Intelligent Reliability 4.0

Conference Presentation: Quantitative Assessment of Sulfur Uptake from Polymers Aged in Harsh Environments via LA-ICP-MS

Autori: Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Pubblicato in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Editore: ICP

Poster: Characterization of the corrosion behavior of copper in sulfur-containing environments using LA-ICP-MS and LIBS

Autori: Lukas, Brunnbauer, Jakob Willner, Günter Fafilek, Silvia Larisegger, Andreas Limbeck
Pubblicato in: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editore: EWCPS

Poster:

Autori: Fabio A. Velarde Gonzalez, Lukas Hahne, Katrin Ortstein, André Lange, Sonja Crocoll
Pubblicato in: 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems, 2023
Editore: IEEE

Presentation: Concepts for reliability improvements of AMR current sensor devices and modules

Autori: Heiko Knoll, Pascal Hille, Lukas Rauber, Matthias Brusius
Pubblicato in: 16. XMR-Symposium, 2023
Editore: Sensitec

Preprint: Defect Detection on Semiconductor Wafers by Distribution Analysis

Autori: Thomas Olschewski
Pubblicato in: arXiv, 2021
Editore: TUDresden
DOI: 10.48550/arxiv.2111.03727

Presentation: Intelligent Manufacturing – From the Chip – Package – Board/System: Impact on reliability

Autori: Klaus Pressel
Pubblicato in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE

Presentation: Investigation of reconstruction stability and limitations for combined dithering-compressed-sensing processing of spectral imaging interferometric data in white-light interferometric surface profiling

Autori: Ch. Taudt, S. Gruner, P. Hartmann
Pubblicato in: SPIE Photonics West 2023 - OPTO part, 2023
Editore: SPIE

Conference Presentation: Determination of protection capabilities of selected polymers against atmospheric corrosion in harsh environments

Autori: J. Willner, L. Varain, L. Brunnbauer, P. Mayr, M. Nelhiebel, G. Fafilek, S. Larisegger, A. Limbeck
Pubblicato in: EUROCORR 2021, 2021
Editore: European Federation of Corrosion

Poster: Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

Autori: D. Kostynski, S. Sack, M. Sievers
Pubblicato in: 12th International Conference on Integrated Power Electronics Systems, 2022
Editore: ETG Energietechnische Gesellschaft im VDE

Poster: Implementation of a new heating stage for in-situ LIBS analysis of temperature induced processes

Autori: Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Pubblicato in: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editore: EWCPS

Presentation: Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Autori: J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Pubblicato in: AOFKA 2021, 2021
Editore: Chemnitz University of Technology

Poster: Investigation of metal diffusion into polymer films by measurement of quantitative LA-ICP-MS depth profiles

Autori: Jakob Willner, Lars Varain, Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck
Pubblicato in: European Winter Conference on Plasma Spectrochemistry 2023, 2023
Editore: EWCPS

Poster: Simulation driven investigation of production and aging related thermo-mechanical effects for the behavior of a SO16 System-in-Package sensor

Autori: Heiner Moeller, Heiko Knoll, Pascal Hille, Sven Rzepka
Pubblicato in: Smart Systems Integration Conference and Exhibition 2023, 2023
Editore: EPoss

Presentation: Virtual Design for Life Time optimization of M2X Modules – A Use Case from the IRel40 project

Autori: Thomas Krivec et al.
Pubblicato in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE

Poster: Spectrally resolved temporal coherence of spectrally narrowband filtered high-power supercontinuum light source versus an appropriately treated laser-driven plasma light source

Autori: Tobias Baselt, Christopher Taudt, Daniel Ruf, Peter Hartmann
Pubblicato in: SPIE Photonics West 2023 - Proceedings Volume 12417, Optical Components and Materials XX; 1241716 (2023), 2023
Editore: Society of Photo-Optical Instrumentation Engineers
DOI: 10.1117/12.2650033

