High density Electrical connectors

The topic aims at defining new type of connectors addressing Modular, low cost and high density connection for avionics application. These new connectors will be designed, manufactured and tested onto a Remote Data Power Cabined studied in the frame of the Platform 3 of LPA IADP. The applicant will benefit of this topic to prepare a future standard of connectors. Please refer to the full and formal topic descriptions published in this call.