Intelligent Reliability 4.0

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Project newsletter No.1, No.2, No. 3

Report on all recent news and activities from the project

Communication channels and project website

Project website and communication channels (Social Media and others)

Publicaciones

Conference Presentation: Quantitative Assessment of Sulfur Uptake from Polymers Aged in Harsh Environments via LA-ICP-MS

Autores: Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Publicado en: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Editor: ICP

Poster: Characterization of the corrosion behavior of copper in sulfur-containing environments using LA-ICP-MS and LIBS

Autores: Lukas, Brunnbauer, Jakob Willner, Günter Fafilek, Silvia Larisegger, Andreas Limbeck
Publicado en: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editor: EWCPS

Poster:

Autores: Fabio A. Velarde Gonzalez, Lukas Hahne, Katrin Ortstein, André Lange, Sonja Crocoll
Publicado en: 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, 2023
Editor: IEEE

Presentation: Concepts for reliability improvements of AMR current sensor devices and modules

Autores: Heiko Knoll, Pascal Hille, Lukas Rauber, Matthias Brusius
Publicado en: 16. XMR-Symposium, 2023
Editor: Sensitec

Preprint: Defect Detection on Semiconductor Wafers by Distribution Analysis

Autores: Thomas Olschewski
Publicado en: arXiv, 2021
Editor: TUDresden
DOI: 10.48550/arxiv.2111.03727

Presentation: Intelligent Manufacturing – From the Chip – Package – Board/System: Impact on reliability

Autores: Klaus Pressel
Publicado en: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE

Presentation: Investigation of reconstruction stability and limitations for combined dithering-compressed-sensing processing of spectral imaging interferometric data in white-light interferometric surface profiling

Autores: Ch. Taudt, S. Gruner, P. Hartmann
Publicado en: SPIE Photonics West 2023 - OPTO part, 2023
Editor: SPIE

Conference Presentation: Determination of protection capabilities of selected polymers against atmospheric corrosion in harsh environments

Autores: J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Publicado en: EUROCORR 2021, 2021
Editor: European Federation of Corrosion

Poster: Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

Autores: D. Kostynski, S. Sack, M. Sievers
Publicado en: 12th International Conference on Integrated Power Electronics Systems, 2022
Editor: ETG Energietechnische Gesellschaft im VDE

Poster: Implementation of a new heating stage for in-situ LIBS analysis of temperature induced processes

Autores: Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Publicado en: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editor: EWCPS

Presentation: Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Autores: J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Publicado en: AOFKA 2021, 2021
Editor: Chemnitz University of Technology

Poster: Investigation of metal diffusion into polymer films by measurement of quantitative LA-ICP-MS depth profiles

Autores: Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Publicado en: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editor: EWCPS

Poster: Simulation driven investigation of production and aging related thermo-mechanical effects for the behavior of a SO16 System-in-Package sensor

Autores: Heiner Moeller, Heiko Knoll, Pascal Hille, Sven Rzepka
Publicado en: Smart Systems Integration Conference and Exhibition 2023, 2023
Editor: EPoss

Presentation: Virtual Design for Life Time optimization of M2X Modules – A Use Case from the IRel40 project

Autores: Thomas Krivec et al.
Publicado en: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE

Poster: Spectrally resolved temporal coherence of spectrally narrowband filtered high-power supercontinuum light source versus an appropriately treated laser-driven plasma light source

Autores: Tobias Baselt, Christopher Taudt, Daniel Ruf, Peter Hartmann
Publicado en: SPIE Photonics West 2023 - Proceedings Volume 12417, Optical Components and Materials XX; 1241716 (2023), 2023
Editor: Society of Photo-Optical Instrumentation Engineers
DOI: 10.1117/12.2650033

Conference Presentation: Humidity and temperature dependence of the Sulfur uptake behavior of different polymers examined via LA-ICP-MS depth profile measurements

Autores: Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Publicado en: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Editor: ICP

Presentation: Holistic Testing in iRel40 and Impact on Reliability

Autores: Susan Zhao
Publicado en: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE

Presentation: AI applied to CSAM Images

Autores: Jason Zi Jie Chia et. al.
Publicado en: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE

