Mujdat Soyturk
Publicado en:
A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing, 2022
Editor:
IEEE
Autores:
Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Publicado en:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Página(s) 1-4, ISBN 978-1-6654-1373-2
Editor:
IEEE
DOI:
10.1109/eurosime52062.2021.9410861
Autores:
F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen and M. Paulasto-Kröckel
Publicado en:
14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor:
IEEE
DOI:
10.1109/asdam55965.2022.9966765
Autores:
K. Pressel and J. Moser
Publicado en:
14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor:
IEEE
DOI:
10.1109/asdam55965.2022.9966780
Autores:
G. Capasso, M. Zanuccoli, A. N. Tallarico and C. Fiegna
Publicado en:
IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Editor:
IEEE
DOI:
10.1109/essderc55479.2022.9947200
Autores:
Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Publicado en:
17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Editor:
IEEE
DOI:
10.1109/prime55000.2022.9816827
Autores:
M. Weninger, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst
Publicado en:
24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editor:
IEEE
DOI:
10.1109/eurosime56861.2023.10100800
Autores:
J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Publicado en:
Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Editor:
University of Zilina in EDIS-Publishing Centre of UZ
Autores:
A. Chvála, J. Marek, A. Šatka and J. Chen
Publicado en:
14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor:
IEEE
DOI:
10.1109/asdam55965.2022.9966769
Autores:
Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Publicado en:
Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Página(s) 2619-2626, ISBN 978-981-18-2016-8
Editor:
Research Publishing Services
DOI:
10.3850/978-981-18-2016-8_763-cd
Autores:
Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Publicado en:
2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Editor:
IEEE
DOI:
10.1109/iccve52871.2022.9742916
Autores:
Thomas Olschewski
Publicado en:
The 33rd European Safety and Reliability Conference (ESREL 2023), 2023
Editor:
ESREL
DOI:
10.3850/978-981-18-8071-1_p237-cd
Autores:
S. Fernbach, E. Kraker, E. Zojer, N. Bedoya-Martinez
Publicado en:
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2022
Editor:
IEEE
DOI:
10.1109/therminic57263.2022.9950668
Autores:
Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Publicado en:
IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Editor:
IEEE
DOI:
10.1109/wipda49284.2021.9645151
Autores:
Stephanie Grubmüller; Pamela Innerwinkler
Publicado en:
2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Editor:
IEEE
DOI:
10.1109/iccve52871.2022.9742765
Autores:
M. Zhang, J. Heilmann, Y. Sing Chan, M. Richard Niessner, P. Altieri-Weimar and B. Wunderle
Publicado en:
IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor:
IEEE
DOI:
10.1109/estc55720.2022.9939510
Autores:
Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Publicado en:
electronics, 2021, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics10182303
Autores:
Miroslav Hagara, Radovan Stojanović, Alexander Šatka, Peter Kubinec, Oldřich Ondráček,
Publicado en:
Microprocessors and Microsystems,, Edición 01419331, 2022, ISSN 0141-9331
Editor:
Elsevier BV
DOI:
10.1016/j.micpro.2022.104669
Autores:
F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, A. Gerosa, G. Meneghesso, E. Zanoni, M. Meneghini
Publicado en:
Microelectronics Reliability, Edición 00262714, 2022, ISSN 0026-2714
Editor:
Elsevier BV
DOI:
10.1016/j.microrel.2022.114735
Autores:
López de la Rosa, F.; Sánchez-Reolid, R.; Gómez-Sirvent, J.L.; Morales, R.; Fernández-Caballero, A.
