Deliverables
Publications
Author(s):
D. Ielmini, N. Lepri, P. Mannocci and A. Glukhov
Published in:
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) (2022), 2022
Publisher:
IEEE
DOI:
10.1109/vlsi-tsa54299.2022.9770972
Author(s):
David Lehninger; Hannes Mähne; Tarek Ali; Raik Hoffmann; Ricardo Olivo; Maximilian Lederer; Konstantin Mertens; Thomas Kämpfe, Kati Biedermann, Matthias Landwehr, Andreas Heinig,Defu Wang, Yukai Shen, Kerstin Bernert, Steffen Thiem, Konrad Seidel
Published in:
2022 IEEE International Memory Workshop (IMW), 2022
Publisher:
IEEE
DOI:
10.1109/imw52921.2022.9779252
Author(s):
N. Lepri, A. Glukhov and D. Ielmini
Published in:
2022 IEEE International Reliability Physics Symposium (IRPS) 3C2-1-3C2-6 (2022), 2022
Publisher:
IEEE
DOI:
10.1109/irps48227.2022.9764486
Author(s):
Matteo Risso, Alessio Burrello, Luca Benini, Enrico Macii, Massimo Poncino and Daniele Jahier Pagliari
Published in:
Proceedings of the 2022 IEEE 13th International Green and Sustainable Computing Conference (IGSC), 2022
Publisher:
IEEE
DOI:
10.1109/igsc55832.2022.9969373
Author(s):
Chen Xie, Francesco Daghero, Yukai Chen∗, Marco Castellano, Luca Gandol, Andrea Calimera, Enrico Macii, Massimo Poncino, Daniele Jahier Pagliari
Published in:
2022 IEEE International Symposium on Circuits and Systems (ISCAS), 2022
Publisher:
IEEE
DOI:
10.48550/arxiv.2204.10541
Author(s):
David Lehninger, Ayse S¨unb¨ul, Ricardo Olivo, Thomas K¨ampfe, Konrad Seidel, Maximilian Lederer
Published in:
2023 IEEE International Memory Workshop (IMW), 2023
Publisher:
IEEE
DOI:
10.1109/imw56887.2023.10145927
Author(s):
A. Glukhov, N. Lepri, V. Milo, A. Baroni, C. Zambelli, P. Olivo, E. Pérez, C. Wenger and D. Ielmini
Published in:
2022 IFIP/IEEE 30th International Conference on Very Large Scale Integration (VLSI-SoC), 2022, pp. 1-5, 2022
Publisher:
IEEE
DOI:
10.1109/vlsi-soc54400.2022.9939653
Author(s):
Konrad Seidel, David Lehninger, Sukhrob Abdulazhanov, Ayse Sünbül, Raik Hoffmann, Katrin Zimmermann, Nandakishor Yadav, Quang Huy Le, Matthias Landwehr, Andreas Heinig, Hannes Mähne, Kerstin Bernert, Steffen Thiem, Thomas Kämpfe, Maximilian Lederer
Published in:
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden, Germany, 2023, pp. 1-3, 2023
Publisher:
IEEE
DOI:
10.1109/iitc/mam57687.2023.10154868
Author(s):
Konrad Seidel, David Lehninger, Franz Müller, Yannick Raffel, Ayse Sünbül, Ricardo Revello, Raik Hoffmann Sourav De, Thomas Kämpfe, Maximilian Lederer
Published in:
2023 IEEE International Memory Workshop (IMW, 2023
Publisher:
IEEE
DOI:
10.1109/imw56887.2023.10145945
Author(s):
Chen Xie, Daniele Jahier Pagliari, Andrea Calimera
Published in:
2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Publisher:
IEEE
DOI:
10.1109/prime55000.2022.9816801
Author(s):
Alessio Antolini, Andrea Lico, Eleonora Franchi Scarselli, Antonio Gnudi, Luca Perilli, Mattia Luigi Torres, Marcella Carissimi, Marco Pasotti, Roberto Antonio Canegallo
Published in:
ESSCIRC 2022: IEEE 48th European Solid-State Circuits Conference, 2022
Publisher:
IEEE
DOI:
10.1109/esscirc55480.2022.9911447
Author(s):
A. Glukhov, V. Milo, A. Baroni, N. Lepri, C. Zambelli, P. Olivo, E. Perez, C. Wenger and D. Ielmini
Published in:
2022 IEEE International Reliability Physics Symposium (IRPS) 3C3-1-3C3-7 (2022)., 2022