Fast Accurate Defect Detection in Wafer Fabrication

Autores: Olschewski, Thomas
Publicado en: Edición 1, 2021
Editor: TU Dresden

Presentation: Virtual Assessement of Power Packages

Autores: Thomas Krivec
Publicado en: 8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Editor: EPoSS

Poster: Investigating the corrosion behaviour of copper in sulphur containing atmospheres

Autores: Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Publicado en: Colloquim Spectroscopicum Internationale XLII, 2022
Editor: CSI

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Autores: L. Du, X. Zhao, P. Watté, R. Poelma, W. Van Driel and G. Zhang
Publicado en: 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editor: IEEE
DOI: 10.1109/iecon49645.2022.9968578

The H2020-ECSEL Project “iRel40” (Intelligent Reliability 4.0)

Autores: Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Publicado en: 2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Página(s) 311-318, ISBN 978-1-6654-2703-6
Editor: IEEE
DOI: 10.1109/dsd53832.2021.00054

Data-Centric Model Development to Improve the CNN Classification of Defect Density SEM Images

Autores: C. Kofler, C. A. Dohr, J. Dohr and A. Zernig
Publicado en: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editor: IEEE
DOI: 10.1109/iecon49645.2022.9968911

Ab initio derived force field potential for the accurate simulation of thermal transport in AlN

Autores: S. Fernbach, E. Kraker and N. Bedoya-Martínez
Publicado en: nternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editor: IEEE
DOI: 10.1109/eurosime56861.2023.10100760

Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)

Autores: I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer
Publicado en: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, ISBN 978-1-6654-8948-5
Editor: IEEE
DOI: 10.1109/estc55720.2022.9939400

GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse

Autores: F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Publicado en: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Editor: IEEE
DOI: 10.1109/irps48227.2022.9764510

Super-Twisting Algorithm-based Sliding Mode Observer for Open-Circuit Fault Diagnosis in PWM Voltage Source Inverter in an In-Wheel Motor Drive System

Autores: M. Hashemi, M. Stolz and D. Watzenig
Publicado en: 2023 IEEE International Conference on Mechatronics (ICM), 2023
Editor: IEEE
DOI: 10.1109/icm54990.2023.10102000

Modelling Thermal Fatigue in Power Electronics

Autores: Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Publicado en: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Editor: IEEE
DOI: 10.1109/eurosime54907.2022.9758893

Size Scaling of Brittle Strength using Multi-Mode Weibull Distribution

Autores: S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar
Publicado en: "S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar, ""Size Scaling of Brittle Strength usi24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", 2023
Editor: IEEE
DOI: 10.1109/eurosime56861.2023.10100803

FPGA implementation of histogram-based thresholding

Autores: M. Hagara, P. Kubinec, A. Šatka and R. Stojanović
Publicado en: 11th Mediterranean Conference on Embedded Computing (MECO), 2022
Editor: IEEE
DOI: 10.1109/meco55406.2022.9797132

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Autores: Fahimeh Emadi; Vesa Vuorinen; Mervi Paulasto-Krockel
Publicado en: Electronics System-Integration Technology Conference (ESTC), Edición 1, 2022
Editor: IEEE
DOI: 10.1109/estc55720.2022.9939539

On suitability of the customized measuring device for electric motor

Autores: Rok Hribar; Gasper Petelin; Margarita Antoniou; Anton Biasizzo; Stanko Ciglaric; Gregor Papa
Publicado en: Annual Conference of Industrial Electronics Society, 2022., Edición 1, 2022
Editor: IEEE
DOI: 10.1109/iecon49645.2022.9968876

Influence of the quality of material models on warpage and lifetime prediction by finite element simulation

Autores: J. Zündel, M. Weninger, T. Krivec, M. Frewein and S. Waschnig
Publicado en: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editor: IEEE
DOI: 10.1109/eurosime56861.2023.10100777

An AI-based Architecture Framework for Improving End-of-line Reliability Tests of Electric Motors

Autores: Müjdat Soytürk; Kutalmış Coşkun; Onur İzmitlioğlu; Borahan Tümer; Deniz Güneş; Sinan Saraçoğlu; Barış Bulut; Hasan Burak Ketmen; İsmethan Hanedar; Taşemir Aşan; Eray Aydın
Publicado en: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editor: IEEE
DOI: 10.1109/iecon49645.2022.9968853

