CORDIS provides links to public deliverables and publications of HORIZON projects.
Links to deliverables and publications from FP7 projects, as well as links to some specific result types such as dataset and software, are dynamically retrieved from OpenAIRE .
Deliverables
Eternity SS/Workshop 3
ETERNITY Kick-Off Meeting (opens in new window)Kick-off meeting (see table 8 for description)
ETERNITY NWE 5 (opens in new window)ETERNITY NWE 5 (see table 8)
ETERNITY NWE 2 (opens in new window)ETERNITY NWE 2 - see table 8
ETERNITY NWE 4 (opens in new window)ETERNITY NWE 4 (see table 8 for description)
Eternity SS/Workshop 2 (opens in new window)Eternity SS/Workshop 3 (opens in new window)
ETERNITY NWE 1 (opens in new window)
ETERNITY NWE 1 - See description Table 8
ETERNITY NWE 3 (opens in new window)ETERNITY NWE 3 (see table 8 for description)
Eternity SS/Workshop 1 (opens in new window)Application of the EMI footprint concept on 2 medical test cases (opens in new window)
Application of the EMI footprint concept on two medical test cases
Guided tutorials for implementing new safe wearable medical devices based on PLUX equipment (opens in new window)EMI sensors design and validation in a medical environment (opens in new window)
Report on correlation of EMC test results measured in different environments (opens in new window)
Process description how to prepare and execute a risk management plan in collaborative medical system development. (opens in new window)
Process description how to prepare and execute a risk management plan in collaborative medical system development
Application of STAMP/STPA to the EMI-aware hazard-and-risk-analysis of two medical systems (opens in new window)Overview of software/hardware diversity and wireless communication protocols with a use- case hardened and validated for robustness vs. developed techniques and measures (opens in new window)
Overview of software/hardware diversity and wireless communication protocols with a use-case hardened and validated for robustness vs. developed techniques and measures
Standardized EMC assurance case patterns for the certification of medical equipment such as MRI or on-board sensing platform. (opens in new window)Standardized EMC assurance case patterns for the certification of medical equipment such as MRI or on-board sensing platform
Model to consider the effect of the transient interference and definition of the rationale to select and configure the communication system (opens in new window)Behavioural testing of coupling of EMI with cables with application to a medical device (opens in new window)
EMI Risk Management Plan for two real-life medical environments (opens in new window)
Test method for determining cumulative EMI (i.e. from multiple sources) in an automotive environment (opens in new window)
Analysis of the relation between the EMI measurements results and the relevant Figures of Merits of DCS (opens in new window)
Publications
Author(s):
Mohammad Kameli; Tim Claeys; Davy Pissoort
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274164
Author(s):
Marc Kopf (main author), Anne Roc'h
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue PProceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, 2023, Page(s) 6, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274348
Author(s):
Miguel Figueirinhas, Ridvan Aba, Robert Vogt-Ardatjew, Frank Leferink
Published in:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Page(s) 151-154, ISBN 978-4-88552-347-2
Publisher:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10585215
Author(s):
Nathalia A. Rocha Batista, Marcos Quílez, Ferran Silva, Mireya Fernandez Chimeno
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 877-882, ISSN 2325-0364
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722742
Author(s):
Sebastian Mauricio Salas Laurens, Jean David Bertaux, Anne Roc’h
Published in:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Page(s) 702-705
Publisher:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584958
Author(s):
Rheyuniarto Sahlendar Asthan, Ridvan Aba, Robert Vogt-Ardatjew, Deny Hamdani, Achmad Munir, Frank Leferink
Published in:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Page(s) 96-99, ISBN 978-4-88552-347-2
