CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.
Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .
Resultado final
Eternity SS/Workshop 3
ETERNITY Kick-Off Meeting (se abrirá en una nueva ventana)Kick-off meeting (see table 8 for description)
ETERNITY NWE 5 (se abrirá en una nueva ventana)ETERNITY NWE 5 (see table 8)
ETERNITY NWE 2 (se abrirá en una nueva ventana)ETERNITY NWE 2 - see table 8
ETERNITY NWE 4 (se abrirá en una nueva ventana)ETERNITY NWE 4 (see table 8 for description)
Eternity SS/Workshop 2 (se abrirá en una nueva ventana)Eternity SS/Workshop 3 (se abrirá en una nueva ventana)
ETERNITY NWE 1 (se abrirá en una nueva ventana)
ETERNITY NWE 1 - See description Table 8
ETERNITY NWE 3 (se abrirá en una nueva ventana)ETERNITY NWE 3 (see table 8 for description)
Eternity SS/Workshop 1 (se abrirá en una nueva ventana)Application of the EMI footprint concept on 2 medical test cases (se abrirá en una nueva ventana)
Application of the EMI footprint concept on two medical test cases
Guided tutorials for implementing new safe wearable medical devices based on PLUX equipment (se abrirá en una nueva ventana)EMI sensors design and validation in a medical environment (se abrirá en una nueva ventana)
Report on correlation of EMC test results measured in different environments (se abrirá en una nueva ventana)
Process description how to prepare and execute a risk management plan in collaborative medical system development. (se abrirá en una nueva ventana)
Process description how to prepare and execute a risk management plan in collaborative medical system development
Application of STAMP/STPA to the EMI-aware hazard-and-risk-analysis of two medical systems (se abrirá en una nueva ventana)Overview of software/hardware diversity and wireless communication protocols with a use- case hardened and validated for robustness vs. developed techniques and measures (se abrirá en una nueva ventana)
Overview of software/hardware diversity and wireless communication protocols with a use-case hardened and validated for robustness vs. developed techniques and measures
Standardized EMC assurance case patterns for the certification of medical equipment such as MRI or on-board sensing platform. (se abrirá en una nueva ventana)Standardized EMC assurance case patterns for the certification of medical equipment such as MRI or on-board sensing platform
Model to consider the effect of the transient interference and definition of the rationale to select and configure the communication system (se abrirá en una nueva ventana)Behavioural testing of coupling of EMI with cables with application to a medical device (se abrirá en una nueva ventana)
EMI Risk Management Plan for two real-life medical environments (se abrirá en una nueva ventana)
Test method for determining cumulative EMI (i.e. from multiple sources) in an automotive environment (se abrirá en una nueva ventana)
Analysis of the relation between the EMI measurements results and the relevant Figures of Merits of DCS (se abrirá en una nueva ventana)
Publicaciones
Autores:
Mohammad Kameli; Tim Claeys; Davy Pissoort
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274164
Autores:
Marc Kopf (main author), Anne Roc'h
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición PProceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, 2023, Página(s) 6, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274348
Autores:
Miguel Figueirinhas, Ridvan Aba, Robert Vogt-Ardatjew, Frank Leferink
Publicado en:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Página(s) 151-154, ISBN 978-4-88552-347-2
Editor:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10585215
Autores:
Nathalia A. Rocha Batista, Marcos Quílez, Ferran Silva, Mireya Fernandez Chimeno
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 877-882, ISSN 2325-0364
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722742
Autores:
Sebastian Mauricio Salas Laurens, Jean David Bertaux, Anne Roc’h
Publicado en:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Página(s) 702-705
Editor:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584958
Autores:
Rheyuniarto Sahlendar Asthan, Ridvan Aba, Robert Vogt-Ardatjew, Deny Hamdani, Achmad Munir, Frank Leferink
Publicado en:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Página(s) 96-99, ISBN 978-4-88552-347-2