Depth-Resolved LA-ICP-MS investigations for the Determination of Diffusion Coefficients of SO2 in thin Polymer films

Autores: Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Publicado en: European Workshop on laser Ablation Poster Abstracts, 2022
Editor: University of Bern

Monitoring Degradation of Insulated Gate Bipolar Transistors in Induction Cooktops by Artificial Neural Networks

Autores: Chenyang Lai, Piero Baralid, Ibrahim Ahmed, Enrico Zio, Alejandro del Cueto, Javier Gil, Sergio Llorente
Publicado en: Proceedings of the 32nd European Safety and Reliability Conference (ESREL), 2022
Editor: Research Publishing, Singapore

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Autores: M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Publicado en: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Editor: IEEE
DOI: 10.1109/eurosime54907.2022.9758866

Reliability of Electronic Drivers: An Industrial Approach

Autores: P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Publicado en: 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Editor: IEEE
DOI: 10.1109/sslchinaifws54608.2021.9675170

Optical pulse generation in nanosecond range with conventional high-power LED modules for metrology and calibration purposes

Autores: E. Kabardiadi-Virkovski, A. Kabardiadi-Virkovski P. Hartmann
Publicado en: SPIE Photonics West 2023 - OPTO part, 2023
Editor: SPIE
DOI: 10.1117/12.2649796

Reliability of Electronic Drivers: An Industrial Approach

Autores: P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Publicado en: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Editor: ASME
DOI: 10.1115/ipack2021-72293

An Unsupervised Method for Anomaly Detection in Multi-Stage Production Systems Based on LSTM Autoencoders

Autores: Fatemeh Hosseinpour, Ibrahim Ahmed, Piero Baraldi, Mehdi Behzad, Enrico Zio, Horst Lewitschnig
Publicado en: Proceedings of the 32nd European Safety and Reliability Conference (ESREL 2022), 2022
Editor: Research Publishing, Singapore

Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach

Autores: H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka
Publicado en: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE
DOI: 10.1109/estc55720.2022.9939391

Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Autores: J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Publicado en: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Página(s) 1-7, ISBN 978-1-6654-1373-2
Editor: IEEE
DOI: 10.1109/eurosime52062.2021.9410833

Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition

Autores: M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Publicado en: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Editor: IEEE
DOI: 10.1109/irps48227.2022.9764592

ReliaVision: In-circuit transistor reliability investigation using XML-based technology reliability information in PDKs

Autores: Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Publicado en: IEEE International Integrated Reliability Workshop (IIRW), 2021
Editor: IEEE
DOI: 10.1109/iirw53245.2021.9635606

Dopant Incomplete Ionization Role in SiC Schottky Diode Edge Termination under Current Over-Stress

Autores: O. Aviñó, F. Bonet, M. Vellvehí, P. Godignon, X. Jordà and X. Perpiñà
Publicado en: IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe), 2022
Editor: IEEE
DOI: 10.1109/wipdaeurope55971.2022.9936256

Prognostics and Health Management for Power Electronics and Electrical Power Systems

Autores: Robert Ross
Publicado en: International Conference on Condition Monitoring and Diagnosis (CMD), 2022
Editor: IEEE
DOI: 10.23919/cmd54214.2022.9991683

Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Autores: J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Publicado en: Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Editor: TU Chemnitz and TU Bergakademie Freiberg

Assets’ Reliability Management Model for a Decision Making in Different Operational Contexts

Autores: Uribetxebarria, J., Zubizarreta, A., Rodríguez, Á., Leturiondo, U.
Publicado en: WCEAM Proceedings. WCEAM 2022. Lecture Notes in Mechanical Engineering, 2023
Editor: Springer
DOI: 10.1007/978-3-031-25448-2_3

A Multi-Channel System for Active Thermal Cycling of Discrete Power Semiconductors Based on Mission Profiles

Autores: D. Kostynski, S. Sack, P. Kolter and M. Glavanovics
Publicado en: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor: IEEE
DOI: 10.1109/asdam55965.2022.9966759

A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing

Autores: Mustafa Onur Izmitlioglu, Mujdat Soyturk
Publicado en: A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing, 2022
Editor: IEEE