Publisher:
IEEE
DOI:
10.1109/irps48227.2022.9764497
Author(s):
E. Piros, M. Lonsky, S. Petzold, A. Zintler, N. Kaiser, T. Vogel, R. Eilhardt, S. U. Sharath, E. Jalaguier, E. Nolot, C. Charpin-Nicolle, C. Wenger, L. Molina-Luna, J. Müller and L. Alff
Published in:
4th International Conference on Memristive Materials, Devices & Systems (Memrisys) 2021, 2021
Publisher:
Memrisys
Author(s):
U. Erdemir, B. Kaplan, I. Hökelek, A. Görçin, H. A. Çırpan
Published in:
IEEE VTC 2023 Spring, 2023
Publisher:
IEEE
DOI:
10.48550/arxiv.2306.08474
Author(s):
S. Keşir, S. Kayraklık, I. Hökelek, A. E. Pusane, E. Başar, A. Görçin
Published in:
IEEE VTC 2023 Spring, 2023
Publisher:
IEEE
DOI:
10.48550/arxiv.2212.07254
Author(s):
Konrad Seidel; David Lehninger; Raik Hoffmann; Tarek Ali; Maximilian Lederer; Ricardo Revello; Konstantin Mertens; Kati Biedermann; Yukai Shen
Defu Wang,Matthias Landwehr, Andreas Heinig, Thomas Kämpfe, Hannes Mähne, Kerstin Bernert, Steffen Thiem,
Published in:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2022
Publisher:
IEEE
DOI:
10.1109/vlsitechnologyandcir46769.2022.9830141
Author(s):
C. Laguna, M. Bernard, J. Garrione, N. Castellani, V. Meli, S. Martin, F. Aussenac, D. Rouchon, N. Rochat, E. Nolot, G. Bourgeois, M. C. Cyrille, L. Militaru, A. Souifi, F. Andrieu and G. Navarro
Published in:
ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Publisher:
IEEE
DOI:
10.1109/essderc55479.2022.9947186
Author(s):
Alessio Antolini , Andrea Lico, Eleonora Franchi Scarselli, Marcella Carissimi, Marco Pasotti
Published in:
2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 2022
Publisher:
IEEE xplore
DOI:
10.1109/prime55000.2022.9816788
Author(s):
Eric Pardoux, Louis Devillaine
Published in:
Conférence Nationale en Intelligence Artificielle 2022 (CNIA 2022), 2022
Publisher:
Conférence Nationale en Intelligence Artificielle
Author(s):
C. De Camaret, G. Bourgeois, O. Cueto, V. Meli, S. Martin, D. Despois, V. Beugin, N. Castellani, M.C. Cyrille, F. Andrieu, J. Arcamone, Y. Le-Friec and G. Navarro
Published in:
ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC), 2022
Publisher:
IEEE
DOI:
10.1109/essderc55479.2022.9947190
Author(s):
S. Kayraklık, I. Yıldırım, Y. Gevez, E. Başar, A. Görçin
Published in:
IEEE ICC 2023, 2023
Publisher:
IEEE
DOI:
10.48550/arxiv.2211.07188
Author(s):
Paolino Carmine, Antolini Alessio, Pareschi Fabio, Mangia Mauro, Rovatti Riccardo, Franchi Scarselli Eleonora, Gnudi Antonio, Setti Gianluca, Canegallo Roberto, Carissimi Marcella, Pasotti Marco
Published in:
2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021, ISSN 2158-1525
Publisher:
IEEE
DOI:
10.1109/iscas51556.2021.9401176
Author(s):
G. Lama, M. Bernard, J. Garrione, N. Castellani, G. Bourgeois, M.C. Cyrille, F. Andrieu and G. Navarro
Published in:
2022
Publisher:
IEEE
DOI:
10.1109/essderc55479.2022.9947157
Author(s):
T. Ali; R. Olivo; S. Kerdilès; D. Lehninger; M. Lederer; D. Sourav; A-S. Royet; A. Sünbül; A. Prabhu; K. Kühnel; M. Czernohorsky, M. Rudolph; R. Hoffmann; C. Charpin-Nicolle; L. Grenouillet; T. Kämpfe; K. Seidel
Published in:
2022 IEEE International Memory Workshop (IMW), 2022, pp. 1-4,, 2022
Publisher:
IEEE Xplore
DOI:
10.1109/imw52921.2022.9779281
Author(s):
