Integration of processes and moDules for the 2 nm node meeting Power Performance Area and Cost requirements

Informazioni relative al progetto

ID2PPAC

ID dell’accordo di sovvenzione: 101007254

DOI

10.3030/101007254

Progetto chiuso

Data della firma CE 12 Maggio 2021

Data di avvio 1 Giugno 2021

Data di completamento 31 Dicembre 2024

Finanziato da

• INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)

Costo totale

€ 107 694 846,37

Contributo UE

€ 24 855 319,13

Coordinato da

ASML NETHERLANDS B.V.
Netherlands

CORDIS fornisce collegamenti ai risultati finali pubblici e alle pubblicazioni dei progetti ORIZZONTE.

I link ai risultati e alle pubblicazioni dei progetti del 7° PQ, così come i link ad alcuni tipi di risultati specifici come dataset e software, sono recuperati dinamicamente da .OpenAIRE .

Pubblicazioni

Conference proceedings (13)

High NA EUV: progress update and mask impact

Autori: Jan van Schoot
Pubblicato in: Photomask Japan, Numero 2023, 2023
Editore: SPIE
DOI: 10.1117/12.3012436

High NA EUV enabling cost efficient scaling for N+1 technology nodes

Autori: Greet Storms, Sjoerd Lok, Rob van Ballegoij, Jan van Schoot, Rudy Peeters, Diederik de Bruin, Kars Troost, Teun van Gogh
Pubblicato in: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States, 2022
Editore: SPIE
DOI: 10.1117/12.2617240

Status and outlook of EUV optics at ZEISS

Autori: Jörg Zimmermann, Jens Timo Neumann, Dirk Jürgens, Paul Gräupner
Pubblicato in: International Conference on Extreme Ultraviolet Lithography 2023, 2023, Pagina/e 47
Editore: SPIE
DOI: 10.1117/12.2687658

EUV optics at ZEISS: status, outlook, and future

Autori: Joachim Kalden, Jens Timo Neumann, Dirk Juergens, Paul Gräupner, Wolfgang Seitz, Peter Kuerz
Pubblicato in: Optical and EUV Nanolithography XXXVII, 2024, Pagina/e 36
Editore: SPIE
DOI: 10.1117/12.3010847

High NA EUV: development towards introduction at the customer

Autori: Rudy Peeters
Pubblicato in: SPIE Advanced Lithography + Patterning, Numero 23 April 2023, 2023
Editore: SPIE
DOI: 10.1117/12.2658381

High-NA EUVL exposure tool: program progress and mask interaction

Autori: Jan van Schoot
Pubblicato in: Photomask Japan 2022, 2022, Online Only, 2022
Editore: SPIE
DOI: 10.1117/12.2656140

Unveiling the individual impact of hydrogen radicals and vacuum EUV photons on pellicle-like materials under varying thermal conditions

Autori: Görsel Yetik, Herman Bekman, Jacqueline van Veldhoven, Shriparna Mukherjee, Karima Tabakkouht, and Henk Lensen
Pubblicato in: International Conference on Extreme Ultraviolet Lithography 2024, Numero Proc. SPIE PC13215,, 2024
Editore: SPIE

A novel way of modelling plasma induced hydrogen permeation in metals

Autori: Cederik Meekes, Dagmar A. Wismeijer, Jurjen Emmelkamp, Henk A. Lensen
Pubblicato in: SPIE Photomask Technology + EUV Lithography 2023, Numero Proceedings Volume PC12750, 2023
Editore: SPIE Photomask Technology + EUV Lithography
DOI: 10.1117/12.2686732

Advancing EUV lithography optics supporting current roadmap and beyond

Autori: Olaf Conradi et al.
Pubblicato in: SPIE International Conference on Extreme Ultraviolet Lithography 2024, 2024
Editore: SPIE
DOI: 10.1117/12.3034698

Enabling the next step for on-product performance with High NA EUV system

Autori: Kaustuve Bhattacharyya, Diederik de Bruin, Rudy Peeters, Jara Garcia Santaclara, Herman Heijmerikx, Rob van Ballegoij, Eelco van Setten, Jan van Schoot, Sjoerd Lok, Greet Storms, Peter Vanoppen
Pubblicato in: EUVL Conference 2023, 2023
Editore: SPIE

Enhanced Critical Defect Detection Using Machine Learning Based Guided Electron Beam Review Strategy

