Cel
The overall objective of the project is to develop radically innovative low cost technologies for the mass production of nano-structured high temperature superconducting materials based on chemical solution processing. Novel nano-structuring methodologies will be developed for the growth of epitaxial nanocomposite films and coated conductors with excellent performance. The originality of the project lies in the fact that two rapid growth rate chemical processing techniques (metal-organic decomposition and h ybrid liquid phase epitaxy) are combined to grow epitaxial REBa2Cu307 high-temperature superconductor films with bottom-up nano-structuring strategies. The purpose is to achieve an artificial network of nano-defects that will immobilize the superconducting vortices and, hence, allow the achievement of high critical currents and a weak magnetic field dependence in films and coated conductors with high thickness. The first general strategy for nano-structuring the superconducting layers is based on the genera tion of coherent randomly distributed nano-structures, such as nano-dots. The second strategy is to engineer nanostructures originating at the substrate interface, either based on strain-induced self-assembling principles or on polymer track-etched cylindr ical nanopores generated by ion bombardment. The final technological goal is to develop nanostructured coated conductors with a total critical current of 400 A in a 1 cm wide tape and to achieve a reduction in its thickness and magnetic field dependence by a factor of 3 compared to the present state of the art. This achievement will represent a real scientific breakthrough that will quickly push coated conductors towards applications in fields such as electrical power technology. The consortium consists of 6 partners from 5 member states - 3 universities (Cambridge, UK; Louvain-la-Neuve, B and TU Wien, A), 2 institutes (CSIC-ICMAB, E and IFW, D) and industrial company Nexans #
Dziedzina nauki
Słowa kluczowe
Temat(-y)
Zaproszenie do składania wniosków
FP6-2003-NMP-TI-3-MAIN
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