Future Oriented Renewable and Reliable Energy SIC Solutions

Informations projet

FOR2ENSICS

N° de convention de subvention: 101075672

DOI

10.3030/101075672

Date de signature de la CE 22 Août 2022

Date de début 1 Janvier 2023

Date de fin 31 Decembre 2026

Financé au titre de

• Climate, Energy and Mobility

Coût total

€ 5 533 910,00

Contribution de l’UE

€ 4 393 517,50

Coordonné par

AGENCIA ESTATAL CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS
Spain

CORDIS fournit des liens vers les livrables publics et les publications des projets HORIZON.

Les liens vers les livrables et les publications des projets du 7e PC, ainsi que les liens vers certains types de résultats spécifiques tels que les jeux de données et les logiciels, sont récupérés dynamiquement sur OpenAIRE .

Livrables

Demonstrators, pilots, prototypes (4)

MFT prototypes

Delivery of more than 3 demontrator units of the Medium Frequency Transformer (MTF) after design, fabrication, testing, and validations phases.

15kV IGBT dies available for packaging

Delivery of the 15kV IGBTs and associated diodes good dies for packaging in WP3

3.3kV MOSFET SiC modules delivery

Supply of the 3.3kV SiC MOSFETs packaged in LinPak modules for the High Voltage series connection concept studied in WP5 and WP6.

15kV rated epilayers with high lifetime and low BPD density

High quality epitaxial wafers with 15kV capability, high carrier lifetime and low BPD density to by supplied to the other tasks and Workpackages for IGBT and diodes devices fabrication.

Websites, patent fillings, videos etc. (1)

Webpage and visual identity

Project’s website. It will be a main channel for the project’s communication to stakeholders, media, and public at large. It will be periodically updated with the progress and free-to-publish results of the project.

Documents, reports (2)

Annual Project Reports

Annual reports of the scientific and technical activities carried out in the project. M12, M24, M36, M48

Communication and dissemination plan

The project communication and dissemination plan will be presented at month 4. It will act as an overall framework for target-oriented communication actions and corporate identity for the project (logo, templates, infographics, brochures and 3 minutes videos showing the project targets).

Data Management Plan (1)

Data management plan (DMP)

Definition of procedures to exchange information among the partners. Updates will be informed during project reports.

Publications

Conference proceedings (7)

Influence of the Mission Profile on the Selection of the Leakage Inductance for DAB converter

Auteurs: A. Campos, P. Dworakowski, B. Asllani, K. Vershinin
Publié dans: EPE 2025
Éditeur: EPE 2025

Solid insulation electrical endurance assessment under square voltage,

Auteurs: M. Balde
Publié dans: CEIDP September 14-17, 2025 (IEEE Conference on Electrical I5nsulation and Dielectric Phenomena), Manchester, 202
Éditeur: IEEE Conference 2025

A Dual-Channel Gate Driver Design with Active Voltage Balancing Circuit for Series Connection of SiC MOSFETs

Auteurs: Rui Wang, Drazen Dujic
Publié dans: ECCE Aisa 2024, 2024, ISBN 979-8-3503-5133-0
Éditeur: IEEE

Development of 15kV SiC-IGBT technology at Hitachi Energy

Auteurs: N
Publié dans: ECPE Workshop
Éditeur: ECPE Workshop

Minimizing edge termination footprint in UHV SiC power devices: an area-efficient edge structure for power devices rated over 10kV

Auteurs: n
Publié dans: ISCRM25
Éditeur: ISCRM25

Integrated Short-Circuit Protection Design Based on Dual-Channel Gate Driver for Series Connected Medium-Voltage SiC MOSFETs

Auteurs: Rui Wang, Drazen Dujic
Publié dans: APEC 2024
Éditeur: APEC 2024

Pushing the limits: Advanced SiC detectors for operation in harsh environments

Auteurs: G. Pellegrini
Publié dans: CERN invited talk
Éditeur: CERN

Peer reviewed articles (2)

Active Voltage Balancing with Seamless Integration into Dual Gate Driver for Series Connection of SiC MOSFETs

Auteurs: Rui Wang, Drazen Dujic
Publié dans: IEEE transactions on power electronics, 2024, ISSN 1941-0107
Éditeur: IEEE
DOI: 10.1109/TPEL.2024.3380245

Advanced Dual-Channel Gate Driver with Short-circuit Protection for Series Connected Medium-Voltage SiC MOSFETs

Auteurs: Rui Wang, Drazen Dujic
Publié dans: Transactions on Power Electronics, 2025, ISSN 0000-0000
Éditeur: Transactions on Power Electronics
DOI: 10.1109/TPEL.2025.3578969

Other (2)

Ultra High Voltage Power Electronics | ECPE Hybrid Workshop

Auteurs: B. Asllani
Publié dans: Bridge news item: event advertisement
Éditeur: ETIPSNET BRIDGE

Ultra High Voltage Power Electronics | ECPE Hybrid Workshop

Auteurs: B. Asllani
Publié dans: Bridge Newsletter
Éditeur: BRIDGE