Autori: Naor Alfassi, Einat Hauzer, Nina Zeng, Dolev Raiz, Gilad Reut
Pubblicato in: SEMICON WEST 2024, Numero July 2024, 2024
Editore: SEMICON WEST 2024

Exploring interactions between hydrogen plasma and construction materials

Autori: Kleopatra Papamichou, Thomas Mechielsen, Aneta Stodólna, Erik Schuring, Henk Lensen
Pubblicato in: SPIE Photomask Technology + EUV Lithography 2023, Numero Proceedings Volume PC12750, 2023
Editore: SPIE Photomask Technology + EUV Lithography
DOI: 10.1117/12.2686862

High NA EUV towards introduction at the customer

Autori: Jara Garcia Santaclara
Pubblicato in: SPIE Photomask Technology + EUV Lithography, 2023
Editore: SPIE

Other (12)

EUV Optics at ZEISS

Autori: Heiko Feldmann
Pubblicato in: Semicon Korea, 2023
Editore: Semicon Korea

Mask3D effects in EUV lithography and their impact on resolution enhancements

Autori: A. Erdmann
Pubblicato in: Keynote Talk EUVL Symposium, 2023
Editore: EUVL Symposium

The challenges of heating a sample in vacuum

Autori: Molkenboer, F.T. Kerkhof, P.J. Burema, A. Haasnoot, H. Velthuis, J.F.M. Hooftman, T. Kerkhof, P.J. Lensen, H.A
Pubblicato in: IVC22, 2022
Editore: IVC22, 22nd International Vacuum Congress (https://ivc22.org/)

Modeling of multilayer degradation and impact on lithographic imaging metrics

Autori: H. Mesilhy, P. Evanschitzky, A. Erdmann
Pubblicato in: Fraunhofer IISB Lithography Simulation Workshop, 2023
Editore: Fraunhofer IISB Lithography Simulation Workshop

Carl ZEISS AG: General presentation and Metrologies at ZEISS

Autori: Richard Quintanilha
Pubblicato in: IMEKO TC 10 Conference, 2023
Editore: IMEKO

Imaging performance of low-n absorbers at the optical resolution limits of high NA EUV systems

Autori: A. Erdmann, H. Mesilhy, P. Evanschitzky, G. Bottiglieri, T. Brunner, E. van Setten, C. van Lare, M- van de Kerkhof
Pubblicato in: Photomask Japan, 2023
Editore: Photomask Japan

Status and outlook of EUV optics at ZEISS

Autori: Martin Kaumanns
Pubblicato in: 2024 EUVL Wokrshop and Supplier Showcase, 2024
Editore: EUV Litho Inc.

Optics for EUV-Lithography with High-NA

Autori: Hartmut Enkisch
Pubblicato in: 322. PTB Seminar 2023 VUV and EUV Metrology, 2023
Editore: PTB

High-NA EUV – breakthrough in resolution and precision

Autori: Alexey Ponomarev
Pubblicato in: 21st Workshop Beams & More IMS Stuttgart, 2024
Editore: IMS Chips Stuttbart

The Challenges of Heating a Sample

Autori: Han Velthuis
Pubblicato in: AVS 68, Numero Paper Id: 74843; Session: VT TuM : Vac Technology for Large Vac Systems, 2022
Editore: AVS 68th International Symposium & Exhibition

High NA EUV: the future that is already here

Autori: Philip Mueller et al.
Pubblicato in: 20th Workshop Beams & More Institut für Mikroelektronik Stuttgart, 2023
Editore: IMS Chips Stuttgart

Pathfinding the perfect EUV mask: Mask imperfections and its impact on the imaging

Autori: H. Mesilhy, Z. Belete, P. Evanschitzky, A. Erdmann
Pubblicato in: EMLC Conference, 2023
Editore: EMLC Conference

Peer reviewed articles (4)

Crystallinity and composition of Sc1−x(−y)Six(Py) silicides in annealed TiN/Sc/Si:P stacks for advanced contact applications

Autori: Bert Pollefliet, Clement Porret, Jean-Luc Everaert, Kiroubanand Sankaran, Xiaoyu Piao, Erik Rosseel, Thierry Conard, Andrea Impagnatiello, Yosuke Shimura, Naoto Horiguchi, Roger Loo, André Vantomme and Clement Merckling
Pubblicato in: JAPANESE JOURNAL OF APPLIED PHYSICS, Numero 63, 2024, Pagina/e 02SP97, ISSN 0021-4922
Editore: The Japan Society of Applied Physics
DOI: 10.35848/1347-4065/ad1f0d