Reliability of LED-based Systems

Autores: Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Publicado en: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Página(s) 1-4, ISBN 978-1-6654-1373-2
Editor: IEEE
DOI: 10.1109/eurosime52062.2021.9410861

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

Autores: F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen and M. Paulasto-Kröckel
Publicado en: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor: IEEE
DOI: 10.1109/asdam55965.2022.9966765

Reliability along the Value Chain – from Chip to Board/System

Autores: K. Pressel and J. Moser
Publicado en: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor: IEEE
DOI: 10.1109/asdam55965.2022.9966780

A novel approach to analyze the reliability of GaN power HEMTs operating in a DC-DC Buck converter

Autores: G. Capasso, M. Zanuccoli, A. N. Tallarico and C. Fiegna
Publicado en: IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Editor: IEEE
DOI: 10.1109/essderc55479.2022.9947200

Analysis and Design of a Fully-Integrated Pulsed LiDAR Driver in 100V-GaN IC Technology

Autores: Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Publicado en: 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Editor: IEEE
DOI: 10.1109/prime55000.2022.9816827

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Autores: M. Weninger, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst
Publicado en: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editor: IEEE
DOI: 10.1109/eurosime56861.2023.10100800

POWER SIC MOSFET UNDER REPETITIVE UIS AND SHORT CIRCUIT STRESS

Autores: J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Publicado en: Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Editor: University of Zilina in EDIS-Publishing Centre of UZ

Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

Autores: A. Chvála, J. Marek, A. Šatka and J. Chen
Publicado en: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editor: IEEE
DOI: 10.1109/asdam55965.2022.9966769

A Method Based on Gaussian Process Regression for Modelling Burn-in of Semiconductor Devices

Autores: Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Publicado en: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Página(s) 2619-2626, ISBN 978-981-18-2016-8
Editor: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_763-cd

A Robust Approach for Inter-Turn Fault Detection of PMSM Used for Autonomous Vehicles

Autores: Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Publicado en: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Editor: IEEE
DOI: 10.1109/iccve52871.2022.9742916

Two Algorithms for Defect Detection in Wafer Fabricatio

Autores: Thomas Olschewski
Publicado en: The 33rd European Safety and Reliability Conference (ESREL 2023), 2023
Editor: ESREL
DOI: 10.3850/978-981-18-8071-1_p237-cd

Reliable force field potential for modelling thermal transport in AlN

Autores: S. Fernbach, E. Kraker, E. Zojer, N. Bedoya-Martinez
Publicado en: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2022
Editor: IEEE
DOI: 10.1109/therminic57263.2022.9950668

Microstructural Degradation Investigations of OFF-State Stressed 0.15 μm RF AlGaN/GaN HEMTs: Failure Mode related Breakdown

Autores: Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Publicado en: IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Editor: IEEE
DOI: 10.1109/wipda49284.2021.9645151

A Framework for the Determination of realistic Usage Profiles for Automated Shuttle Pods

Autores: Stephanie Grubmüller; Pamela Innerwinkler
Publicado en: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Editor: IEEE
DOI: 10.1109/iccve52871.2022.9742765

SAC305 solder fatigue crack propagation under 3-point bending cycle test condition

Autores: M. Zhang, J. Heilmann, Y. Sing Chan, M. Richard Niessner, P. Altieri-Weimar and B. Wunderle
Publicado en: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editor: IEEE
DOI: 10.1109/estc55720.2022.9939510

Towards Realization of a Low-Voltage Class-AB VCII with High Current Drive Capability

Autores: Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Publicado en: electronics, 2021, ISSN 2079-9292
Editor: MDPI
DOI: 10.3390/electronics10182303

Modified algorithm of unimodal thresholding for FPGA implementation

Autores: Miroslav Hagara, Radovan Stojanović, Alexander Šatka, Peter Kubinec, Oldřich Ondráček,
Publicado en: Microprocessors and Microsystems,, Edición 01419331, 2022, ISSN 0141-9331
Editor: Elsevier BV
DOI: 10.1016/j.micpro.2022.104669

Study of the influence of gate etching and passivation on current dispersion, trapping and reliability in RF 0.15 μm AlGaN/GaN HEMTs

