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gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform

Rezultaty

Internal and external IT communication infrastructure and project website

The external IT communication infrastructure constitutes a guideline for communication of the SERENA project to external target groups including conferences, marketing measures and communication channels. Furthermore this deliverable constitutes the launch of the internal SERENA communication infrastructure including the establishment of mailing lists or a subversion server, and the SERENA website.

Interface between the modules and the signal processing platform

This deliverable includes the hardware components of the interface and the documentation of the interface and the control software

Fabricated and tested module

This deliverable will consist of the fabricated hardware module and a documentation of the functional and reliability tests

Signal processing algorithms and specifications

This deliverable reports on the signal processing algorithms and specifications necessary to implement hybrid beamforming for mobile (5G) and fixed backhaul applications. It includes the theory underlying the algorithms, the algorithms specification and computational complexity analysis, and extensive performance simulations in selected scenarios of interest.

Updated plan and initial report on Exploitation, Dissemination & Communication activities

This report includes updates on the exploitation, dissemination and communication plans as well as initial reports on the executed activities. It furthermore includes a first view on the market, its opportunities and on the target audiences.

39 GHz Proof-of-concept Platform evaluation

Final test report containing the results and conclusions from evaluation and characterization of the 5G demonstrator

Project quality plan

The project quality plan (the project handbook) constitutes a set of project templates, explanations on the project management process, review process, quality checks, meeting organisation, which is communicated to all partners.

Data Management Plan (DMP)

The DMP will provide an analysis of the main elements of the data management policy that will be used by the applications with regard to all the datasets that will be generated by the project. The DMP is not a fixed document, but evolves (if necessary) during the lifespan of the project. According to the Guidelines on Data Management in Horizon 2020, the DMP should address data set reference and name, data set description, standards and metadata, data sharing and archiving and preservation (including storage and backup) on a dataset by dataset basis and should reflect the current status of reflection within the consortium about the data that will be produced.

Publikacje

Fully-/Partially-Connected Hybrid Beamforming Architectures for mmWave MU-MIMO

Autorzy: Xiaoshen Song, Thomas Kuhne, Giuseppe Caire
Opublikowane w: IEEE Transactions on Wireless Communications, Issue 19/3, 2020, Page(s) 1754-1769, ISSN 1536-1276
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.1109/twc.2019.2957227

Implementation Challenges and Opportunities in Beyond-5G and 6G Communication

Autorzy: Ulf Gustavsson, Pal Frenger, Christian Fager, Thomas Eriksson, Herbert Zirath, Franz Dielacher, Christoph Studer, Aarno Parssinen, Ricardo Correia, Joao Nuno Matos, Daniel Belo, Nuno Borges Carvalho
Opublikowane w: IEEE Journal of Microwaves, Issue 1/1, 2021, Page(s) 86-100, ISSN 2692-8388
Wydawca: IEEE xplore
DOI: 10.1109/jmw.2020.3034648

Temperature-dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique

Autorzy: Taghikhani, Parastoo; Buisman, Koen; Versleijen, Martin; Perez-Cisneros, Jose-Ramon; Fager, Christian
Opublikowane w: IEEE Transactions on Microwave Theory and Techniques, Issue 2, 2021, ISSN 0018-9480
Wydawca: Institute of Electrical and Electronics Engineers
DOI: 10.5281/zenodo.5801076

Development of innovative substrate and embedding technologies for high frequency applications

Autorzy: Manessis, Dionysios; Kosmider, Stefan; Boettcher, Lars; Seckel, Manuel; Murugesan, Kavin; Maaß, Uwe; Ndip, Ivan; Ostmann, Andreas; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, K-D.
Opublikowane w: Issue 1, 2021
Wydawca: IEEE
DOI: 10.23919/EMPC53418.2021.9584975

A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

Autorzy: Ivan Ndip, Kristoffer Andersson, Stefan Kosmider, Thi Huyen Le, Abhijeet Kanitkar, Marius van Dijk, Kavin Senthil Murugesan, Uwe Maas, Thomas Loher, Marco Rossi, Johannes Jaeschke, Andreas Ostmann, Rolf Aschenbrenner, Martin Schneider-Ramelow, Klaus-Dieter Lang
Opublikowane w: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, Page(s) 101-107, ISBN 978-1-7281-6180-8
Wydawca: IEEE
DOI: 10.1109/ectc32862.2020.00029