Conference Presentation: Humidity and temperature dependence of the Sulfur uptake behavior of different polymers examined via LA-ICP-MS depth profile measurements

Autori: Jakob Willner, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Pubblicato in: 22nd Winter Conference on Plasma Spectrochemistry, 2022
Editore: ICP

Presentation: Holistic Testing in iRel40 and Impact on Reliability

Autori: Susan Zhao
Pubblicato in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE

Presentation: AI applied to CSAM Images

Autori: Jason Zi Jie Chia et. al.
Pubblicato in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE

Fast Accurate Defect Detection in Wafer Fabrication

Autori: Olschewski, Thomas
Pubblicato in: Numero 1, 2021
Editore: TU Dresden

Presentation: Virtual Assessement of Power Packages

Autori: Thomas Krivec
Pubblicato in: 8th European Expert Workshop on Reliability of Electronics and Smart Systems, 2020
Editore: EPoSS

Poster: Investigating the corrosion behaviour of copper in sulphur containing atmospheres

Autori: Lukas Brunnbauer, Jakob Willner, Markus Sauer, Annette Foelske-Schmitz, Silvia Larisegger, Andreas Limbeck
Pubblicato in: Colloquim Spectroscopicum Internationale XLII, 2022
Editore: CSI

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Autori: L. Du, X. Zhao, P. Watté, R. Poelma, W. Van Driel and G. Zhang
Pubblicato in: 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editore: IEEE
DOI: 10.1109/iecon49645.2022.9968578

The H2020-ECSEL Project “iRel40” (Intelligent Reliability 4.0)

Autori: Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
Pubblicato in: 2021 24th Euromicro Conference on Digital System Design (DSD), 2021, Pagina/e 311-318, ISBN 978-1-6654-2703-6
Editore: IEEE
DOI: 10.1109/dsd53832.2021.00054

Data-Centric Model Development to Improve the CNN Classification of Defect Density SEM Images

Autori: C. Kofler, C. A. Dohr, J. Dohr and A. Zernig
Pubblicato in: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editore: IEEE
DOI: 10.1109/iecon49645.2022.9968911

Ab initio derived force field potential for the accurate simulation of thermal transport in AlN

Autori: S. Fernbach, E. Kraker and N. Bedoya-Martínez
Pubblicato in: nternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editore: IEEE
DOI: 10.1109/eurosime56861.2023.10100760

Deformation measurement on cross sections of Fan-Out Wafer Level Package by Digital Image Correlation (DIC)

Autori: I. Maus, P. Altieri–Weimar, W. Hartner, M. Niessner and B. Bäumer
Pubblicato in: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, ISBN 978-1-6654-8948-5
Editore: IEEE
DOI: 10.1109/estc55720.2022.9939400

GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse

Autori: F. Chiocchetta; C. De Santi; F. Rampazzo; K. Mukherjee; Jan Grünenpütt; Daniel Sommer; Hervé Blanck; Benoit Lambert; A. Gerosa; G. Meneghesso; E. Zanoni; M. Meneghini
Pubblicato in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Editore: IEEE
DOI: 10.1109/irps48227.2022.9764510

Super-Twisting Algorithm-based Sliding Mode Observer for Open-Circuit Fault Diagnosis in PWM Voltage Source Inverter in an In-Wheel Motor Drive System

Autori: M. Hashemi, M. Stolz and D. Watzenig
Pubblicato in: 2023 IEEE International Conference on Mechatronics (ICM), 2023
Editore: IEEE
DOI: 10.1109/icm54990.2023.10102000

Modelling Thermal Fatigue in Power Electronics

Autori: Rainer Dudek; Ralf Döring; Anu Mathew; Alexander Otto; Sven Rzepka
Pubblicato in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Editore: IEEE
DOI: 10.1109/eurosime54907.2022.9758893

