Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements

Información del proyecto

ID2PPAC

Identificador del acuerdo de subvención: 101007254

DOI 10.3030/101007254

Fecha de la firma de la CE 12 Mayo 2021

Fecha de inicio 1 Junio 2021

Fecha de finalización 31 Diciembre 2024

Financiado con arreglo a

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Coste total € 107 274 292,38

Aportación de la UE € 24 842 225,23

Coordinado por

ASML NETHERLANDS B.V.
Netherlands

Publicaciones

Conference proceedings (6)

High NA EUV: progress update and mask impact

Autores: Jan van Schoot
Publicado en: Photomask Japan, Edición 2023, 2023
Editor: SPIE
DOI: 10.1117/12.3012436

High NA EUV enabling cost efficient scaling for N+1 technology nodes

Autores: Greet Storms, Sjoerd Lok, Rob van Ballegoij, Jan van Schoot, Rudy Peeters, Diederik de Bruin, Kars Troost, Teun van Gogh
Publicado en: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States, 2022
Editor: SPIE
DOI: 10.1117/12.2617240

High NA EUV: development towards introduction at the customer

Autores: Rudy Peeters
Publicado en: SPIE Advanced Lithography + Patterning, Edición 23 April 2023, 2023
Editor: SPIE
DOI: 10.1117/12.2658381

High-NA EUVL exposure tool: program progress and mask interaction

Autores: Jan van Schoot
Publicado en: Photomask Japan 2022, 2022, Online Only, 2022
Editor: SPIE
DOI: 10.1117/12.2656140

Enabling the next step for on-product performance with High NA EUV system

Autores: Kaustuve Bhattacharyya, Diederik de Bruin, Rudy Peeters, Jara Garcia Santaclara, Herman Heijmerikx, Rob van Ballegoij, Eelco van Setten, Jan van Schoot, Sjoerd Lok, Greet Storms, Peter Vanoppen
Publicado en: EUVL Conference 2023, 2023
Editor: SPIE

High NA EUV towards introduction at the customer

Autores: Jara Garcia Santaclara
Publicado en: SPIE Photomask Technology + EUV Lithography, 2023
Editor: SPIE

Other (5)

Mask3D effects in EUV lithography and their impact on resolution enhancements

Autores: A. Erdmann
Publicado en: Keynote Talk EUVL Symposium, 2023
Editor: EUVL Symposium

The challenges of heating a sample in vacuum

Autores: Molkenboer, F.T. Kerkhof, P.J. Burema, A. Haasnoot, H. Velthuis, J.F.M. Hooftman, T. Kerkhof, P.J. Lensen, H.A
Publicado en: 2022
Editor: IVC22, 22nd International Vacuum Congress (https://ivc22.org/)

Modeling of multilayer degradation and impact on lithographic imaging metrics

Autores: H. Mesilhy, P. Evanschitzky, A. Erdmann
Publicado en: Fraunhofer IISB Lithography Simulation Workshop, 2023
Editor: Fraunhofer IISB Lithography Simulation Workshop

Imaging performance of low-n absorbers at the optical resolution limits of high NA EUV systems

Autores: A. Erdmann, H. Mesilhy, P. Evanschitzky, G. Bottiglieri, T. Brunner, E. van Setten, C. van Lare, M- van de Kerkhof
Publicado en: Photomask Japan, 2023
Editor: Photomask Japan

Pathfinding the perfect EUV mask: Mask imperfections and its impact on the imaging

Autores: H. Mesilhy, Z. Belete, P. Evanschitzky, A. Erdmann
Publicado en: EMLC Conference, 2023
Editor: EMLC Conference