Publisher:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584929
Author(s):
Prashanth Domakonda, Geon George Bastian, Marco A. Azpúrua, Mireya Fernandez-Chimeno, Ferran Silva
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 750-755
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722522
Author(s):
Miguel Figueirinhas, Hans Schipper, Ridvan Aba, Robert Vogt-Ardatjew, Frank Leferink
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 198-202
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722536
Author(s):
Mohammad Kameli, Davy Pissoort, Tim Claeys
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 739-744
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722705
Author(s):
Geon George Bastian (main author), Tiago Pinto Nunes (second author), Marcos Quílez, Mireya Fernández-Chimeno, Ferran Silva
Published in:
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274265
Author(s):
Laure Buysse, Pavithrakrishnan Radhakrishnan, Vikas Ghatge, Johan Catrysse, Davy Pissoort
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 883-888
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722060
Author(s):
Rıdvan Aba; Robert Vogt-Ardatjew; Frank Leferink
Published in:
Grand Rapids Michigan, U.S.A., Issue yearly, 2023, ISBN 979-8-3503-0976-8
Publisher:
IEEE
DOI:
10.1109/emcsipi50001.2023.10241622
Author(s):
Tiago Nunes, Hugo Plácido da Silva, Hugo Gamboa
Published in:
Proceedings of the 17th International Joint Conference on Biomedical Engineering Systems and Technologies, 2024, Page(s) 82-87, ISBN 978-989-758-688-0
Publisher:
SCITEPRESS - Science and Technology Publications
DOI:
10.5220/0012588900003657
Author(s):
Mohammad Kameli (Main author); Tim Claeys; Davy Pissoort
Published in:
EMC Europe 2022 Conference, Issue yearly, 2022, Page(s) 822-827, ISBN 978-1-6654-0788-5
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9900946
Author(s):
Simon Rendon Velez, Ridvan Aba, Mark J.A.M. van Helvoort, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 745-749
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722656
Author(s):
Ridvan Aba; Vasiliki Gkatsi; Robert Vogt-Ardatjew; Frank Leferink
Published in:
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023, ISBN 979-8-3503-9693-5
Publisher:
IEEE
DOI:
10.1109/gemccon57842.2023.10078197
Author(s):
Tiago Nunes (main author), Ferran Silva, Mireya Fernandez, Marcos Quílez, Hugo Silva
Published in:
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274383
Author(s):
Nandun Senevirathna, Rob Kleihorst
Published in:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Page(s) 100-103
Publisher:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584843
Author(s):
Xinting Xue, Tim Claeys, Davy Pissoort
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023, Page(s) 6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274213
Author(s):
Rıdvan Aba (main author); Robert Vogt-Ardatjew; Frank Leferink
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274262
Author(s):
Miriam Gonzalez-Atienza (main author), Dries Vanoost, Rob Kleihorst and Davy Pissoort
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue 2023, frequency: Yearly, 2023, Page(s) 6, ISBN 979-8-3503-2401-3
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274394
Author(s):
Nandun Senevirathna( Main author), Co-authors : Rob Kleihorst, Sander Bronckers, Anne Roc'h
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274273
Author(s):
Miriam Gonzalez-Atienza, Dries Vanoost, Rob Kleihorst and Davy Pissoort
Published in:
Safety Critical Systems Symposium SSS'24, 2024
Publisher:
Safety Critical Systems Symposium
Author(s):
Miguel Figueirinhas, Hans Schipper, Ridvan Aba, Robert Vogt-Ardatjew, Frank Leferink
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 36-40
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722750
Author(s):
Ghatge VA, Buysse L, Vanoost D, Catrysse J, Kleihorst R, Pissoort D
Published in:
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), Bengaluru, India, 2023, ISBN 979-8-3503-3834-8
Publisher:
IEEE
DOI:
10.1109/apemc57782.2023.10217754
Author(s):
Sebastian Mauricio Salas Laurens (main author), Anne Roc'h
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe Krakow, Poland, Issue yearly, 2023, Page(s) n.a
