Future Oriented Renewable and Reliable Energy SIC Solutions

Información del proyecto

FOR2ENSICS

Identificador del acuerdo de subvención: 101075672

DOI

10.3030/101075672

Fecha de la firma de la CE 22 Agosto 2022

Fecha de inicio 1 Enero 2023

Fecha de finalización 31 Diciembre 2026

Financiado con arreglo a

• Climate, Energy and Mobility

Coste total

€ 5 533 910,00

Aportación de la UE

€ 4 393 517,50

Coordinado por

AGENCIA ESTATAL CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS
Spain

CORDIS proporciona enlaces a los documentos públicos y las publicaciones de los proyectos de los programas marco HORIZONTE.

Los enlaces a los documentos y las publicaciones de los proyectos del Séptimo Programa Marco, así como los enlaces a algunos tipos de resultados específicos, como conjuntos de datos y «software», se obtienen dinámicamente de OpenAIRE .

Resultado final

Demonstrators, pilots, prototypes (4)

MFT prototypes

Delivery of more than 3 demontrator units of the Medium Frequency Transformer (MTF) after design, fabrication, testing, and validations phases.

15kV IGBT dies available for packaging

Delivery of the 15kV IGBTs and associated diodes good dies for packaging in WP3

3.3kV MOSFET SiC modules delivery

Supply of the 3.3kV SiC MOSFETs packaged in LinPak modules for the High Voltage series connection concept studied in WP5 and WP6.

15kV rated epilayers with high lifetime and low BPD density

High quality epitaxial wafers with 15kV capability, high carrier lifetime and low BPD density to by supplied to the other tasks and Workpackages for IGBT and diodes devices fabrication.

Websites, patent fillings, videos etc. (1)

Webpage and visual identity

Project’s website. It will be a main channel for the project’s communication to stakeholders, media, and public at large. It will be periodically updated with the progress and free-to-publish results of the project.

Documents, reports (2)

Annual Project Reports

Annual reports of the scientific and technical activities carried out in the project. M12, M24, M36, M48

Communication and dissemination plan

The project communication and dissemination plan will be presented at month 4. It will act as an overall framework for target-oriented communication actions and corporate identity for the project (logo, templates, infographics, brochures and 3 minutes videos showing the project targets).

Data Management Plan (1)

Data management plan (DMP)

Definition of procedures to exchange information among the partners. Updates will be informed during project reports.

Publicaciones

Conference proceedings (7)

Influence of the Mission Profile on the Selection of the Leakage Inductance for DAB converter

Autores: A. Campos, P. Dworakowski, B. Asllani, K. Vershinin
Publicado en: EPE 2025
Editor: EPE 2025

Solid insulation electrical endurance assessment under square voltage,

Autores: M. Balde
Publicado en: CEIDP September 14-17, 2025 (IEEE Conference on Electrical I5nsulation and Dielectric Phenomena), Manchester, 202
Editor: IEEE Conference 2025

A Dual-Channel Gate Driver Design with Active Voltage Balancing Circuit for Series Connection of SiC MOSFETs

Autores: Rui Wang, Drazen Dujic
Publicado en: ECCE Aisa 2024, 2024, ISBN 979-8-3503-5133-0
Editor: IEEE

Development of 15kV SiC-IGBT technology at Hitachi Energy

Autores: N
Publicado en: ECPE Workshop
Editor: ECPE Workshop

Minimizing edge termination footprint in UHV SiC power devices: an area-efficient edge structure for power devices rated over 10kV

Autores: n
Publicado en: ISCRM25
Editor: ISCRM25

Integrated Short-Circuit Protection Design Based on Dual-Channel Gate Driver for Series Connected Medium-Voltage SiC MOSFETs

Autores: Rui Wang, Drazen Dujic
Publicado en: APEC 2024
Editor: APEC 2024

Pushing the limits: Advanced SiC detectors for operation in harsh environments

Autores: G. Pellegrini
Publicado en: CERN invited talk
Editor: CERN

Peer reviewed articles (2)

Active Voltage Balancing with Seamless Integration into Dual Gate Driver for Series Connection of SiC MOSFETs

Autores: Rui Wang, Drazen Dujic
Publicado en: IEEE transactions on power electronics, 2024, ISSN 1941-0107
Editor: IEEE
DOI: 10.1109/TPEL.2024.3380245

Advanced Dual-Channel Gate Driver with Short-circuit Protection for Series Connected Medium-Voltage SiC MOSFETs

Autores: Rui Wang, Drazen Dujic
Publicado en: Transactions on Power Electronics, 2025, ISSN 0000-0000
Editor: Transactions on Power Electronics
DOI: 10.1109/TPEL.2025.3578969

Other (2)

Ultra High Voltage Power Electronics | ECPE Hybrid Workshop

Autores: B. Asllani
Publicado en: Bridge news item: event advertisement
Editor: ETIPSNET BRIDGE

Ultra High Voltage Power Electronics | ECPE Hybrid Workshop

Autores: B. Asllani
Publicado en: Bridge Newsletter
Editor: BRIDGE