Size Scaling of Brittle Strength using Multi-Mode Weibull Distribution

Autori: S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar
Pubblicato in: "S. Ananiev, G. M. Reuther, N. D. Vecchio and P. Altieri-Weimar, ""Size Scaling of Brittle Strength usi24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", 2023
Editore: IEEE
DOI: 10.1109/eurosime56861.2023.10100803

FPGA implementation of histogram-based thresholding

Autori: M. Hagara, P. Kubinec, A. Šatka and R. Stojanović
Pubblicato in: 11th Mediterranean Conference on Embedded Computing (MECO), 2022
Editore: IEEE
DOI: 10.1109/meco55406.2022.9797132

Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Autori: Fahimeh Emadi; Vesa Vuorinen; Mervi Paulasto-Krockel
Pubblicato in: Electronics System-Integration Technology Conference (ESTC), Numero 1, 2022
Editore: IEEE
DOI: 10.1109/estc55720.2022.9939539

On suitability of the customized measuring device for electric motor

Autori: Rok Hribar; Gasper Petelin; Margarita Antoniou; Anton Biasizzo; Stanko Ciglaric; Gregor Papa
Pubblicato in: Annual Conference of Industrial Electronics Society, 2022., Numero 1, 2022
Editore: IEEE
DOI: 10.1109/iecon49645.2022.9968876

Influence of the quality of material models on warpage and lifetime prediction by finite element simulation

Autori: J. Zündel, M. Weninger, T. Krivec, M. Frewein and S. Waschnig
Pubblicato in: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editore: IEEE
DOI: 10.1109/eurosime56861.2023.10100777

An AI-based Architecture Framework for Improving End-of-line Reliability Tests of Electric Motors

Autori: Müjdat Soytürk; Kutalmış Coşkun; Onur İzmitlioğlu; Borahan Tümer; Deniz Güneş; Sinan Saraçoğlu; Barış Bulut; Hasan Burak Ketmen; İsmethan Hanedar; Taşemir Aşan; Eray Aydın
Pubblicato in: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society, 2022
Editore: IEEE
DOI: 10.1109/iecon49645.2022.9968853

Depth-Resolved LA-ICP-MS investigations for the Determination of Diffusion Coefficients of SO2 in thin Polymer films

Autori: Jakob Willner, Philipp Rosenauer, Lukas Brunnbauer, Michael Nelhiebel, Silvia Larisegger and Andreas Limbeck
Pubblicato in: European Workshop on laser Ablation Poster Abstracts, 2022
Editore: University of Bern

Monitoring Degradation of Insulated Gate Bipolar Transistors in Induction Cooktops by Artificial Neural Networks

Autori: Chenyang Lai, Piero Baralid, Ibrahim Ahmed, Enrico Zio, Alejandro del Cueto, Javier Gil, Sergio Llorente
Pubblicato in: Proceedings of the 32nd European Safety and Reliability Conference (ESREL), 2022
Editore: Research Publishing, Singapore

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

Autori: M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
Pubblicato in: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022
Editore: IEEE
DOI: 10.1109/eurosime54907.2022.9758866

Reliability of Electronic Drivers: An Industrial Approach

Autori: P. Watté, G. van Hees, R. Engelen, W. D. van Driel, T. Chen
Pubblicato in: 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors, 2021
Editore: IEEE
DOI: 10.1109/sslchinaifws54608.2021.9675170

Optical pulse generation in nanosecond range with conventional high-power LED modules for metrology and calibration purposes

Autori: E. Kabardiadi-Virkovski, A. Kabardiadi-Virkovski P. Hartmann
Pubblicato in: SPIE Photonics West 2023 - OPTO part, 2023
Editore: SPIE
DOI: 10.1117/12.2649796

Reliability of Electronic Drivers: An Industrial Approach

Autori: P. Watté, G. van Hees, R. Engelen, W. D. van Driel
Pubblicato in: ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2021
Editore: ASME
DOI: 10.1115/ipack2021-72293