Editor:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584929
Autores:
Prashanth Domakonda, Geon George Bastian, Marco A. Azpúrua, Mireya Fernandez-Chimeno, Ferran Silva
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 750-755
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722522
Autores:
Miguel Figueirinhas, Hans Schipper, Ridvan Aba, Robert Vogt-Ardatjew, Frank Leferink
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 198-202
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722536
Autores:
Mohammad Kameli, Davy Pissoort, Tim Claeys
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 739-744
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722705
Autores:
Geon George Bastian (main author), Tiago Pinto Nunes (second author), Marcos Quílez, Mireya Fernández-Chimeno, Ferran Silva
Publicado en:
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274265
Autores:
Laure Buysse, Pavithrakrishnan Radhakrishnan, Vikas Ghatge, Johan Catrysse, Davy Pissoort
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 883-888
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722060
Autores:
Rıdvan Aba; Robert Vogt-Ardatjew; Frank Leferink
Publicado en:
Grand Rapids Michigan, U.S.A., Edición yearly, 2023, ISBN 979-8-3503-0976-8
Editor:
IEEE
DOI:
10.1109/emcsipi50001.2023.10241622
Autores:
Tiago Nunes, Hugo Plácido da Silva, Hugo Gamboa
Publicado en:
Proceedings of the 17th International Joint Conference on Biomedical Engineering Systems and Technologies, 2024, Página(s) 82-87, ISBN 978-989-758-688-0
Editor:
SCITEPRESS - Science and Technology Publications
DOI:
10.5220/0012588900003657
Autores:
Mohammad Kameli (Main author); Tim Claeys; Davy Pissoort
Publicado en:
EMC Europe 2022 Conference, Edición yearly, 2022, Página(s) 822-827, ISBN 978-1-6654-0788-5
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9900946
Autores:
Simon Rendon Velez, Ridvan Aba, Mark J.A.M. van Helvoort, Robert Vogt-Ardatjew, Bärbel van den Berg, Frank Leferink
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 745-749
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722656
Autores:
Ridvan Aba; Vasiliki Gkatsi; Robert Vogt-Ardatjew; Frank Leferink
Publicado en:
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON), 2023, ISBN 979-8-3503-9693-5
Editor:
IEEE
DOI:
10.1109/gemccon57842.2023.10078197
Autores:
Tiago Nunes (main author), Ferran Silva, Mireya Fernandez, Marcos Quílez, Hugo Silva
Publicado en:
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274383
Autores:
Nandun Senevirathna, Rob Kleihorst
Publicado en:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Página(s) 100-103
Editor:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584843
Autores:
Xinting Xue, Tim Claeys, Davy Pissoort
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023, Página(s) 6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274213
Autores:
Rıdvan Aba (main author); Robert Vogt-Ardatjew; Frank Leferink
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274262
Autores:
Miriam Gonzalez-Atienza (main author), Dries Vanoost, Rob Kleihorst and Davy Pissoort
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición 2023, frequency: Yearly, 2023, Página(s) 6, ISBN 979-8-3503-2401-3
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274394
Autores:
Nandun Senevirathna( Main author), Co-authors : Rob Kleihorst, Sander Bronckers, Anne Roc'h
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274273
Autores:
Miriam Gonzalez-Atienza, Dries Vanoost, Rob Kleihorst and Davy Pissoort
Publicado en:
Safety Critical Systems Symposium SSS'24, 2024
Editor:
Safety Critical Systems Symposium
Autores:
Miguel Figueirinhas, Hans Schipper, Ridvan Aba, Robert Vogt-Ardatjew, Frank Leferink
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 36-40
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722750
Autores:
Ghatge VA, Buysse L, Vanoost D, Catrysse J, Kleihorst R, Pissoort D
Publicado en:
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), Bengaluru, India, 2023, ISBN 979-8-3503-3834-8
Editor:
IEEE
DOI:
10.1109/apemc57782.2023.10217754
Autores:
Sebastian Mauricio Salas Laurens (main author), Anne Roc'h
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe Krakow, Poland, Edición yearly, 2023, Página(s) n.a
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274185