Multi-Physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept for Millimetre-Wave Communications

Autorzy: Rasilainen, Kimmo; Buisman, Koen; Andersson, Kristoffer; Fager, Christian
Opublikowane w: Issue 1, 2020
Wydawca: IEEE
DOI: 10.5281/zenodo.3945937

An Analog Module for Hybrid Massive MIMO Testbeds Demonstrating Beam Alignment Algorithms

Autorzy: Thomas Kühne, Giuseppe Caire
Opublikowane w: 2018
Wydawca: VDE Verlag GmbH
DOI: 10.5281/zenodo.1217533

Fully-Connected vs. Sub-Connected Hybrid Precoding Architectures for mmWave MU-MIMO

Autorzy: Song, Xiaoshen; Kühne, Thomas; Caire, Giuseppe
Opublikowane w: Issue 7, 2019
Wydawca: IEEE
DOI: 10.5281/zenodo.3337958

Performance Simulation of a 5G Hybrid Beamforming Millimeter-Wave System

Autorzy: Kühne, Thomas; Song, Xiaoshen; Caire, Giuseppe; Rasilainen, Kimmo; Le, Thi Huyen; Rossi, Marco; Ndip, Ivan; Fager, Christian
Opublikowane w: Issue 1, 2020
Wydawca: VDE Verlag GmbH
DOI: 10.5281/zenodo.3697751

E/W-Band CPW-based Amplifier MMICs Fabricated in a 60 nm GaN-on-Silicon Foundry Process

Autorzy: Robert Malmqvist, Rolf Jonsson, Anders Bernland, Mingquan Bao, Rémy LeBlanc, Koen Buisman, Christian Fager, Kristoffer Andersson
Opublikowane w: European Microwave Integrated Circuits Conf. 2020 (part of EuMW), 2021
Wydawca: IEEE
DOI: 10.5281/zenodo.4497009

PCB Embedding Technology for 5G mmWave Applications

Autorzy: S. Kosmider, K. Murugesan, T. Le, U. Maaß, M. Rossi and L. Boettcher
Opublikowane w: 2020
Wydawca: 16th Annual Device Packaging Conference
DOI: 10.5281/zenodo.3971608

E-/W-band multifunctional sub-system specifications

Autorzy: Andersson, Kristoffer; Mingquan,Bao; Malmquist, Robert
Opublikowane w: Issue 1, 2018
Wydawca: SERENA - gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform (779305)
DOI: 10.5281/zenodo.3240449

Signal processing algorithms and specifications

Autorzy: Kühne, Thomas; Caire, Giuseppe; Song, Xiaoshen
Opublikowane w: Issue 5, 2018
Wydawca: SERENA - gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform (779305)
DOI: 10.5281/zenodo.3240455

Integration specifications

Autorzy: Ndip, Ivan; Andersson, Kristoffer; Dielacher, Franz; Papananos, Yannis; Reyes, Jacob; Tschoban, Christian; Maaß, Uwe; Ostmann, Andreas; Kosmider, Stefan
Opublikowane w: Issue 4, 2018
Wydawca: SERENA - gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform (779305)
DOI: 10.5281/zenodo.3240451

Proof of concept platform and front end specifications

Autorzy: Andersson, Kristoffer; Kühne, Thomas
Opublikowane w: Issue 3, 2019
Wydawca: SERENA - gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform (779305)
DOI: 10.5281/zenodo.3240304

Overview about RF and PA Requirements for 5G NR and Challenges for Hardware Implementation

Autorzy: Franz Dielacher; Yannis Papananos; Peter Singerl; Marc Tiebout; Daniele Dal Maistro; Christos Thomos
Opublikowane w: Issue 2, 2019
Wydawca: SERENA - gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform (779305)
DOI: 10.5281/zenodo.3271458

Optimising GaN heterostructures for 5G

Autorzy: Behet, Markus; Derluyn, Joff; Degroote, Stefan; Germain, Marianne
Opublikowane w: Compound Semiconductor Magazine, Issue 1, 2020, ISSN 2042-7328
Wydawca: Compound Semiconductor Magazine
DOI: 10.5281/zenodo.3706893

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