Publicado en:
applied science, Edición 20763417, 2021, ISSN 2076-3417
Editor:
MDPI
DOI:
10.3390/app11209508
Autores:
Anselmo Martínez; Lidia M. Belmonte; Arturo S. García; Antonio Fernández-Caballero; Rafael Morales
Publicado en:
Electronics, Vol 10, Iss 868, p 868 (2021), Edición 3, 2021, ISSN 2079-9292
Editor:
MDPI
DOI:
10.3390/electronics10070868
Autores:
M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Publicado en:
IEEE Transactions on Electron Devices, 2021, Página(s) 1-6, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2021.3111144
Autores:
Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Publicado en:
Information and Software Technology, Edición 126, 2020, Página(s) 106351, ISSN 0950-5849
Editor:
Elsevier BV
DOI:
10.1016/j.infsof.2020.106351
Autores:
Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Publicado en:
Journal of Applied Physics, 2021, ISSN 0021-8979
Editor:
American Institute of Physics
DOI:
10.1063/5.0061354
Autores:
Y. Chen, L. C. C. Heredia, J. J. Smit, M. G. Niasar and R. Ross
Publicado en:
Transactions on Instrumentation and Measurement,, 2023, ISSN 1557-9662
Editor:
IEEE
DOI:
10.1109/tim.2023.3268485
Autores:
M. Millesimo; M. Borga; B. Bakeroot; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Publicado en:
IEEE Electron Device Letters, 2022, ISSN 1558-0563
Editor:
IEEE
DOI:
10.1109/led.2022.3206610
Autores:
F. Bonet, O. Aviñó-Salvadó, M. Vellvehi, X. Jordà, P. Godignon and X. Perpiñà
Publicado en:
Electron Device Letters, 2022, ISSN 1558-0563
Editor:
IEEE
DOI:
10.1109/led.2022.3171112
Autores:
Joshua Lommes, Gesa Patzelt, Volkmar Stenzel,
Publicado en:
Microelectronics Engineering, 2023, ISSN 0167-9317
Editor:
Elsevier BV
DOI:
10.1016/j.mee.2023.112014
Autores:
Lidia M. Belmonte; Eva Segura; Antonio Fernández-Caballero; José A. Somolinos; Rafael Morales
Publicado en:
Mathematics, Vol 9, Iss 1424, p 1424 (2021), Edición 3, 2021, ISSN 2227-7390
Editor:
MDPI (Multidisciplinary Digital Publishing Institute)
DOI:
10.3390/math9121424
Autores:
Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, Andreas Limbeck
Publicado en:
Talanta, 2023, ISSN 0039-9140
Editor:
Elsevier BV
DOI:
10.1016/j.talanta.2023.124305
Autores:
Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Publicado en:
Sensors, Edición 21/3, 2021, Página(s) 908, ISSN 1424-8220
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s21030908
Autores:
F. Emadi; V. Vuorinen; G. Ross; M. Paulasto-Kröckel
Publicado en:
Materials Science & Engineering: A, Edición 2, 2023, ISSN 0921-5093
Editor:
Elsevier BV
DOI:
10.1016/j.msea.2023.145398
Autores:
Francisco López de la Rosa, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, Antonio Fernández-Caballero,
Publicado en:
Expert Systems with Applications, Edición 09574174, 2022, ISSN 0957-4174
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.eswa.2022.117731
Autores:
A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Publicado en:
IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2021.3134928
Autores:
Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero,
Publicado en:
Applied Soft Computing, Edición 15684946, 2022, ISSN 1568-4946
Editor:
Elsevier BV
DOI:
10.1016/j.asoc.2022.109743
Autores:
S. Mehra, G. Raut, R. D. Purkayastha, S. K. Vishvakarma and A. Biasizzo
Publicado en:
IEEE Access, 2023, ISSN 2169-3536
Editor:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/access.2023.3265327
Autores:
Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt
Publicado en:
IEEE Electron Device Letters, 2023, ISSN 0741-3106
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/led.2023.3268334
Autores:
Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero
Publicado en:
Computers & Industrial Engineering, 2023, ISSN 0360-8352
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.cie.2023.109549
Autores:
N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Publicado en:
IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/ted.2022.3184622
Autores:
Martin Kemeny, Peter Ondrejka, Miroslav Mikolasek
Publicado en:
Batteries, 2023, ISSN 2313-0105
Editor:
MDPI
DOI:
10.3390/batteries9010033
Autores:
Kutalmış Coşkun, Borahan Tümer
Publicado en:
Engineering Applications of Artificial Intelligence, 2023, ISSN 0952-1976
Editor:
Pergamon Press Ltd.
DOI:
10.1016/j.engappai.2023.106363
Autores:
N. Modoloa, M. Fregolent, F. Masin, A. Benato, A. Bettini, M. Buffolo, C. De Santi, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, D. Vogrig, A. Neviani, G. Meneghesso, E. Zanoni, M. Meneghini
Publicado en:
Microelectronics Reliability, Edición 00262714, 2022, ISSN 0026-2714
Editor:
Elsevier BV
DOI:
10.1016/j.microrel.2022.114708
Autores:
Coşkun, K., Kumralbaş, Z., Çavuş, H., Tümer, B.
Publicado en:
Pattern Recognition. DAGM GCPR 2022. Lecture Notes in Computer Science, 2022
Editor:
Springer
DOI:
10.1007/978-3-031-16788-1_8
Autores:
B.S.Çağlar, H.B.Ketmen, B. Bulut
Publicado en:
International Aegean Scientific Research Symposium 2021 Proceedings Book, 2022, ISBN 978-605-74014-2-7
Editor:
Kocaeli University
Autores:
W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Publicado en:
Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Editor:
Springer
DOI:
10.1007/978-3-030-81576-9_7
Autores:
Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Publicado en:
Communications in Computer and Information Science, Edición 2, 2021, ISBN 9783030853464
Editor:
Springer Nature Switzerland AG
DOI:
10.1007/978-3-030-85347-1_24
Autores:
W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Publicado en:
Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Página(s) 535–538
Editor:
Springer
DOI:
10.1007/978-3-030-81576-9_17
Buscando datos de OpenAIRE...
Se ha producido un error en la búsqueda de datos de OpenAIRE
No hay resultados disponibles