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Scalable Structured Micro Illumination Light Engines

Descrizione del progetto

Serie a microLED potrebbero aprire la strada a nuove applicazioni commerciali in molti campi

I diodi a emissione luminosa, o LED, esistono da più di mezzo secolo. Partendo dai dispositivi di comunicazione a infrarossi, i LED hanno presto trovato impiego nelle spie luminose, nei display e persino nell’illuminazione generale grazie alle loro dimensioni compatte, al basso consumo energetico, alla lunga durata e alla flessibilità di utilizzo. Nelle serie a LED standard, ogni pixel è un chip LED separato, mentre le serie a microLED possono essere fabbricate con più pixel singoli per chip LED, ottenendo densità di pixel, intensità di luce e controllo elevati in un’area ridotta. Il progetto SMILE, finanziato dall’UE, si basa sulla vasta tecnologia di serie a microLED per sviluppare nuove piattaforme microLED da dimostrare in diverse importanti applicazioni di elevata rilevanza commerciale, dalla fabbricazione di chip di DNA alla microscopia ad alta tecnologia.

Obiettivo

The SMILE idea is based on the results of FET-Open “ChipScope”, which gave us unique technology skills in the processing of nanoLED arrays. In contrast to the ChipScope’s nanoLEDs for superresolution microscopy, larger SMILE microLEDs arrays can also be used for activating and manipulating chemical or biological reactions. With microLEDs, light intensities can be orders of magnitude higher. Larger dimensions enable hybrid integration with CMOS microelectronics, leading to a full scalability of the microLED platform in terms of number of pixels, intensity, switching speed and cost in a mass production situation. MicroLEDs can also be combined with existing colour converter technology, resulting in substantial flexibility concerning wavelength control. SMILE will develop microLED platforms giving access to an enormous variety of novel applications, when used as “Scalable Structured Micro-Illumination Light Engines” (SMILE). The approach is completely different to conventional structured illumination strategies used today. SMILE workplan includes GaN chip technology, CMOS design, chip-chip hybrid integration and system integration (housing and software). SMILE gives very high priority to market replication, preparing for discussions with future investors by the following approach: an “End-User Board” (EUB) of experts from various applications will discuss requirements to be met and perform SMILE test experiments. Therefore, SMILE prototypes will be made available to the EUB for testing and market validation in at least 5 different Pilot Applications (PA), which have already been chosen for analysing importance, relevance and high market potential: (1) DNA chip fabrication; (2) Maskless photolithography; (3) Optogenetics; (4) High-throughput fluorescence microscopy; (5) Chip-based holographic microscopy. All PA are addressing quickly increasing markets. The direct participation of a dedicated start-up company secures the long-term exploitation of SMILE technology.

Invito a presentare proposte

H2020-FETPROACT-2019-2020

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Bando secondario

H2020-EIC-FETPROACT-2019

Meccanismo di finanziamento

RIA - Research and Innovation action

Coordinatore

UNIVERSITAT DE BARCELONA
Contribution nette de l'UE
€ 774 500,00
Indirizzo
GRAN VIA DE LES CORTS CATALANES 585
08007 Barcelona
Spagna

Mostra sulla mappa

Regione
Este Cataluña Barcelona
Tipo di attività
Higher or Secondary Education Establishments
Collegamenti
Costo totale
€ 774 500,00

Partecipanti (3)