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274185
Author(s):
Marc Kopf, Tiago P. Nunes, Hugo Plácido Da Silva, Hugo Gamboa, Anne Roc’H
Published in:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Page(s) 698-701
Publisher:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584973
Author(s):
Xinting Xue, Tim Claeys, Robert Vogt-Ardatjew, Davy Pissoort
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 1052-1057, ISBN 979-8-3503-4304-5
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722674
Author(s):
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 889-894
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722465
Author(s):
Nathalia Batista (main author), Marcos Quiléz, Ferran Silva
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023, Page(s) 5 Pages, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274202
Author(s):
Simón Rendón Vélez (first author); Ridvan Aba (second author); Mark J. A. M. van Helvoort; Bärbel van den Berg; Robert Vogt-Ardatjew; Frank Leferink
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Issue yearly, 2023, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274349
Author(s):
Sebastian M. Salas Laurens, Anne Roc’h
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 756-761
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722270
Author(s):
Simón Rendón Veléz (main author); Mark J. A. M. van Helvoort; Robert Vogt-Ardatjew; Frank Leferink
Published in:
n.a, Issue n.a, 2023, Page(s) n.a, ISBN 979-8-3503-9693-5
Publisher:
IEEE
DOI:
10.1109/gemccon57842.2023.10078222
Author(s):
Simón Rendón Vélez, Mark J. A. M. van Helvoort, Robert Vogt-Ardatjew, Bärbel Van Den Berg, Frank Leferink
Published in:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, 2023, ISBN 979-8-3503-2400-6
Publisher:
IEEE
DOI:
10.1109/emceurope57790.2023.10274190
Author(s):
Ridvan Aba, Miguel Figueirinhas, Robert Vogt-Ardatjew, Frank Leferink
Published in:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Page(s) 32-35
Publisher:
IEEE
DOI:
10.1109/emceurope59828.2024.10722604
Author(s):
Nandun Senevirathna( Main author), Co-authors : Rob Kleihorst; Anne Roc'h
Published in:
EMC Europe 2022 Conference, Issue 05-08 September 2022, 2022, ISBN 978-1-6654-0788-5
Publisher:
IEEE
DOI:
10.1109/emceurope51680.2022.9900939
Author(s):
Asif Ali, Mireya Fernández Chimeno, Marco A. Azpúrua
Published in:
IEEE Open Journal of the Communications Society, Issue 5, 2024, Page(s) 2391-2400, ISSN 2644-125X
Publisher:
IEEE
DOI:
10.1109/ojcoms.2024.3387339
Author(s):
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Published in:
IEEE Transactions on Electromagnetic Compatibility, Issue 66, 2024, Page(s) 1329-1338, ISSN 0018-9375
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2024.3422619
Author(s):
Miriam Gonzalez-Atienza (main author), Dries Vanoost, Mathias Verbeke and Davy Pissoort
Published in:
IEEE Transactions on Electromagnetic Compatibility, 2023, Page(s) On pages: 667-678, ISSN 0018-9375
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2023.3258745
Author(s):
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Published in:
IEEE Transactions on Electromagnetic Compatibility, Issue 66, 2024, Page(s) 2085-2094, ISSN 0018-9375
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2024.3482565
Author(s):
Mohamed Bikrat, Seddik Bri, Alberto Gascón Bravo, Alejandro Muñoz Manterola, Miriam Gonzalez-Atienza, Farah Amador
Published in:
Applied Sciences, Issue 13, 2025, Page(s) 9367, ISSN 2076-3417
Publisher:
MDPI
DOI:
10.3390/app13169367
Author(s):
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Published in:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, Issue 7, 2025, Page(s) 14-18, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2024.3504712
Author(s):
Tiago Nunes (Main author), Hugo Silva
Published in:
Sensors, Issue Volume 23, Issue 3, 2023, Page(s) Article nº 1468, ISSN 1424-8220
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s23031468
Author(s):
Ghatge VA, Buysse L, Vanoost D, Catrysse J, Pissoort D
Published in:
"""IEEE Letters on Electromagnetic Compatibility Practice and Applications """, 2023, ISSN 2637-6423
Publisher:
IEEE
DOI:
10.1109/lemcpa.2023.3284229
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