An Unsupervised Method for Anomaly Detection in Multi-Stage Production Systems Based on LSTM Autoencoders

Autori: Fatemeh Hosseinpour, Ibrahim Ahmed, Piero Baraldi, Mehdi Behzad, Enrico Zio, Horst Lewitschnig
Pubblicato in: Proceedings of the 32nd European Safety and Reliability Conference (ESREL 2022), 2022
Editore: Research Publishing, Singapore

Improving the production quality and robustness of a SO16 sensor package by a simulation based digital twin approach

Autori: H. Moeller, H. Knoll, P. Hille, R. Dudek and S. Rzepka
Pubblicato in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE
DOI: 10.1109/estc55720.2022.9939391

Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

Autori: J. Zundel, M. Sagerer, M. Frewein, T. Krivec
Pubblicato in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Pagina/e 1-7, ISBN 978-1-6654-1373-2
Editore: IEEE
DOI: 10.1109/eurosime52062.2021.9410833

Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition

Autori: M. Millesimo; B. Bakeroot; M. Borga; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Pubblicato in: 2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Editore: IEEE
DOI: 10.1109/irps48227.2022.9764592

ReliaVision: In-circuit transistor reliability investigation using XML-based technology reliability information in PDKs

Autori: Lukas Hahne, G. Fabio A. Velarde, André Lange, Christoph Sohrmann, Daniel Wetzel, Sonja Crocoll
Pubblicato in: IEEE International Integrated Reliability Workshop (IIRW), 2021
Editore: IEEE
DOI: 10.1109/iirw53245.2021.9635606

Dopant Incomplete Ionization Role in SiC Schottky Diode Edge Termination under Current Over-Stress

Autori: O. Aviñó, F. Bonet, M. Vellvehí, P. Godignon, X. Jordà and X. Perpiñà
Pubblicato in: IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe), 2022
Editore: IEEE
DOI: 10.1109/wipdaeurope55971.2022.9936256

Prognostics and Health Management for Power Electronics and Electrical Power Systems

Autori: Robert Ross
Pubblicato in: International Conference on Condition Monitoring and Diagnosis (CMD), 2022
Editore: IEEE
DOI: 10.23919/cmd54214.2022.9991683

Quantitative Determination of sulfur uptake in selected polymers via LA-ICP-MS

Autori: J. Willner, L. Brunnbauer, M. Nelhiebel, S. Larisegger, A. Limbeck
Pubblicato in: Applied Surface and Solid State Analytics (AOFKA21) Conference, 2021
Editore: TU Chemnitz and TU Bergakademie Freiberg

Assets’ Reliability Management Model for a Decision Making in Different Operational Contexts

Autori: Uribetxebarria, J., Zubizarreta, A., Rodríguez, Á., Leturiondo, U.
Pubblicato in: WCEAM Proceedings. WCEAM 2022. Lecture Notes in Mechanical Engineering, 2023
Editore: Springer
DOI: 10.1007/978-3-031-25448-2_3

A Multi-Channel System for Active Thermal Cycling of Discrete Power Semiconductors Based on Mission Profiles

Autori: D. Kostynski, S. Sack, P. Kolter and M. Glavanovics
Pubblicato in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editore: IEEE
DOI: 10.1109/asdam55965.2022.9966759

A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing

Autori: Mustafa Onur Izmitlioglu, Mujdat Soyturk
Pubblicato in: A Practical Study on Optimization of Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing, 2022
Editore: IEEE

Reliability of LED-based Systems

Autori: Willem D. van Driel, B. Jacobs, P. Watte, X. Zhao
Pubblicato in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, Pagina/e 1-4, ISBN 978-1-6654-1373-2
Editore: IEEE
DOI: 10.1109/eurosime52062.2021.9410861

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

Autori: F. Emadi, S. Liu, A. Klami, N. Tiwary, V. Vuorinen and M. Paulasto-Kröckel
Pubblicato in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editore: IEEE
DOI: 10.1109/asdam55965.2022.9966765