Autores: F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, A. Gerosa, G. Meneghesso, E. Zanoni, M. Meneghini
Publicado en: Microelectronics Reliability, Edición 00262714, 2022, ISSN 0026-2714
Editor: Elsevier BV
DOI: 10.1016/j.microrel.2022.114735

A Review on Machine and Deep Learning for Semiconductor Defect Classification in Scanning Electron Microscope Images

Autores: López de la Rosa, F.; Sánchez-Reolid, R.; Gómez-Sirvent, J.L.; Morales, R.; Fernández-Caballero, A.
Publicado en: applied science, Edición 20763417, 2021, ISSN 2076-3417
Editor: MDPI
DOI: 10.3390/app11209508

Facial Emotion Recognition from an Unmanned Flying Social Robot for Home Care of Dependent People

Autores: Anselmo Martínez; Lidia M. Belmonte; Arturo S. García; Antonio Fernández-Caballero; Rafael Morales
Publicado en: Electronics, Vol 10, Iss 868, p 868 (2021), Edición 3, 2021, ISSN 2079-9292
Editor: MDPI
DOI: 10.3390/electronics10070868

High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs

Autores: M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Publicado en: IEEE Transactions on Electron Devices, 2021, Página(s) 1-6, ISSN 0018-9383
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3111144

An empirical evaluation of the use of models to improve the understanding of safety compliance needs

Autores: Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Publicado en: Information and Software Technology, Edición 126, 2020, Página(s) 106351, ISSN 0950-5849
Editor: Elsevier BV
DOI: 10.1016/j.infsof.2020.106351

GaN-based power devices: Physics, reliability, and perspectives

Autores: Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Publicado en: Journal of Applied Physics, 2021, ISSN 0021-8979
Editor: American Institute of Physics
DOI: 10.1063/5.0061354

Giant Magneto-Resistive (GMR) Sensors for Non-Contacting Partial Discharge Detection

Autores: Y. Chen, L. C. C. Heredia, J. J. Smit, M. G. Niasar and R. Ross
Publicado en: Transactions on Instrumentation and Measurement,, 2023, ISSN 1557-9662
Editor: IEEE
DOI: 10.1109/tim.2023.3268485

The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs

Autores: M. Millesimo; M. Borga; B. Bakeroot; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Publicado en: IEEE Electron Device Letters, 2022, ISSN 1558-0563
Editor: IEEE
DOI: 10.1109/led.2022.3206610

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes Under Current Crowding

Autores: F. Bonet, O. Aviñó-Salvadó, M. Vellvehi, X. Jordà, P. Godignon and X. Perpiñà
Publicado en: Electron Device Letters, 2022, ISSN 1558-0563
Editor: IEEE
DOI: 10.1109/led.2022.3171112

UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips

Autores: Joshua Lommes, Gesa Patzelt, Volkmar Stenzel,
Publicado en: Microelectronics Engineering, 2023, ISSN 0167-9317
Editor: Elsevier BV
DOI: 10.1016/j.mee.2023.112014

Generalised Proportional Integral Control for Magnetic Levitation Systems Using a Tangent Linearisation Approach

Autores: Lidia M. Belmonte; Eva Segura; Antonio Fernández-Caballero; José A. Somolinos; Rafael Morales
Publicado en: Mathematics, Vol 9, Iss 1424, p 1424 (2021), Edición 3, 2021, ISSN 2227-7390
Editor: MDPI (Multidisciplinary Digital Publishing Institute)
DOI: 10.3390/math9121424

A versatile approach for the preparation of matrix-matched standards for LA-ICP-MS analysis – Standard addition by the spraying of liquid standards

Autores: Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, Andreas Limbeck
Publicado en: Talanta, 2023, ISSN 0039-9140
Editor: Elsevier BV
DOI: 10.1016/j.talanta.2023.124305

Feeling of Safety and Comfort towards a Socially Assistive Unmanned Aerial Vehicle That Monitors People in a Virtual Home

Autores: Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Publicado en: Sensors, Edición 21/3, 2021, Página(s) 908, ISSN 1424-8220
Editor: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s21030908