Alessio Antolini (IUNET-UNIBO) , Andrea Lico (IUNET-UNIBO), Eleonora Franchi Scarselli (IUNET-UNIBO), Antonio Gnudi (IUNET-UNIBO), Luca Perilli (IUNET-UNIBO),
Marcella Carissimi (ST-I), Marco Pasotti (ST-I) and Roberto Antonio Canegallo (ST-I)
Published in:
ESSCIRC 2022 - https://www.esscirc-essderc2022.org/, 2022
Publisher:
ESSCIRC
Author(s):
Erhan Karakoca, Hasan Nayir,Ali Görçin, Khalid Qaraqe
Published in:
2022 IEEE Globecom Workshops (GC Wkshps): Workshop on Emerging Topics in 6G Communications-page 1555-1560, 2022
Publisher:
IEEE
DOI:
10.1109/gcwkshps56602.2022.10008723
Author(s):
Muhammed Zahid Karakusak ,Hasan Kivrak,Hasan Fehmi Ates, Mehmet Kemal Ozdemir
Published in:
Big Data Cogn. Comput 2022, 6(3), 84, 2022, ISSN 2504-2289
Publisher:
MDPI
DOI:
10.3390/bdcc6030084
Author(s):
Chen Xie, Francesco Daghero, Yukai Chen, Marco Castellano, Luca Gandolfi, Andrea Calimera, Enrico Macii, Massimo Poncino, Daniele Jahier Pagliari
Published in:
IEEE Internet of Things Journal, 2023, ISSN 2327-4662
Publisher:
Institute of Electrical and Electronics Engineers Inc.
DOI:
10.1109/jiot.2023.3263290
Author(s):
Dennis V Christensen, Regina Dittmann, Bernabe Linares-Barranco, Abu Sebastian, Manuel Le Gallo, Andrea Redaelli, Stefan Slesazeck, Thomas Mikolajick, Sabina Spiga, Stephan Menzel, Ilia Valov, Gianluca Milano, Carlo Ricciardi, Shi-Jun Liang, Feng Miao, Mario Lanza, Tyler J Quill, Scott T Keene, Alberto Salleo, Julie Grollier, Danijela Marković, Alice Mizrahi, Peng Yao, J Joshua Yang, Giacomo Indi
Published in:
Neuromorph. Comput. Eng. 2 022501, 2022, ISSN 2634-4386
Publisher:
IOP Publishing Ltd
DOI:
10.1088/2634-4386/ac4a83
Author(s):
Nico Kaiser; Tobias Vogel; Alexander Zintler; Stefan Petzold; Alexey Arzumanov; Eszter Piros; Robert Eilhardt; Leopoldo Molina-Luna; Lambert Alff
Published in:
Crossref, Issue 19448244, 2021, ISSN 1944-8244
Publisher:
American Chemical Society
DOI:
10.1021/acsami.1c09451
Author(s):
Alexander Zintler, Robert Eilhardt, Stefan Petzold, Sankaramangalam Ulhas Sharath, Enrico Bruder, Nico Kaiser, Lambert Alff, and Leopoldo Molina-Luna
Published in:
ACS Omega 2022, 7, 2041−2048, Issue 24701343, 2022, ISSN 2470-1343
Publisher:
American Chemical Society
DOI:
10.1021/acsomega.1c05505
Author(s):
David Lehninger, Raik Hoffmann; Ayse Sünbül; Hannes Mähne; Thomas Kämpfe; Kerstin Bernert; Steffen Thiem; Konrad Seidel
Published in:
IEEE Electron Device Letters ( Volume: 43, Issue: 11, November 2022), 2022, ISSN 1558-0563
Publisher:
IEEE
DOI:
10.1109/led.2022.3204360
Author(s):
A. Baroni, A. Glukhov, E. Pérez, C. Wenger, E. Calore, S. F. Schifano, P. Olivo, D. Ielmini and C. Zambelli
Published in:
Front. Neurosci. 16:932270, 2022, ISSN 1662-453X
Publisher:
Frontiers Media S.A
DOI:
10.3389/fnins.2022.932270
Author(s):
C. Laguna , M. Bernard, F. Fillot, D. Rouchon, N. Rochat, J. Garrione, L. Prazakova, E. Nolot, V. Meli, N. Castellani, S. Martin, C. Sabbione, G. Bourgeois , M.C. Cyrille, L. Militaru, A. Souifi, F. Andrieu, G. Navarro
Published in:
IEEE Transactions on Electron Devices, 2022, ISSN 1557-9646
Publisher:
IEEE
DOI:
10.1109/ted.2022.3203368
Author(s):
Faizan Ali,Tarek Ali,David Lehninger,Ayse Sünbül,Alison Viegas,Ridham Sachdeva,Akmal Abbas,Malte Czernohorsky,Konrad Seidel
Published in:
Adv. Funct. Mater. 2022, 2201737, Issue 1616301X, 2022, ISSN 1616-301X
Publisher:
John Wiley & Sons Ltd.
