Skip to main content
Vai all'homepage della Commissione europea (si apre in una nuova finestra)
italiano italiano
CORDIS - Risultati della ricerca dell’UE
CORDIS
Contenuto archiviato il 2024-05-07

Silicon carbide films on insulator - development of the material system and demonstration of devices

Obiettivo


Epichem have been successful in identifying the optimum precursors for MOVPE of SiC layers and establish production methods capable of yielding ultra high purity batches of these materials. Furthermore analytical sensitivities for key impurities have been improved. Supply of source material to growth teams has been maintained throughout the project.
Data on the resistivity and piezoresisitive effect of high quality SiCOIN films has been successfully collected. Extensive characterization of SiCOIN films by HALL measurements was done. Two sensor concepts were developed: a high-pressure sensor (up to P = 2000 bar) for oil well logging applications and a low-pressure sensor (up to P = 12 bar) for turbine control or avionics applications. Both concepts were optimised by FE analyses. Sensors of both types were successfully fabricated and special 3C-SiC deposition techniques (selective deposition, deposition on structured substrates) were developed.
In the proposed project a material system consisting of a
single crystalline B SiC layer deposited by CVD on an SOI
(Silicon On Insulator) substrate will be developed for
the fabrication of various high temperature sensor
devices. For the deposition and doping of the SiC layers
special low temperature (T<1000 C) precursors will be
developed, to obtain the lowest possible deposition
temperatures. The advantage of the SiC on SOI system is
that the SiC layer is electrically insulated from the Si
substrate by a thin oxide layer since the thin Si
overlayer of the SOI substrates converts during a
carbonization step into single crystalline SiC. However,
the bulk micromachining capabilities of the Si substrate,
necessary for the fabrication of sensor devices, will
remain unchanged.
To determine the quality of the layers and to optimize
the process extensive analysis (e.g. XRD, TEM, AFM, and
optical and electrical characterization) will be
performed. To demonstrate the applicability of this
material system (SiC On INsulatoroSiCOIN) for sensors, a
number of sensors such as pressure, vibration and
position sensors will be developed that will be tested by
the industrial partners under real industrial conditions
such as in automotive or oil well logging applications.
The processes necessary for the technological realization
of the sensors (CVD of in situ doped, B SiC layers on
pure Si substrates, oxidation, dry etching, ion
implantation and metallization) have been developed
within the former BRITE/EURAM basic research programme
TECSICA (Technology and Characterisation of Silicon
Carbide films for high temperature Applications).

Campo scientifico (EuroSciVoc)

CORDIS classifica i progetti con EuroSciVoc, una tassonomia multilingue dei campi scientifici, attraverso un processo semi-automatico basato su tecniche NLP. Cfr.: Il Vocabolario Scientifico Europeo.

È necessario effettuare l’accesso o registrarsi per utilizzare questa funzione

Programma(i)

Programmi di finanziamento pluriennali che definiscono le priorità dell’UE in materia di ricerca e innovazione.

Argomento(i)

Gli inviti a presentare proposte sono suddivisi per argomenti. Un argomento definisce un’area o un tema specifico per il quale i candidati possono presentare proposte. La descrizione di un argomento comprende il suo ambito specifico e l’impatto previsto del progetto finanziato.

Invito a presentare proposte

Procedura per invitare i candidati a presentare proposte di progetti, con l’obiettivo di ricevere finanziamenti dall’UE.

Dati non disponibili

Meccanismo di finanziamento

Meccanismo di finanziamento (o «Tipo di azione») all’interno di un programma con caratteristiche comuni. Specifica: l’ambito di ciò che viene finanziato; il tasso di rimborso; i criteri di valutazione specifici per qualificarsi per il finanziamento; l’uso di forme semplificate di costi come gli importi forfettari.

CSC - Cost-sharing contracts

Coordinatore

N/A
Contributo UE
Nessun dato
Indirizzo

81663 München
Germania

Mostra sulla mappa

Costo totale

I costi totali sostenuti dall’organizzazione per partecipare al progetto, compresi i costi diretti e indiretti. Questo importo è un sottoinsieme del bilancio complessivo del progetto.

Nessun dato

Partecipanti (6)

Il mio fascicolo 0 0