Final Report Summary - CHISMACOMB (CHIral SMArt honeyCOMB)
This goal will be accomplished through the:
1. development of analytical and numerical models to evaluate different chiral cellular configurations in terms of their mechanical and dielectric properties.
2. design and manufacture a curved sandwich panel with optimised chiral cellular core configuration. Compared to current technology sandwich panels containing honeycomb core, the manufacturability of the dome-shape structure will be enhanced, with reduced in-plane buckling and residual stresses.
3. design and manufacture a sandwich panel with optimised chiral core with embedded PZT custom-designed sensors in the cellular microstructure for structural health monitoring applications to increase passenger safety in ship constructions.
4. design and manufacture a sandwich panel with optimised chiral core having custom-designed load impedance embedded in the cellular microstructure for multifrequency microwave absorption capabilities to decrease electromagnetic pollution and improve security and comfort of the European populations.
The CHISMACOMB project took advantage of initial studies developed on chiral structural materials, and extensive body of knowledge accumulated during the last decade of development of structural health monitoring, microwave absorption, microsystems design and their applications. The project gave a final drive to produce groundbreaking technological alternative to currently available core materials for sandwich applications, with embedded smart sensing/actuating capabilities in their microstructure, and provide a competitive edge to European industry in the field of design of smart and structures. The most promising microstructure layouts were tested on large-scale specimens, including sandwich panels with sensors and electromagnetic actuator capabilities.
The output of CHISMACOMB have not only confirmed the multifunctional characteristics of the chiral structural cores, but also produced new concepts and demonstrators for the smart materials communities, and new paradigms for electromagnetic compatibility applications.