DOI:
10.1002/adfm.202201737
Author(s):
Robert Winkler, Alexander Zintler, Stefan Petzold, Eszter Piros, Nico Kaiser, Tobias Vogel, Déspina Nasiou, Keith P. McKenna, Leopoldo Molina-Luna, Lambert Alff
Published in:
Advanced Science 2022, 2198-3844, 2201806, 2022, ISSN 2198-3844
Publisher:
Wiley online library
DOI:
10.1002/advs.202201806
Author(s):
Giusy Lama, M. Bernard, G. Bourgeois , J. Garrione, V. Meli, N. Castellani, C. Sabbione , L. Prazakova , D. Fernandez Rodas, E. Nolot, M.C. Cyrille, F. Andrieu, G. Navarro
Published in:
IEEE Transactions on Electron Devices, 2022, ISSN 1557-9646
Publisher:
IEEE
DOI:
10.1109/ted.2022.3184659
Author(s):
Fernando Leonel Aguirre, Eszter Piros, Nico Kaiser, Tobias Vogel, Stephan Petzold, Jonas Gehrunger, Timo Oster, Christian Hochberger, Jordi Suñé, Lambert Alff and Enrique Miranda
Published in:
Micromechanics, 2022, ISSN 2072-666X
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/mi13112002
Author(s):
Ayse Sünbül, David Lehninger, Raik Hoffmann, Ricardo Olivo, Aditya Prabhu, Fred Schöne, Kati Kühnel, Moritz Döllgast, Nora Haufe, Lisa Roy, Thomas Kämpfe, Konrad Seidel, Lukas M. Eng
Published in:
Adv. Eng. Mater.2022, 2201124, Issue 15272648, 2022, ISSN 1527-2648
Publisher:
Wiley Online Libray
DOI:
10.1002/adem.202201124
Author(s):
Lederer, M., Lehninger, D., Ali, T. and Kämpfe, T.
Published in:
Phys. Status Solidi RRL, 16: 2200168., 2022, ISSN 1862-6270
Publisher:
Wiley online library
DOI:
10.1002/pssr.202200168
Author(s):
F Aguirre, E Piros, N Kaiser, T Vogel, S Petzold, J Gehrunger, T Oster, K Hofmann, C Hochberger, J Suñé, L Alff, E Miranda
Published in:
APL Machine Learning, 2023, ISSN 2770-9019
Publisher:
AIP Publishing
DOI:
10.1063/5.0143926
Author(s):
Taewook Kim, Tobias Vogel, Eszter Piros, Déspina Nasiou, Nico Kaiser, Philipp Schreyer, Robert Winkler, Alexander Zintler, Alexey Arzumanov, Stefan Petzold, Leopoldo Molina-Luna, Lambert Alff
Published in:
Appl. Phys. Lett. 122, 023502 (2023), 2023, ISSN 0003-6951
Publisher:
American Institute of Physics
DOI:
10.1063/5.0124781
Author(s):
A. Baroni, A. Glukhov, E. Perez, C. Wenger, D. Ielmini, P. Olivo and C. Zambelli
Published in:
IEEE Transactions on Device and Materials Reliability, vol. 22, no. 3, pp. 340-347, Sept. 2022, 2022, ISSN 1530-4388
Publisher:
Institute of Electrical and Electronics Engineers
DOI:
10.1109/tdmr.2022.3182133
Author(s):
David Lehninger, Aditya Prabhu, Ayse Sünbül, Tarek Ali, Fred Schöne, Thomas Kämpfe, Kati Biedermann, Lisa Roy, Konrad Seidel, Maximilian Lederer, Lukas M. Eng
Published in:
Adv. Physics Res.2023, 2023, ISSN 2751-1200
Publisher:
Wiley Online Library
DOI:
10.1002/apxr.202200108
Author(s):
M. Lederer, T. Vogel, T. Kämpfe, N. Kaiser, E. Piros, R. Olivo, T. Ali, S. Petzold, D. Lehninger, C. Trautmann, L. Alff, K. Seidel
Published in:
Journal of Applied Physics 132, 064102 (2022), Issue 10897550, 2022, ISSN 1089-7550
Publisher:
AIP Publishing
DOI:
10.1063/5.0098953
Author(s):