Reliability along the Value Chain – from Chip to Board/System

Autori: K. Pressel and J. Moser
Pubblicato in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editore: IEEE
DOI: 10.1109/asdam55965.2022.9966780

A novel approach to analyze the reliability of GaN power HEMTs operating in a DC-DC Buck converter

Autori: G. Capasso, M. Zanuccoli, A. N. Tallarico and C. Fiegna
Pubblicato in: IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Editore: IEEE
DOI: 10.1109/essderc55479.2022.9947200

Analysis and Design of a Fully-Integrated Pulsed LiDAR Driver in 100V-GaN IC Technology

Autori: Andrea Bettini; Thibault Cosnier; Alessandro Magnani; Olga Syshchyk; Matteo Borga; Stefaan Decoutere; Andrea Neviani
Pubblicato in: 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Editore: IEEE
DOI: 10.1109/prime55000.2022.9816827

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach

Autori: M. Weninger, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst
Pubblicato in: 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023
Editore: IEEE
DOI: 10.1109/eurosime56861.2023.10100800

POWER SIC MOSFET UNDER REPETITIVE UIS AND SHORT CIRCUIT STRESS

Autori: J. Marek1, J. Kozárik, A. Chvála, M. Minárik and M. Donoval
Pubblicato in: Advances in Electronic and Photonic Technologies (ADEPT 2021), 2021, ISBN 978-80-554-1806-3
Editore: University of Zilina in EDIS-Publishing Centre of UZ

Simulation Study of Thermo-Mechanical Properties of Power Transistor Embedded in PCB

Autori: A. Chvála, J. Marek, A. Šatka and J. Chen
Pubblicato in: 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 2022
Editore: IEEE
DOI: 10.1109/asdam55965.2022.9966769

A Method Based on Gaussian Process Regression for Modelling Burn-in of Semiconductor Devices

Autori: Piero Baraldi, Stefano Medici, Ibrahim Ahmed, Enrico Zio, Horst Lewitschnig
Pubblicato in: Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021), 2021, Pagina/e 2619-2626, ISBN 978-981-18-2016-8
Editore: Research Publishing Services
DOI: 10.3850/978-981-18-2016-8_763-cd

A Robust Approach for Inter-Turn Fault Detection of PMSM Used for Autonomous Vehicles

Autori: Maliheh Hashemi, Mohammad Ali Golkani, Daniel Watzenig
Pubblicato in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Editore: IEEE
DOI: 10.1109/iccve52871.2022.9742916

Two Algorithms for Defect Detection in Wafer Fabricatio

Autori: Thomas Olschewski
Pubblicato in: The 33rd European Safety and Reliability Conference (ESREL 2023), 2023
Editore: ESREL
DOI: 10.3850/978-981-18-8071-1_p237-cd

Reliable force field potential for modelling thermal transport in AlN

Autori: S. Fernbach, E. Kraker, E. Zojer, N. Bedoya-Martinez
Pubblicato in: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2022
Editore: IEEE
DOI: 10.1109/therminic57263.2022.9950668

Microstructural Degradation Investigations of OFF-State Stressed 0.15 μm RF AlGaN/GaN HEMTs: Failure Mode related Breakdown

Autori: Prabha Sana, Andreas Graff, Michel Simon-Najasek, Susanne Huebner, Veronica Zhan Gao, Fabiana Rampazzo, Carlo De Santi, Benoit Lambert, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini, Frank Altmann
Pubblicato in: IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2021
Editore: IEEE
DOI: 10.1109/wipda49284.2021.9645151

A Framework for the Determination of realistic Usage Profiles for Automated Shuttle Pods

Autori: Stephanie Grubmüller; Pamela Innerwinkler
Pubblicato in: 2022 International Conference on Connected Vehicle and Expo (ICCVE), 2022
Editore: IEEE
DOI: 10.1109/iccve52871.2022.9742765