Autores:
Marc Kopf, Tiago P. Nunes, Hugo Plácido Da Silva, Hugo Gamboa, Anne Roc’H
Publicado en:
2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024, Página(s) 698-701
Editor:
IEEE
DOI:
10.23919/emcjapan/apemcokinaw58965.2024.10584973
Autores:
Xinting Xue, Tim Claeys, Robert Vogt-Ardatjew, Davy Pissoort
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 1052-1057, ISBN 979-8-3503-4304-5
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722674
Autores:
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 889-894
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722465
Autores:
Nathalia Batista (main author), Marcos Quiléz, Ferran Silva
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023, Página(s) 5 Pages, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274202
Autores:
Simón Rendón Vélez (first author); Ridvan Aba (second author); Mark J. A. M. van Helvoort; Bärbel van den Berg; Robert Vogt-Ardatjew; Frank Leferink
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Edición yearly, 2023, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274349
Autores:
Sebastian M. Salas Laurens, Anne Roc’h
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 756-761
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722270
Autores:
Simón Rendón Veléz (main author); Mark J. A. M. van Helvoort; Robert Vogt-Ardatjew; Frank Leferink
Publicado en:
n.a, Edición n.a, 2023, Página(s) n.a, ISBN 979-8-3503-9693-5
Editor:
IEEE
DOI:
10.1109/gemccon57842.2023.10078222
Autores:
Simón Rendón Vélez, Mark J. A. M. van Helvoort, Robert Vogt-Ardatjew, Bärbel Van Den Berg, Frank Leferink
Publicado en:
Proceedings of the 2023 International Symposium on Electromagnetic Compatibility – EMC Europe, 2023, ISBN 979-8-3503-2400-6
Editor:
IEEE
DOI:
10.1109/emceurope57790.2023.10274190
Autores:
Ridvan Aba, Miguel Figueirinhas, Robert Vogt-Ardatjew, Frank Leferink
Publicado en:
2024 International Symposium on Electromagnetic Compatibility – EMC Europe, 2024, Página(s) 32-35
Editor:
IEEE
DOI:
10.1109/emceurope59828.2024.10722604
Autores:
Nandun Senevirathna( Main author), Co-authors : Rob Kleihorst; Anne Roc'h
Publicado en:
EMC Europe 2022 Conference, Edición 05-08 September 2022, 2022, ISBN 978-1-6654-0788-5
Editor:
IEEE
DOI:
10.1109/emceurope51680.2022.9900939
Autores:
Asif Ali, Mireya Fernández Chimeno, Marco A. Azpúrua
Publicado en:
IEEE Open Journal of the Communications Society, Edición 5, 2024, Página(s) 2391-2400, ISSN 2644-125X
Editor:
IEEE
DOI:
10.1109/ojcoms.2024.3387339
Autores:
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, Edición 66, 2024, Página(s) 1329-1338, ISSN 0018-9375
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2024.3422619
Autores:
Miriam Gonzalez-Atienza (main author), Dries Vanoost, Mathias Verbeke and Davy Pissoort
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, 2023, Página(s) On pages: 667-678, ISSN 0018-9375
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2023.3258745
Autores:
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Publicado en:
IEEE Transactions on Electromagnetic Compatibility, Edición 66, 2024, Página(s) 2085-2094, ISSN 0018-9375
Editor:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/temc.2024.3482565
Autores:
Mohamed Bikrat, Seddik Bri, Alberto Gascón Bravo, Alejandro Muñoz Manterola, Miriam Gonzalez-Atienza, Farah Amador
Publicado en:
Applied Sciences, Edición 13, 2025, Página(s) 9367, ISSN 2076-3417
Editor:
MDPI
DOI:
10.3390/app13169367
Autores:
Miriam Gonzalez-Atienza, Dries Vanoost, Mathias Verbeke, Davy Pissoort
Publicado en:
IEEE Letters on Electromagnetic Compatibility Practice and Applications, Edición 7, 2025, Página(s) 14-18, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2024.3504712
Autores:
Tiago Nunes (Main author), Hugo Silva
Publicado en:
Sensors, Edición Volume 23, Edición 3, 2023, Página(s) Article nº 1468, ISSN 1424-8220
Editor:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/s23031468
Autores:
Ghatge VA, Buysse L, Vanoost D, Catrysse J, Pissoort D
Publicado en:
"""IEEE Letters on Electromagnetic Compatibility Practice and Applications """, 2023, ISSN 2637-6423
Editor:
IEEE
DOI:
10.1109/lemcpa.2023.3284229
Buscando datos de OpenAIRE...
Se ha producido un error en la búsqueda de datos de OpenAIRE
No hay resultados disponibles