E.V. Skopin, N. Guillaume, L. Alrifai, P. Gonon, and A. Bsiesy
Published in:
Appl. Phys. Lett. 120, 172901 (2022), Issue 00036951, 2022, ISSN 0003-6951
Publisher:
American Institute of Physics
DOI:
10.1063/5.0088505
Author(s):
Nico Kaiser, Eszter Piros, Philipp Schreyer, Taewook Kim, Stefan Petzold, Roser Valenti, Youngjoon Song, Tobias Vogel, Lambert Alff
Published in:
ACS Applied Electronic Materials, 2023, ISSN 2637-6113
Publisher:
ACS Publications
DOI:
10.1021/acsaelm.2c01255
Author(s):
Carmine Paolino, Alessio Antolini, Francesco Zavalloni, Andrea Lico, Eleonora Franchi Scarselli,
Mauro Mangia, Alex Marchioni, Fabio Pareschi, Gianluca Setti, Riccardo Rovatti, Mattia Luigi Torres,
Marcella Carissimi and Marco Pasotti
Published in:
J. Low Power Electron. Appl. 2023, 13(1), 17;, 2023, ISSN 2079-9268
Publisher:
Multidisciplinary Digital Publishing Institute (MDPI)
DOI:
10.3390/jlpea13010017
Author(s):
Alessio Antolini, Carmine Paolino, Francesco Zavalloni, Andrea Lico, Eleonora Franchi Scarselli,
Mauro Mangia, Fabio Pareschi, Gianluca Setti, Riccardo Rovatti, Mattia Luigi Torres, Marcella Carissimi, Marco Pasotti
Published in:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems, vol. 13, no. 1, pp. 395-407, March 2023,, 2023, ISSN 2156-3357
Publisher:
IEEE Circuits and Systems Society
DOI:
10.1109/jetcas.2023.3241750
Author(s):
Tobias Vogel, Alexander Zintler, Nico Kaiser, Nicolas Guillaume, Gauthier Lefèvre, Maximilian Lederer, Anna Lisa Serra, Eszter Piros, Taewook Kim, Philipp Schreyer, Robert Winkler, Déspina Nasiou, Ricardo Revello Olivo, Tarek Ali, David Lehninger, Alexey Arzumanov, Christelle Charpin-Nicolle, Guillaume Bourgeois, Laurent Grenouillet, Marie-Claire Cyrille, Gabriele Navarro, Konrad Seidel, Thomas
Published in:
ACS Nano 2022, 16, 9, 14463–14478, Issue 1936086X, 2022, ISSN 1936-086X
Publisher:
ACS publications
DOI:
10.1021/acsnano.2c04841
Author(s):
Sung-Ho Lee, Valerio Olevano, Benoit Sklénard
Published in:
Solid-State Electronics Volume 199, January 2023, 108508, 2023, ISSN 0038-1101
Publisher:
Pergamon Press Ltd.
DOI:
10.1016/j.sse.2022.108508
Author(s):
Zdeněk Pohl, Lukáš Kohout, Jiří Kadlec
Published in:
2022
Publisher:
UTIA
Author(s):
Raissa Likhonina
Published in:
2022
Publisher:
UTIA
Author(s):
T. Vogel, A. Zintler, N. Kaiser, N. Guillaume, G. Lefèvre, M. Lederer, A. L. Serra, E. Piros, T. Kim, P. Schreyer, R. Winkler, D. Nasiou, R. R. Olivo, T. Ali, D. Lehninger, A. Arzumanov, C. Charpin-Nicolle, G. Bourgeois, L. Grenouillet, MC. Cyrille, G. Navarro, K. Seidel, T. Kämpfe, S. Petzold, C. Trautmann, L. Molina-Luna, L. Alff
Published in:
Open Repository TuDatalib 2022, 2022
Publisher:
TU Darmstadt
DOI:
10.48328/tudatalib-896
Author(s):
Zdeněk Pohl, Lukáš Kohout, Jiří Kadlec
Published in:
2022
Publisher:
UTIA
Author(s):
Zdeněk Pohl, Lukáš Kohout, Jiří Kadlec
Published in:
2022
Publisher:
UTIA
Author(s):
Zdeněk Pohl, Lukáš Kohout, Jiří Kadlec
Published in:
2022
Publisher:
UTIA
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