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

Autores: F. Emadi; V. Vuorinen; G. Ross; M. Paulasto-Kröckel
Publicado en: Materials Science & Engineering: A, Edición 2, 2023, ISSN 0921-5093
Editor: Elsevier BV
DOI: 10.1016/j.msea.2023.145398

Geometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a ResNet50 convolutional neural network

Autores: Francisco López de la Rosa, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, Antonio Fernández-Caballero,
Publicado en: Expert Systems with Applications, Edición 09574174, 2022, ISSN 0957-4174
Editor: Pergamon Press Ltd.
DOI: 10.1016/j.eswa.2022.117731

TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs

Autores: A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Publicado en: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3134928

A deep residual neural network for semiconductor defect classification in imbalanced scanning electron microscope datasets

Autores: Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero,
Publicado en: Applied Soft Computing, Edición 15684946, 2022, ISSN 1568-4946
Editor: Elsevier BV
DOI: 10.1016/j.asoc.2022.109743

An Empirical Evaluation of Enhanced Performance Softmax Function in Deep Learning

Autores: S. Mehra, G. Raut, R. D. Purkayastha, S. K. Vishvakarma and A. Biasizzo
Publicado en: IEEE Access, 2023, ISSN 2169-3536
Editor: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2023.3265327

A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology

Autores: Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt
Publicado en: IEEE Electron Device Letters, 2023, ISSN 0741-3106
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2023.3268334

Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet

Autores: Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero
Publicado en: Computers & Industrial Engineering, 2023, ISSN 0360-8352
Editor: Pergamon Press Ltd.
DOI: 10.1016/j.cie.2023.109549

Compact Modeling of Non-Ideal Trapping/Detrapping Processes in GaN Power Devices

Autores: N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Publicado en: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Editor: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3184622

Comprehensive Degradation Analysis of NCA Li-Ion Batteries via Methods of Electrochemical Characterisation for Various Stress-Inducing Scenarios

Autores: Martin Kemeny, Peter Ondrejka, Miroslav Mikolasek
Publicado en: Batteries, 2023, ISSN 2313-0105
Editor: MDPI
DOI: 10.3390/batteries9010033

Learning under concept drift and non-stationary noise: Introduction of the concept of persistence

Autores: Kutalmış Coşkun, Borahan Tümer
Publicado en: Engineering Applications of Artificial Intelligence, 2023, ISSN 0952-1976
Editor: Pergamon Press Ltd.
DOI: 10.1016/j.engappai.2023.106363

Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs

Autores: N. Modoloa, M. Fregolent, F. Masin, A. Benato, A. Bettini, M. Buffolo, C. De Santi, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, D. Vogrig, A. Neviani, G. Meneghesso, E. Zanoni, M. Meneghini
Publicado en: Microelectronics Reliability, Edición 00262714, 2022, ISSN 0026-2714
Editor: Elsevier BV
DOI: 10.1016/j.microrel.2022.114708

A Syntactic Pattern Recognition Based Approach to Online Anomaly Detection and Identification on Electric Motors

Autores: Coşkun, K., Kumralbaş, Z., Çavuş, H., Tümer, B.
Publicado en: Pattern Recognition. DAGM GCPR 2022. Lecture Notes in Computer Science, 2022
Editor: Springer
DOI: 10.1007/978-3-031-16788-1_8

Anomaly Detection using Audio Signals

Autores: B.S.Çağlar, H.B.Ketmen, B. Bulut
Publicado en: International Aegean Scientific Research Symposium 2021 Proceedings Book, 2022, ISBN 978-605-74014-2-7
Editor: Kocaeli University

Reliability and Failures in Solid State Lighting Systems

Autores: W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Publicado en: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Editor: Springer
DOI: 10.1007/978-3-030-81576-9_7

A Proposal for the Classification of Methods for Verification and Validation of Safety, Cybersecurity, and Privacy of Automated Systems.

Autores: Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Publicado en: Communications in Computer and Information Science, Edición 2, 2021, ISBN 9783030853464
Editor: Springer Nature Switzerland AG
DOI: 10.1007/978-3-030-85347-1_24

Outlook: From Physics of Failure to Physics of Degradation

Autores: W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Publicado en: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Página(s) 535–538
Editor: Springer
DOI: 10.1007/978-3-030-81576-9_17

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