Stitching insights towards high numerical aperture extreme ultraviolet lithography: an experimental study

Autori: Vincent Wiaux, Natalia Davydova, Lieve Van Look, Nick Pellens, Ataklti Weldeslassie, Guillaume Libeert, Tatiana Kovalevich, Joost Bekaert, Frank Timmermans, Cyrus Tabery, Laura Huddleston
Pubblicato in: Journal of Micro/Nanopatterning, Materials, and Metrology, Numero 24, 2025, ISSN 2708-8340
Editore: SPIE
DOI: 10.1117/1.jmm.24.1.011012

EUV-induced hydrogen plasma and particle release

Autori: Mark van de Kerkhof, Andrei M. Yakunin, Vladimir Kvon, Andrey Nikipelov, Dmitry Astakhov, Pavel Krainov, Vadim Banine
Pubblicato in: Radiation Effects and Defects in Solids, Numero 177, 2022, Pagina/e 486-512, ISSN 1042-0150
Editore: Taylor & Francis
DOI: 10.1080/10420150.2022.2048657

Epitaxial Si/SiGe Multi-Stacks: From Stacked Nano-Sheet to Fork-Sheet and CFET Devices

Autori: R. Loo, A. Akula, Y. Shimura, C. Porret, E. Rosseel, T. Dursap, A. Y. Hikavyy, M. Beggiato, J. Bogdanowicz, A. Merkulov, M. Ayyad, H. Han, O. Richard, A. Impagnatiello, D. Wang, K. Yamamoto, T. Sipőcz, Á. Kerekes, H. Mertens, N. Horiguchi, R. Langer
Pubblicato in: ECS Journal of Solid State Science and Technology, Numero 14, 2025, Pagina/e 015003, ISSN 2162-8769
Editore: Electrochemical Society, Inc.
DOI: 10.1149/2162-8777/ada79f

Non-peer reviewed articles (5)

The Evolvement of Lithography Optics Towards Advanced EUV Lithography: Enabling the Continuation of Moore’s Law for Six Decades

Autori: Winfried Kaiser
Pubblicato in: IEEE Electron Devices Magazine, Numero 2, 2024, Pagina/e 23-34, ISSN 2832-7691
Editore: IEEE
DOI: 10.1109/med.2023.3343627

Data Processing Unit for Energy Saving in Computer Vision: Weapon Detection Use Case

Autori: Marina Perea-Trigo, Enrique J. López-Ortiz, Jose L. Salazar-González, Juan A. Álvarez-García, J. J. Vegas Olmos
Pubblicato in: Electronics, Numero 12, 2024, Pagina/e 146, ISSN 2079-9292
Editore: Multidisciplinary Digital Publishing Institute
DOI: 10.3390/electronics12010146

P4 Telemetry collector

Autori: Faris Alhamed, Davide Scano, Piero Castoldi, Juan Jose Vegas Olmos, Ilya Vershkov, Francesco Paolucci, Filippo Cugini
Pubblicato in: Computer Networks, Numero 227, 2023, Pagina/e 109727, ISSN 1389-1286
Editore: Elsevier BV
DOI: 10.1016/j.comnet.2023.109727

Energy-Efficient Edge and Cloud Image Classification with Multi-Reservoir Echo State Network and Data Processing Units

Autori: E. J. López-Ortiz, M. Perea-Trigo, L. M. Soria-Morillo, J. A. Álvarez-García, J. J. Vegas-Olmos
Pubblicato in: Sensors, Numero 24, 2024, Pagina/e 3640, ISSN 1424-8220
Editore: Multidisciplinary Digital Publishing Institute (MDPI)
DOI: 10.3390/s24113640

Exploring deep echo state networks for image classification: a multi-reservoir approach

Autori: E. J. López-Ortiz, M. Perea-Trigo, L. M. Soria-Morillo, F. Sancho-Caparrini, J. J. Vegas-Olmos
Pubblicato in: Neural Computing and Applications, Numero 36, 2024, Pagina/e 11901-11918, ISSN 0941-0643
Editore: Springer Verlag
DOI: 10.1007/s00521-024-09656-4