Adhesive joining technology in electronics manufacturing

Informacje na temat projektu

ADHESIVES IN ELECTRO

Identyfikator umowy o grant: BRRT960031

Projekt został zamknięty

Data rozpoczęcia 12 Lipca 1996

Data zakończenia 31 Stycznia 1997

Finansowanie w ramach

• Specific research and technological development programme in the field of industrial and materials technologies, 1994-1998

Koszt całkowity € 0,00

Wkład UE Brak danych

Koordynowany przez

VDI/VDE- TECHNOLOGIEZENTRUM INFORMATIONSTECHNIK GMBH
Germany

Rezultaty

Report "Roadmap "Adhesives in Automotive Electronics"

A roadmap on the use of adhesives technology in automotive electronics was prepared and published under the leadership of Robert Bosch GmbH. The market share of automotive electronics in overall electronics is 6% only. Therefore automotive electronics will follow general roadmaps for electronics. Higher power density combined with higher ambient conditions leads to higher fatigue of electronic components and assemblies. Improving the materials in order to achieve a higher productivity is another important issue. The main automotive electronics products are control units (ECU) and sensors for engine, power train and safety systems. Especially sensors are a fast growing product sector. For ECU`s, power consumption and clock speed will be increased. At the same time, packages will become smaller while increasing the number of I/O. These trends however, can be observed in all fields of electronics. The difference between automotive electronics and other fields of electronics is the need for reliability. Usually, the service life of a car is in the range of 10 years, but the working life is about 5000 hours. Additionally, the working conditions are a combination of high ambient temperature and high vibrations. Power dissipation is going to increase in the future while box volumes are decreasing. Working temperatures as well as vibration load are said to remain as high as now. Allowable defect rates are decreasing below 50ppm.

Model Curricula for Courses "Adhesives in Electronics"

The traditional education of an electrical engineer or a production engineer for electronic manufacturing still is oriented on the use of soldering technologies. Design tools, and most of the manufacturing equipment as well is made for the use of soldering processes in production. This situation is a major hindrance for adhesives joining technology to become a real technology option. Most of the applications consider adhesives technology only, if the use of soldering technologies fails for some reasons. There still is no clear “design for adhesives joining”-concept, which can be applied by the industry. Even though, singular courses on the use of adhesives technology throughout Europe are being held in irregular periods, the knowledge level on the use of adhesives in join-ing technology, the chances, perspectives, and the problems as well, is very poor. Met-allurgy knowledge is much more common than chemistry knowledge, being a basis for the application of adhesives. This situation was found even worse than expected at the begin of the project. As a consequence, a working group on educational issues was initiated, which has evaluated the situation, has developed a course program, and has executed this program during three courses in three different countries. It was found, that theoretical and practical training has to be carried out, in order to aware the participants for the specific aspects of using adhesives joining technology. Naturally, the Thematic Network could not improve the knowledge level on the use of adhesives in general, here a broad re-thinking process throughout all education levels for engineers, designers, production personnel, and quality assessment personnel is required. Hopefully, some of the results of the project will be considered by universities for restructuring their curricula, which would improve the situation on middle to long term.