COCHISA fosters the European non-dependence in terms of critical RF components for space applications …
… by the development of radiation-hard, scalable multi-channel X-band and Ka-band core-chips …
… based on a fully European supply chain, …
… including a cost-effective MMIC packaging solution and the …
… prototype qualification by radiation and reliability testing.
With the developed European beamforming core-chips, the European space industry has access to space-grade components free from ITAR or similar restrictions.
Highly integrated phased-array antennas are fundamental enablers for space-borne SAR (Synthetic Aperture Radar) satellites for earth observation and for constellations of LEO (Low Earth Orbit) satellites for telecommunications. Core-chips are a key component for active phased-array antennas. They allow the integration of all RF functions needed for antenna beamforming like TX/RX switching, phase shifting, amplitude setting and signal amplification in a single chip. Digital components like serial peripheral interface (SPI) blocks can be additionally integrated, to ease the control of the different analog parts. Thus, core-chips allow to greatly increase the antenna array integration, resulting in a reduction of antenna array size, mass, power consumption and cost. Those are crucial factors for the use of active arrays in general and especially for the use in space applications.
As of today, several companies outside Europe are providing integrated multi-channel core-chips with the use of technologies and manufacturing all outside the European Union. This leads to a strong dependence of the European space industry on non-European providers. Therefore, the EC-ESA-EDA Joint Task Force (JTF) has put RF components needed for electronically steerable antennas into their list of actions for Critical Space Technologies for European Non Dependence in the time-frame of 2021-2023.
COCHISA aims to foster the European non-dependence in terms of critical RF components for space applications. For this, scalable multi-channel radiation-hard beamforming core-chips operating in X-band (10 GHz) as well as Ka-band (28 GHz) will be developed. The scalable approach will allow to increase the number of beamforming channels as well as to scale the system to higher operational frequencies. COCHISA does not only focus on the IC itself, but also a cost-effective plastic non-hermetic MMIC packaging process supporting space applications by robust encapsulation.
Furthermore, a fully European supply chain for the core-chips will be established, based on the European foundry and packaging partners. This includes the availability of a proven radiation-hard SiGe BiCMOS technology with qualified radiation-hard libraries. Due to the establishment of the European supply chain, the mid-term impact will be the wider use of the European radiation-hard technology, increasing the number of ITAR-free European space-grade components.
A main objective of COCHISA is to reach at least TRL 7 for the developed and packaged X-band core-chip, proven by the scheduled radiation and reliability tests. During the COCHISA project, a dedicated work package will prepare the commercial exploitation and market introduction of the project results, especially to make the developed core-chips available to the European and global space industry.
The main objectives of COCHISA can be summarized as follows:
1. The first and main objective of COCHISA is the development of a European multi-channel beamforming core-chip focused on - but not limited to - space applications.
2. The second objective is the core-chip development based on a scalable approach with respect to the number of integrated phase-shifting channels as well as the used frequency band.
3. The third objective is the development of a cost-effective non-hermetic plastic MMIC package, providing a robust encapsulation solution to survive being launched into space.
4. The fourth objective is to reach technology readiness level (TRL) 7 for the X-band core-chip at the end of the project.
5. The fifth objective is to find means to reach radiation-hardness in digital designs without a continuously operating clock, i. e. to enable clocking-free self-correcting features of TMR-flip-flops.
6. The sixth objective is the establishment and enduring assurance of a fully European supply chain for the developed core-chips as well as the preparation of a successful exploitation and market introduction.
By creating and maintaining a fully European supply chain for the development and series production of the core-chips, COCHISA directly contributes to the Horizon Europe expected impact:
“To open strategic autonomy in developing, deploying and using global space-based infrastructures, services, applications and data, including by reinforcing the EU’s independent capacity to access space, securing the autonomy of supply for critical technologies and equipment, and fostering the EU's space sector competitiveness.”
In the long-term, the established European supply chain will not only deliver ITAR/EAR/ECL-free core-chips to the European and global space industry. Instead, the proven viability of the European supply chain will lead to an increased use of the established European technologies to develop space products, e.g. other critical space-grade RF components, based on IHP’s prospectively EPPL listed SG13RH technology.
As indicated in the EC-ESA-EDA Joint Task Force List of Actions 2021-2023, RF components and their monolithic integration are needed as they are currently only available with export license restrictions. Therefore, JTF emphasizes that “a qualified and European controlled source is vital for space end users”. Furthermore, “new components are needed so that the future high-throughput Terabyte satellites become a reality: this includes components at Ka-band and higher in particular for multi-constellation low-cost aspects.” Additionally, non-hermetic plastic packages are emphasized by the JFT due to their cost effectiveness. These JTF requirements are directly addressed by COCHISA’s objectives, results and outcomes.