SAC305 solder fatigue crack propagation under 3-point bending cycle test condition

Autori: M. Zhang, J. Heilmann, Y. Sing Chan, M. Richard Niessner, P. Altieri-Weimar and B. Wunderle
Pubblicato in: IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022
Editore: IEEE
DOI: 10.1109/estc55720.2022.9939510

Towards Realization of a Low-Voltage Class-AB VCII with High Current Drive Capability

Autori: Safari, L.; Barile, G.; Stornelli, V.; Minaei, S.; Ferri, G.
Pubblicato in: electronics, 2021, ISSN 2079-9292
Editore: MDPI
DOI: 10.3390/electronics10182303

Modified algorithm of unimodal thresholding for FPGA implementation

Autori: Miroslav Hagara, Radovan Stojanović, Alexander Šatka, Peter Kubinec, Oldřich Ondráček,
Pubblicato in: Microprocessors and Microsystems,, Numero 01419331, 2022, ISSN 0141-9331
Editore: Elsevier BV
DOI: 10.1016/j.micpro.2022.104669

Study of the influence of gate etching and passivation on current dispersion, trapping and reliability in RF 0.15 μm AlGaN/GaN HEMTs

Autori: F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, A. Gerosa, G. Meneghesso, E. Zanoni, M. Meneghini
Pubblicato in: Microelectronics Reliability, Numero 00262714, 2022, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2022.114735

A Review on Machine and Deep Learning for Semiconductor Defect Classification in Scanning Electron Microscope Images

Autori: López de la Rosa, F.; Sánchez-Reolid, R.; Gómez-Sirvent, J.L.; Morales, R.; Fernández-Caballero, A.
Pubblicato in: applied science, Numero 20763417, 2021, ISSN 2076-3417
Editore: MDPI
DOI: 10.3390/app11209508

Facial Emotion Recognition from an Unmanned Flying Social Robot for Home Care of Dependent People

Autori: Anselmo Martínez; Lidia M. Belmonte; Arturo S. García; Antonio Fernández-Caballero; Rafael Morales
Pubblicato in: Electronics, Vol 10, Iss 868, p 868 (2021), Numero 3, 2021, ISSN 2079-9292
Editore: MDPI
DOI: 10.3390/electronics10070868

High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs

Autori: M. Millesimo, C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, A. N. Tallarico
Pubblicato in: IEEE Transactions on Electron Devices, 2021, Pagina/e 1-6, ISSN 0018-9383
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3111144

An empirical evaluation of the use of models to improve the understanding of safety compliance needs

Autori: Jose Luis de la Vara, Beatriz Marín, Clara Ayora, Giovanni Giachetti
Pubblicato in: Information and Software Technology, Numero 126, 2020, Pagina/e 106351, ISSN 0950-5849
Editore: Elsevier BV
DOI: 10.1016/j.infsof.2020.106351

GaN-based power devices: Physics, reliability, and perspectives

Autori: Matteo Meneghini, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela, Nicolò Zagni, Alessandro Chini, Farid Medjdoub, Gaudenzio Meneghesso, Giovanni Verzellesi, Enrico Zanoni, and Elison Matioli
Pubblicato in: Journal of Applied Physics, 2021, ISSN 0021-8979
Editore: American Institute of Physics
DOI: 10.1063/5.0061354

Giant Magneto-Resistive (GMR) Sensors for Non-Contacting Partial Discharge Detection

Autori: Y. Chen, L. C. C. Heredia, J. J. Smit, M. G. Niasar and R. Ross
Pubblicato in: Transactions on Instrumentation and Measurement,, 2023, ISSN 1557-9662
Editore: IEEE
DOI: 10.1109/tim.2023.3268485

