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Zawartość zarchiwizowana w dniu 2024-05-28

Advanced Surface Protection for Improved Reliability PCB Systems

Cel

To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and ionic liquid based electrolytes. To introdude these to the European PCB industry and to support the introductiuon of new standards around their use.

Zaproszenie do składania wniosków

FP7-SME-2008-2
Zobacz inne projekty w ramach tego zaproszenia

Koordynator

THE INSTITUTE OF CIRCUIT TECHNOLOGY LIMITED LBG
Wkład UE
€ 447 167,00
Adres
Forestfield 25
TD5 7BX KELSO
Zjednoczone Królestwo

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Rodzaj działalności
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Kontakt administracyjny
Martin Trevor Goosey (Dr.)
Linki
Koszt całkowity
Brak danych

Uczestnicy (10)