The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs

Autori: M. Millesimo; M. Borga; B. Bakeroot; N. Posthuma; S. Decoutere; E. Sangiorgi; C. Fiegna; A. N. Tallarico
Pubblicato in: IEEE Electron Device Letters, 2022, ISSN 1558-0563
Editore: IEEE
DOI: 10.1109/led.2022.3206610

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes Under Current Crowding

Autori: F. Bonet, O. Aviñó-Salvadó, M. Vellvehi, X. Jordà, P. Godignon and X. Perpiñà
Pubblicato in: Electron Device Letters, 2022, ISSN 1558-0563
Editore: IEEE
DOI: 10.1109/led.2022.3171112

UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips

Autori: Joshua Lommes, Gesa Patzelt, Volkmar Stenzel,
Pubblicato in: Microelectronics Engineering, 2023, ISSN 0167-9317
Editore: Elsevier BV
DOI: 10.1016/j.mee.2023.112014

Generalised Proportional Integral Control for Magnetic Levitation Systems Using a Tangent Linearisation Approach

Autori: Lidia M. Belmonte; Eva Segura; Antonio Fernández-Caballero; José A. Somolinos; Rafael Morales
Pubblicato in: Mathematics, Vol 9, Iss 1424, p 1424 (2021), Numero 3, 2021, ISSN 2227-7390
Editore: MDPI (Multidisciplinary Digital Publishing Institute)
DOI: 10.3390/math9121424

A versatile approach for the preparation of matrix-matched standards for LA-ICP-MS analysis – Standard addition by the spraying of liquid standards

Autori: Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, Andreas Limbeck
Pubblicato in: Talanta, 2023, ISSN 0039-9140
Editore: Elsevier BV
DOI: 10.1016/j.talanta.2023.124305

Feeling of Safety and Comfort towards a Socially Assistive Unmanned Aerial Vehicle That Monitors People in a Virtual Home

Autori: Lidia M. Belmonte, Arturo S. García, Rafael Morales, Jose Luis de la Vara, Francisco López de la Rosa, Antonio Fernández-Caballero
Pubblicato in: Sensors, Numero 21/3, 2021, Pagina/e 908, ISSN 1424-8220
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s21030908

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

Autori: F. Emadi; V. Vuorinen; G. Ross; M. Paulasto-Kröckel
Pubblicato in: Materials Science & Engineering: A, Numero 2, 2023, ISSN 0921-5093
Editore: Elsevier BV
DOI: 10.1016/j.msea.2023.145398

Geometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a ResNet50 convolutional neural network

Autori: Francisco López de la Rosa, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, Antonio Fernández-Caballero,
Pubblicato in: Expert Systems with Applications, Numero 09574174, 2022, ISSN 0957-4174
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.eswa.2022.117731

TCAD Modeling of the Dynamic VTH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs

Autori: A. N. Tallarico, M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna
Pubblicato in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2021.3134928

A deep residual neural network for semiconductor defect classification in imbalanced scanning electron microscope datasets

Autori: Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero,
Pubblicato in: Applied Soft Computing, Numero 15684946, 2022, ISSN 1568-4946
Editore: Elsevier BV
DOI: 10.1016/j.asoc.2022.109743

An Empirical Evaluation of Enhanced Performance Softmax Function in Deep Learning

Autori: S. Mehra, G. Raut, R. D. Purkayastha, S. K. Vishvakarma and A. Biasizzo
Pubblicato in: IEEE Access, 2023, ISSN 2169-3536
Editore: Institute of Electrical and Electronics Engineers Inc.
DOI: 10.1109/access.2023.3265327

A Highly Linear Temperature Sensor Operating up to 600°C in a 4H-SiC CMOS Technology

Autori: Jiarui Mo; Jinglin Li; Yaqian Zhang; Joost Romijn; Alexander May; Tobias Erlbacher; Guoqi Zhang; Sten Vollebregt
Pubblicato in: IEEE Electron Device Letters, 2023, ISSN 0741-3106
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/led.2023.3268334

Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet

Autori: Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, Antonio Fernández-Caballero
Pubblicato in: Computers & Industrial Engineering, 2023, ISSN 0360-8352
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.cie.2023.109549

Compact Modeling of Non-Ideal Trapping/Detrapping Processes in GaN Power Devices

Autori: N. Modolo, C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot, S. You, S. Decoutere, A. Bevilacqua, A. Neviani, G. Meneghesso, E. Zanoni and M. Meneghini
Pubblicato in: IEEE Transactions on Electron Devices, 2022, ISSN 0018-9383
Editore: Institute of Electrical and Electronics Engineers
DOI: 10.1109/ted.2022.3184622

Comprehensive Degradation Analysis of NCA Li-Ion Batteries via Methods of Electrochemical Characterisation for Various Stress-Inducing Scenarios

Autori: Martin Kemeny, Peter Ondrejka, Miroslav Mikolasek
Pubblicato in: Batteries, 2023, ISSN 2313-0105
Editore: MDPI
DOI: 10.3390/batteries9010033

Learning under concept drift and non-stationary noise: Introduction of the concept of persistence

Autori: Kutalmış Coşkun, Borahan Tümer
Pubblicato in: Engineering Applications of Artificial Intelligence, 2023, ISSN 0952-1976
Editore: Pergamon Press Ltd.
DOI: 10.1016/j.engappai.2023.106363

Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs

Autori: N. Modoloa, M. Fregolent, F. Masin, A. Benato, A. Bettini, M. Buffolo, C. De Santi, M. Borga, N. Posthuma, B. Bakeroot, S. Decoutere, D. Vogrig, A. Neviani, G. Meneghesso, E. Zanoni, M. Meneghini
Pubblicato in: Microelectronics Reliability, Numero 00262714, 2022, ISSN 0026-2714
Editore: Elsevier BV
DOI: 10.1016/j.microrel.2022.114708

A Syntactic Pattern Recognition Based Approach to Online Anomaly Detection and Identification on Electric Motors

Autori: Coşkun, K., Kumralbaş, Z., Çavuş, H., Tümer, B.
Pubblicato in: Pattern Recognition. DAGM GCPR 2022. Lecture Notes in Computer Science, 2022
Editore: Springer
DOI: 10.1007/978-3-031-16788-1_8

Anomaly Detection using Audio Signals

Autori: B.S.Çağlar, H.B.Ketmen, B. Bulut
Pubblicato in: International Aegean Scientific Research Symposium 2021 Proceedings Book, 2022, ISBN 978-605-74014-2-7
Editore: Kocaeli University

Reliability and Failures in Solid State Lighting Systems

Autori: W. D. van Driel, B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, J. Lynn Davis
Pubblicato in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022
Editore: Springer
DOI: 10.1007/978-3-030-81576-9_7

A Proposal for the Classification of Methods for Verification and Validation of Safety, Cybersecurity, and Privacy of Automated Systems.

Autori: Jose Luis de la Vara; Thomas Bauer; Bernhard Fischer; Mustafa Karaca; Henrique Madeira; Martin Matschnig; Silvia Mazzini; Giann Spilere Nandi; Fabio Patrone; David Pereira; José Proença; Rupert Schlick; Stefano Tonetta; Ugur Yayan; Behrooz Sangchoolie
Pubblicato in: Communications in Computer and Information Science, Numero 2, 2021, ISBN 9783030853464
Editore: Springer Nature Switzerland AG
DOI: 10.1007/978-3-030-85347-1_24

Outlook: From Physics of Failure to Physics of Degradation

Autori: W. D. van Driel, M. Yazdan Mehr, X. J. Fan, G. Q. Zhang
Pubblicato in: Reliability of Organic Compounds in Microelectronics and Optoelectronics, 2022, Pagina/e 535–538
Editore: Springer
DOI: 10.1007/978-3-030-81576-9_17

Risultati finali

Pubblicazioni

Condividi questa pagina

Scarica